User Manual for NXP models including: UM12023 Battery Cell Controller IC, UM12023, Battery Cell Controller IC, Cell Controller IC, Controller IC
UM12023, RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC, user manual
7 Feb 2024 — This user manual describes the RD33774PDSTEVB. The RD33774PDSTEVB features one MC33774ATP battery-cell controller integrated circuit (IC).
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DocumentDocumentUM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Rev. 1 -- 7 February 2024 User manual Document information Information Content Keywords RD33774PDSTEVB, MC33774ATP, battery-cell controller, battery emulator, battery management systems Abstract This user manual describes how to use the RD33774PDSTEVB evaluation board. NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 1 Introduction This user manual describes the RD33774PDSTEVB. The RD33774PDSTEVB features one MC33774ATP battery-cell controller integrated circuit (IC). The NXP analog product development board provides a platform for evaluating NXP products. These development boards support a range of analog, mixed-signal, and power solutions. These boards incorporate monolithic ICs and system-in-package devices that use high-volume technology. NXP products offer long battery life, a small form factor, reduced component counts, lower cost, and improved performance in powering state-of-the-art systems. UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 2 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Important notice IMPORTANT NOTICE For engineering development or evaluation purposes only NXP provides the product under the following conditions: This evaluation kit is for use of ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed-circuit board to make it easier to access inputs, outputs and supply terminals. This evaluation board may be used with any development system or other source of I/O signals by connecting it to the host MCU computer board via off-theshelf cables. This evaluation board is not a Reference Design and is not intended to represent a final design recommendation for any particular application. Final device in an application heavily depends on proper printed-circuit board layout and heat sinking design as well as attention to supply filtering, transient suppression, and I/O signal quality. The product provided may not be complete in terms of required design, marketing, and or manufacturing related protective considerations, including product safety measures typically found in the end device incorporating the product. Due to the open construction of the product, it is the responsibility of the user to take all appropriate precautions for electric discharge. In order to minimize risks associated with the customers' applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. For any safety concerns, contact NXP sales and technical support services. UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 3 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 2 Getting ready 2.1 Finding kit resources and information on the NXP website NXP Semiconductors provides online resources for this evaluation board and its supported device(s) on http:// www.nxp.com. The information page for the RD33774PDSTEVB evaluation board is at http://www.nxp.com/ RD33774PDSTEVB. The information page provides overview information, documentation, software and tools, parametrics, ordering information and a Getting Started tab. The Getting Started tab provides quick-reference information applicable to using the RD33774PDSTEVB evaluation board, including the downloadable assets referenced in this document. 2.2 Kit contents · Assembled and tested evaluation board/module in antistatic bag · One 32-pin battery cell cable · One two-pin TPL cable 2.3 Required equipment To use this kit, the following equipment is required: · A 4-cell to 18-cell battery pack or a battery pack emulator, such as BATT-18EMULATOR · FRDMDUALK3664EVB (EVB for MC33664A) with the S32K3X4EVB-T172 (S32K3X4 EVB) to interface with a PC; for the evaluation setup, a graphical user interface, EvalGUI 7, is available in Secure Files on http:// www.nxp.com UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 4 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 3 Getting to know the hardware 3.1 Kit overview The RD33774PDSTEVB serves as a hardware evaluation tool in support of NXP's MC33774ATP device. The MC33774ATP is a battery-cell controller that monitors up to 18 lithium-ion battery cells. RD33774PDSTEVB is designed for use in automotive and industrial applications. The device performs analog-to-digital conversion on the differential cell voltages and currents. It is also capable of battery-charge coulomb counting and battery temperature measurements. The RD33774PDSTEVB can be used for rapid prototyping of MC33774ATP-based applications that involve voltage and temperature sensing. The information is digitally transmitted to a microcontroller for processing. The evaluation board can be used with a physical layer transformer transceiver driver (MC33664) to convert MCU SPI data bits to pulse bit information for the MC33774ATP and vice versa. 