EBYTE SI4463 900MHz 1W SPI Wireless Module User Manual

SI4463 900MHz 1W SPI Wireless Module

Specifications

  • Product Name: E30-900M30S
  • Model: SI4463 900MHz 1W SPI Wireless Module
  • Manufacturer: Chengdu Ebyte Electronic Technology Co.,Ltd

Product Overview

1.1 Brief Introduction

The E30-900M30S is a wireless module designed for various
applications including home security alarm, smart home sensors,
industrial solutions, and more.

1.2 Features

– Supports 900MHz frequency

– SPI interface for communication

– Power output of 1W

1.3 Application

The module can be used in various applications such as home
security alarm systems, smart home devices, industrial sensors,
wireless alarm security systems, building automation solutions, and
more.

Product Usage Instructions

2. Specification and Parameter

2.1 Limit Parameter

  • Power supply: 0V – 5.5V
  • Blocking power: -10dBm
  • Operating temperature: -40°C to +85°C

2.2 Operating Parameter

Ensure the module is powered within the specified voltage range
to prevent damage. Operating the module within the temperature
limits is recommended for optimal performance.

3. Size and Pin Definition

Refer to the user manual for detailed information on the size
and pin configurations of the E30-900M30S module.

4. Recommended Circuit Diagram

Follow the recommended circuit diagram provided in the user
manual when integrating the module into your circuit design.

5. Hardware Design

Ensure proper hardware design considerations are made to
facilitate the seamless integration and operation of the
E30-900M30S module.

FAQ

Q: Can the E30-900M30S module be used for automotive
industry applications?

A: Yes, the module can be utilized in
automotive industry applications for various wireless communication
needs.

E30-900M30S
SI4463 900MHz 1W SPI Wireless Module

Chengdu Ebyte Electronic Technology Co.,Ltd

E30-900M30S User Manual

Contents
DISCLAIMER ………………………………………………………… 3 1 OVERVIEW ……………………………………………………….. 4
1.1 BRIEF INTRODUCTION ……………………………………………………………………………………………………………………………………………………… 4 1.2 FEATURES………………………………………………………………………………………………………………………………………………………………………….4 1.3 APPLICATION ……………………………………………………………………………………………………………………………………………………………………. 4
2 SPECIFICATION AND PARAMETER …………………………………… 5
2.1 LIMIT PARAMETER …………………………………………………………………………………………………………………………………………………………… 5 2.2 OPERATING PARAMETER …………………………………………………………………………………………………………………………………………………..5
3 SIZE AND PIN DEFINITION ………………………………………….. 6 4 RECOMMENDED CIRCUIT DIAGRAM …………………………………. 7 5 HARDWARE DESIGN ……………………………………………….. 7 6 FAQ ……………………………………………………………… 8
6.1 COMMUNICATION RANGE IS TOO SHORT………………………………………………………………………………………………………………………. 8 6.2 MODULE IS EASY TO DAMAGE ……………………………………………………………………………………………………………………………………….8 6.3 BER(BIT ERROR RATE) IS HIGH …………………………………………………………………………………………………………………………………… 9
7 PRODUCTION GUIDANCE …………………………………………… 9 8 E30 SERIES ……………………………………………………….. 9 9 ANTENNA RECOMMENDATION ……………………………………… 10 10 PACKAGE METHOD FOR BULK ORDER ……………………………… 10 REVISION HISTORY ………………………………………………….. 11 ABOUT US ………………………………………………………….. 11

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Disclaimer

E30-900M30S User Manual

EBYTE reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of EBYTE is strictly prohibited.
The information contained herein is provided “as is” and EBYTE assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by EBYTE at any time. For most recent documents, visit www.cdebyte.com

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1 OVERVIEW
1.1 Brief Introduction
E30-900M30S is a hardware module (SPI) based on the SI4463 RF chip imported from Silicon Labs. It is a half-duplex, SMD integrated transceiver with transparent transmission available. With working frequency band 855-925MHz, transmitting power 1w, it is suitable for a variety of environments. The original imported SI4463 RF chip from Silicon Labs(USA) features high receiving sensitivity and strong anti-interference, supporting the development of low power consumption as well. It has been widely used in various industries and has the characteristics of stable performance, long transmission distance, and strong ability of penetration and diffraction, etc.
1.2 Features
The measured communication distance is up to 5.6km; Maximum transmission power: 1W; 855-925MHz ultra-wide frequency band; Air date rate100bps1Mbps; With 3.35.5V power supply, over 5 V guarantees the best performance; Industrial grade standard design,support -40 ~ 85 °C for working over a long time;
1.3 Application
Home security alarm and remote keyless entry; Smart home and industrial sensors, etc.; Wireless alarm security system; Building automation solutions; Wireless industrial-grade remote control; Intelligent agriculture and oilfield solutions; Health care products; Advanced Meter Reading Architecture(AMI); Automotive industry applications.

