Hewei Electronic Technology HW58S3-XYLS Multi-Protocol Card Reader Module Owner’s Manual

HW58S3-XYLS Multi-Protocol Card Reader Module

Product Specifications

  • Name: Multi-protocol Card Reader Module
  • Model: SPI HW58S3-XYLS
  • Code: 5824080801

Product Overview

This module is a 13.56MHz card reading and writing module
developed based on MH1612 card reading chip. It supports various
protocols including ISO/IEC 14443 Type A/Type B, ISO/IEC 18092, and
ISO/IEC 15693. Additionally, it supports mobile payment
applications like Apple Pay and Samsung Pay, as well as EMV3.0/3.1
certification.

Product Parameters

  • Name: Multi-protocol Card Reader ModuleSPI
    HW58S3-XYLS
  • Size: 40*40*4mm
  • Environment: Temperature: -40-85°C, Humidity:
    5%~95% (no condensation and ice)
  • Contactless Card: Supports 14443 Type A/Type B
    contactless smart card, Feilica card, and ISO15693 card
  • Card Reading Distance: 5cm
  • Communication Mode: SPI, up to 10Mbit/s
  • Power Dissipation: Typical working current
    120-200mA (DC3.3V)
  • Software: Refer to the latest MH1612 data
    sheet for detailed module operation timing and instructions

Product Usage Instructions

  1. Installation: Install the product away from
    metal environments (4cm) to prevent interference with card reading
    signal.
  2. Maintenance: If interference occurs, try
    attaching ferrite absorbing paper to the back of the card
    reader.
  3. Troubleshooting: If the card still cannot be
    read, contact technical support for assistance.

Frequently Asked Questions (FAQ)

Q: What should I do if the card reader interferes with metal
environments?

A: Install the product at least 4cm away from metal
environments. If interference persists, use ferrite absorbing
paper.

Q: How can I troubleshoot if the card cannot be read?

A: Contact technical support for further assistance in
troubleshooting the issue.

“`

Version NO. V1.0

Product Specification

Name: Model: Code:

Multi-protocol Card Reader ModuleSPI HW58S3-XYLS 5824080801

Preparation: Xu Xiaobing Date: 24/08/08

Checked: Wang Hanping Date: 24/08/08
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Approved: Jiang Xulian Date: 24/08/08

Change log:
Date 2024/08/08

Version V1.0

Preparation

Checked

Xu Xiaobing Wang Hanping

Change content First written

Remarks

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1. Product Image:

Interface definition (12-pin stamp hole, SPI)

Pin1 Pin2 NSS SCLK

Pin3 MOSI

Pin4 MISO

Pin5 Pin6 Pin7 Pin8 IRQ GND RST VCC

Pin9, 10,11,12 NC

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Product Size (mm)
2. Product Overview
This module is a 13.56MHz card reading and writing module developed based on MH1612 card reading chip;
Wide voltage operating range, voltage 2.0-5.5V; Support ISO/IEC 14443 Type A/Type B protocol; Supports ISO/IEC 18092 protocol; Supports ISO/IEC 15693 protocol;
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Support mobile payment applications such as Apple Pay and Samsung Pay;
Support EMV3.0/3.1 certification, including electrical, protocol, and mobile compatibility certification tests;
SPI, rate up to 10Mbit/s; Support low power card detection function (LPCD); The main MCU consumes less resources and can support multiple cores; Integrated PCB antenna, can simply achieve stable and reliable
non-contact card operation;

3. Product Parameters

Name Model Size
Environment
Contactless Card
Card reading distance communication Mode
Power Dissipation
Software

Multi-protocol Card Reader ModuleSPI HW58S3-XYLS
Length * width * height 40*40*4mm Temperature: -40-85
Humidity: 5%~95% no condensation and ice Supports 14443 Type A/Type B contactless smart card
Supports Feilica card and ISO15693 card 5cm
SPI, up to 10Mbit/s Supports 2.0-5.5V input (DC3.3V) Typical working current 120-200mA (DC3.3V) Refer to the latest MH1612 data sheet for detailed module operation timing
and instructions

Attention

The product needs to be installed away from metal environments (4cm), otherwise it may interfere with the card reading signal and shorten the
reading distance. If this occurs, try attaching ferrite absorbing paper to the back of the card reader. If the card still cannot be read, please contact technical support.

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4.Conformal coating follows the following standards
4.1.Spray coating thickness: 0.1-0.3 mm, with a cured thickness of 40-60 µm. 4.2.Conformal coating bubble standards: Bubbles are allowed on the plastic body or insulating parts
of components, and small bubbles within the coating are acceptable. Only a single bubble enclosing a single part of a conductor is acceptable; bubbles between the component leads are not acceptable. 4.3.Exposed copper with tin plating, connectors, and power components should not be coated with conformal coating. 4.4.Components within 3 mm around the connectors do not require conformal coating, but a clear isolation strip of conformal coating must be present around the connectors. 4.5.No conformal coating is allowed within a 5 mm diameter of positioning holes, and holes should not be filled. 4.6.All IC component leads must be coated with conformal coating, and there should be visible traces of conformal coating on the body.
5.Salt Spray Testing is conducted in accordance with the following standards
GB/T 2423. 17-2008 Environmental Testing for Electrical and Electronic Products, Part 2: Test Methods, Test Ka: Salt Spray
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FCC Statement This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: 1) this device may not cause harmful interference, and 2) this device must accept any interference received, including interference that may cause undesired operation. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: –Reorient or relocate the receiving antenna. –Increase the separation between the equipment and receiver. –Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. –Consult the dealer or an experienced radio/TV technician for help. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. FCC Radiation Exposure Statement This device complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device must operate with a minimum distance of 20 cm between the radiator and user body.

Documents / Resources

Hewei Electronic Technology HW58S3-XYLS Multi-Protocol Card Reader Module [pdf] Owner's Manual
HW58S3-XYLS, HW58S3-XYLS Multi-Protocol Card Reader Module, Multi-Protocol Card Reader Module, Card Reader Module, Reader Module, Module

References

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