3.2 Board features The main features of the RD33774PDSTEVB are: · Daisy-chain device connection · LED indicator for operation mode · Cell-balancing resistors (22 per individual cell) · Cell-sense input with RC filter · GPIO: Digital I/O, wake-up inputs, convert trigger inputs, ratiometric analog inputs, analog inputs with absolute measurements · EEPROM (connected to the IC with I2C interface) to store user-defined calibration parameters UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 5 / 20 NXP Semiconductors 3.3 Block diagram UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 4 cells to 18 cells NTC and other sensor HV CONNECTOR ESD CELL BALANCING FILTER MC33774 Figure 1.Block diagram TPL connector TPL connector aaa-051623 3.4 MC33774ATP features and benefits The MC33774ATP is a battery-cell controller IC designed to monitor battery characteristics, such as voltage, current, and temperature. The MC33774ATP contains the circuit blocks necessary to perform battery-cell voltage measurement, cell temperature measurement, and integrated cell balancing. The MC33774ATP supports the following functions: · AEC-Q100 grade 1 qualified: -40 °C to 125 °C ambient temperature range · ISO 26262 ASIL D support for cell-voltage and cell-temperature measurements from the host microcontroller unit (MCU) to the cell · Cell-voltage measurement 4 cells to 18 cells per device Supports busbar voltage measurement with -3 V to 5 V input voltage 16-bit resolution and ±0.8 mV typical measurement accuracy with ultra-low long-term drift 136 µs synchronicity of cell-voltage measurements Integrated configurable digital filter · External temperature and auxiliary voltage measurements One analog input for absolute measurement, 5 V input range Eight analog inputs configurable as absolute or ratiometric, 5 V input range UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 6 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 16-bit resolution and ±5 mV typical measurement accuracy Integrated configurable digital filter · Internal measurement Two redundant internal temperature sensors Supply voltages External transistor current · Cell-voltage balancing 18 internal balancing field effect transistors (FET), up to 360 mA peak with 0.5 RDSon per channel (typ) Support for simultaneous passive balancing of all channels with automatic odd/even sequence Global balancing timeout timer Timer-controlled balancing with individual timers with 10 s resolution and up to 45 hours duration Voltage-controlled balancing with global and individual undervoltage thresholds Temperature-controlled balancing; if balancing resistors are in overtemperature, balancing is interrupted Configurable pulse width modulation (PWM) duty cycle balancing Automatic pausing of balancing during measurement with configurable filter settling time Configurable delay of the start of balancing after transition to sleep Automatic discharge of the battery pack (emergency discharge) Constant current cell balancing to compensate the balancing current variation because of cell voltage variation · I2C-bus master interface to control external devices, for example, EEPROMs and security ICs · Configurable alarm output · Cyclic wake-up to monitor the pack and the balancing function during sleep · Capability to wake up the host MCU via daisy chain in case of a fault event · Host interface supporting SPI or isolated daisy-chain communication (TPL3) 2 Mbit/s data rate for TPL interface 4 Mbit/s data rate for SPI interface · TPL3 daisy-chain communication supports Two-wire daisy chain with capacitive or inductive isolation Protocol supporting up to six daisy chains and 62 nodes per chain · Unique device ID with dynamic adressing · Operation modes Active mode (12 mA typ) Sleep mode (60 µA typ) Deep Sleep mode (15 µA typ) UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 7 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 3.5 Board description The RD33774PDSTEVB allows the user to exercise all the functions of the MC33774ATP battery controller cell. Figure 2.Board description Table 1.Board description Number Name Description 1 Cell balancing resistors 3 x 33 ohms in parallel on each Cx pin: 200 mA of cell-balancing current @4.5 V 2 Cell terminal low-pass filters LPF: 10 k resistor/0.047 µF capacitor to GND 3 GPIO low-pass filters For NTC connections and temperature measurement 4 MC33774ATP (U2) 18-cell battery-cell controller IC 5 NV24C64DWVLT3G (U1) High-speed 64 Kb I2C EEPROM 6 NSS1C201MZ4T1G (Q1) NPN supply bipolar transistor 7, 8 TC102M or capacitive coupling Default BOM: High-voltage single-channel transformers 9 JAE-MX34032NF2 (J1) 32-pin connector for cell connections and NTC connections 10 MOLEX-43650-0213 (J2) TPL connector to higher node 11 MOLEX-43650-0213 (J3) TPL connector to lower node 12 LED VAUX status UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 8 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 3.5.1 Connectors 3.5.1.1 Battery pack connector J1 The cells and NTC connections are available on J1. See Figure 3 Cell0 is connected between C0M(cell0M) and C1M(cell0P); Cell1 is connected between C1M(cell1M) and C2M(cell1P), and so on ... Cell17 is connected between C17M (cell17M) and C17P (cell17P) C17P-PWR and GND (pin21) are used to supply the RD33774PDSTEVB and are separated from C17P and C0M respectively to avoid any voltage drop because of the EVB current consumption. Optional external 10 k NTCs can be connected between each NTCx terminal and one GND terminal. C1M C3M C5M C7M C9M C11M C13M C15M C17M C17P-PWR J1 1 17 NTC8 2 18 NTC7 3 19 NTC2 4 20 NTC1 5 21 6 7 8 9 10 11 12 13 14 15 16 22 23 24 25 26 27 28 29 30 31 32 C0M C2M C4M C6M C8M C10M C12M C14M C16M C17P CON _ 2 X16 aaa - 05116 6 Figure 3.Cell-connector schematic Board connector reference: MX34032NF2 (32 pins/right-angle version) - Manufacturer : JAE Corresponding mate connector reference: MX34032SF1 Crimp reference for the mate connector: M34S75C4F1 (applicable cable 0.22 mm2 to 0.35 mm2) 3.5.1.2 TPL connectors Isolated connections to upper and lower nodes can be done through J2 and J3, respectively. As the TPL communications are bidirectional, the connections can be reversed. J2 OUT- 2 OUT+ 1 2 1 OUT- OUT+ CONN SKT 2 J3 IN+ IN+ IN- 1 2 1 2 INCONN SKT 2 aa a- 051167 Figure 4.TPL connectors Board connector reference: Micro-fit 3.0 43650-0213 (two pins/right angle version) - Manufacturer: Molex Corresponding mate connector reference: 0436450200 Crimp reference for the mate connector: 0436450201 UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 9 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Twisted cable: 64920108 - Manufacturer: Kromberg & Schubert 3.5.1.2.1 TPL configuration The RD33774PDSTEVB can be configured for capacitive TPL communications instead of the default BOM with inductive TPL communication (transformer). See Table 2 for configuration instructions. Table 2.Configuration Name T2 C83_1, C84_1, C83_3, C84_3 R102_1, R103_1, R102_3, R103_3, L1, L2, L3, L4 Value 1:1 transformer 22 nF 0 ohms Inductive isolation Place Remove Remove Capacitive isolation Remove Place Place UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 10 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 3.6 Test points Test points are provided to access various signals on the board. Main test points are detailed in Table 3. Table 3.Test points Label TP1 TP2 TP3 TP6 TP51, 44, 38, 31, 23, 18, 10, 8 TP53, 45, 39, 32, 24, 19, 11, 7 TP61 TP57 TP58 TP66 TP67 TP68 TP86, 87, 88, 89 Signal name C17P-VPWR VBAT RXTX... NTCx GPIO ALARM_OUT VDDA VAUX DRIVE_VDDC IMON_VDDC VDDC, VDDIO GND Description Battery stack HV+ MC33774ATP VBAT supply MC33774ATP TPL lines NTC1 to 8 MC33774 GPIO0 to GPIO7 pins MC33774 AINA_ALARM_OUT pin MC33774 VDDA pin MC33774 VAUX pin MC33774 DRIVE_VDDC pin MC33774 IMON_VDCC pin MC33774 VDDC pin Battery stack HV- UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 11 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 3.7 GPIO configurations The MC33774ATP has nine GPIO pins (GPIO0 to GPIO7 and AINA) available for temperature measurements (excepted AINA), absolute analog measurements, and other functions. The RD33774PDSTEVB makes available the GPIO measurements and functions as described in Table 4. Table 4.GPIO connections Connection J1-20 Board label NTC1 J1-19 NTC2 J1-18 NTC7 J1-17 NTC8 Onboard NTC NCP15XV103J03RC - TP38 NTC3 Not connected - TP31 NTC4 Onboard I2Ceeprom - SCL Onboard I2Ceeprom - SDA Not connected - TP61 GPIO4 GPIO5 AINA Description - BCC connection GPIO0/AIN0 pin through low-pass filter for NTC acquisition - to be connected to an external 10 k NTC (that is, NCP15XV103J03RC) GPIO1/AIN1 pin through low-pass filter for NTC acquisition - to be connected to an external 10 k NTC (that is, NCP15XV103J03RC) GPIO6/AIN6 pin through low-pass filter for NTC acquisition - to be connected to an external 10 k NTC (that is, NCP15XV103J03RC) GPIO7/AIN7 pin through low-pass filter for NTC acquisition - to be connected to an external 10 k NTC (that is, NCP15XV103J03RC) GPIO2/AIN2 pin through low-pass filter for NTC acquisition GPIO3/AIN3 pin through low-pass filter for NTC acquisition GPIO4 pin GPIO5 pin AINA pin UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 12 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 4 Configuring the hardware The RD33774PDSTEVB kit is designed for use with the FRDMDUALK3664EVB in high-voltage isolated applications that provide an SPI-to-high-speed isolated communication interface. The FRDMDUALK3664EVB includes two MC33664 isolated-network high-speed transceivers allowing loopback connection. MCU SPI data bits are directly converted to pulse bit information. Figure 5.FRDMDUALK3664EVB transceiver board 4.1 Battery emulator connection The RD33774PDSTEVB supports the use of a battery-cell emulator, such as the BATT-18EMULATOR board. The BATT-18EMULATOR is an 18-cell battery-emulator board that provides a way to change the voltage across any of the 18 cells and four voltage outputs to emulate four external NTCs. The emulator board can be connected to the RD33774PDSTEVB J1 connector using the provided cell connection cable. Up to three RD33774PDSTEVB can be connected to one BATT-18EMULATOR. See Figure 6 Figure 6.RD33774PDSTEVBs connection to a BATT-18EMULATOR aaa-051169 4.2 TPL communication connection In a high-voltage isolated application with a daisy-chain configuration, up to 62 RD33774PDSTEVB boards may be connected. The TPL connections use the connectors J2 and J3. UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 13 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Figure 7.TPL communication connection UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 14 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC 5 Revision history Revision history Document ID UM12023 v.1 Date 07 February 2024 Description Initial version UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 15 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Legal information Definitions Draft -- A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. 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If this product is used by customer in the development of, or for incorporation into, products or services (a) used in safety critical applications or (b) in which failure could lead to death, personal injury, or severe physical or environmental damage (such products and services hereinafter referred to as "Critical Applications"), then customer makes the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, safety, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. As such, customer assumes all risk related to use of any products in Critical Applications and NXP and its suppliers shall not be liable for any such use by customer. 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Security -- Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer's applications and products. Customer's responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer's applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. -- NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 16 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC NXP -- wordmark and logo are trademarks of NXP B.V. UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 17 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Tables Tab. 1. Board description .............................................. 8 Tab. 2. Configuration ................................................... 10 Tab. 3. Test points ....................................................... 11 Tab. 4. GPIO connections ........................................... 12 UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 18 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Figures Fig. 1. Fig. 2. Fig. 3. Fig. 4. Block diagram ................................................... 6 Board description .............................................. 8 Cell-connector schematic .................................. 9 TPL connectors ................................................. 9 Fig. 5. Fig. 6. Fig. 7. FRDMDUALK3664EVB transceiver board ...... 13 RD33774PDSTEVBs connection to a BATT-18EMULATOR .......................................13 TPL communication connection ...................... 14 UM12023 User manual All information provided in this document is subject to legal disclaimers. Rev. 1 -- 7 February 2024 © 2024 NXP B.V. All rights reserved. 19 / 20 NXP Semiconductors UM12023 RD33774PDSTEVB featuring the MC33774ATP battery cell controller IC Contents 1 2 2.1 2.2 2.3 3 3.1 3.2 3.3 3.4 3.5 3.5.1 3.5.1.1 3.5.1.2 3.6 3.7 4 4.1 4.2 5 Introduction ...................................................... 2 Getting ready ................................................... 4 Finding kit resources and information on the NXP website ................................................4 Kit contents ........................................................4 Required equipment .......................................... 4 Getting to know the hardware ........................ 5 Kit overview ....................................................... 5 Board features ................................................... 5 Block diagram ....................................................6 MC33774ATP features and benefits .................. 6 Board description ...............................................8 Connectors .........................................................9 Battery pack connector J1 .................................9 TPL connectors ................................................. 9 Test points ....................................................... 11 GPIO configurations ........................................ 12 Configuring the hardware ............................. 13 Battery emulator connection ............................ 13 TPL communication connection .......................13 Revision history .............................................15 Legal information ...........................................16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © 2024 NXP B.V. For more information, please visit: https://www.nxp.com All rights reserved. Date of release: 7 February 2024 Document identifier: UM12023