E30-900M30S User Manual

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2 Specification and Parameter

E30-900M30S User Manual

2.1 Limit Parameter
Main parameter Power supplyV Blocking powerdBm Operating temperature

Performance

Min

Max

0

5.5

10

-40

+85

Remark
Voltage over 5.5V will cause permanent damage to module Chances of burn is slim when modules are used in short distance Industrial grade

2.2 Operating Parameter

Main parameter

Operating voltageV

Communication levelV

Operating temperature

Operating frequencyMHz

Power

TX currentmA

Consump RX currentmA

– tion Sleep current A

Max TX powerdBm

Receiving sensitivitydBm

Performance

Min

Typical

Max

3.3

5.0

5.5

3.3

-40

+85

855

925

550

650

700

22

2

29

30

30.5

-120

-121

-122

Remark
5 V ensures output power For 5V TTL, it may be at risk of burning down Industrial grade
Instant power consumption
Air data rate is1kbps

Main parameter
Reference distance
Modulation Crystal frequency Communication Interface
Package Interface method
Size Antenna

Description
5.6Km
GFSK 26MHz
SPI SMD Stamp Hole 38.5*24mm IPEX/STAMP

Remark Test conditionclear and open area, antenna gain: 5dBi antenna height: 2.5mair data rate: 1kbps
Built-in passive crystal Max. rate 10Mbps
50 ohm impedance

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3 Size and Pin definition

E30-900M30S User Manual

Pin No. 1 2 3 4
5

Item GND GND GND GND
GND

6

IO2

7

IO3

8

IO0

9

VCC

10

VCC

11

GND

12

GND

13

IO1

14

IRQ

15

SDN

16

MISO

Direction
Output Output Output
Output Output Output

Description
Ground wire, connected to the power reference ground Ground wire, connected to the power reference ground Ground wire, connected to the power reference ground Ground wire, connected to the power reference ground
Ground wire, connected to the power reference ground
Configurable universal GPIO2 ports (controlled via SI4463 internal register, see SI4463 manual), the RF transceiver control switch RX enabling terminal is connected inside the module, see Table 1 for control logic The configurable universal GPIO3 port (controlled by SI4463 internal register, see SI4463 manual), the RF transceiver control switch TX enabling terminal is connected inside the module, see Table 1 for control logic Configurable universal GPIO0 port (see SI4463manual for details) Power supply, 3.3~5.5V, 5V is recommended (It is also recommended to add external ceramic filter capacitor) Power supply, 3.3~5.5V, 5V is recommended (It is also recommended to add external ceramic filter capacitor) Ground wire, connected to the power reference ground Ground wire, connected to the power reference ground Configurable universal GPIO1 port (see SI4463manual for details) SPI interrupt request Shutdown Input Pin. It is low level when working (See SI4463 manual for more details) SPI master output slave input

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17

MOSI

Input

SPI master input slave output

18

SCK

Input

Serial Clock Input

19

nSEL

Input

SPI Chip select for starting SPI communication

20

GND

Ground wire, connected to the power reference ground

21

ANT Input/Output Antena

22

GND

Ground wire, connected to the power reference ground

E30-900M30S User Manual

Table 1 [Transceiver state control truth table]

Radio State

Pin

GPIO2 RXEN

GPIO3 TXEN

Remark

Transmit

0

Receive

1

Low power consumption

0

1

“0”low level, “1”high level

* GPIO2,GPIO3 cannot be at the same time as “1”.

0

* If at the far-distance, the received packet lacks the first few frames,

then try to delay the data by 1ms after opening the transmit state on

0

the transmitter.

4 Recommended circuit diagram

5 Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible and the module needs to be reliably grounded;
Please pay attention to the correct connection of the positive and negative poles of the power supply, reverse connection may cause permanent damage to the module;
Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged;
Please check the stability of the power supply. Voltage can not fluctuate greatly and frequently; When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the

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E30-900M30S User Manual

margin, so the whole machine is beneficial for long-term stable operation; The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference; Bottom Layer High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under
the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in the Bottom Layer; Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees; It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance. It is recommended to keep them away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done; Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding can be done; If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage); Try to stay away from some physical layers such as TTL protocol at 400MHz; The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside; When the antenna is installed inside a metal case, it will cause the transmission distance to be greatly weakened.

6 FAQ

6.1 Communication range is too short
The communication distance will be affected when obstacle exists; Data lose rate will be affected by temperature, humidity and co-channel interference; The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground; Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea; The signal will be seriously affected when the antenna is near metal object or put in a metal case; Power register was set incorrectly or air data rate is set as too high (the higher the air data rate, the shorter the distance); The power supply low voltage under room temperature is lower than our recommendation, the lower the voltage, the
lower the transmitting power; Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply, ensure it works in correct voltage;

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E30-900M30S User Manual

Please check the stability of power source, the voltage cannot fluctuate too much; Please make sure anti-static operation when installing and using, high frequency devices have electrostatic
susceptibility; Please ensure the humidity is within limited range, some parts are sensitive to humidity; Please avoid using modules under too high or too low temperature.

6.3 BER(Bit Error Rate) is high

There are co-channel signal interference nearby, please be away from interference sources or modify frequency and channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable; The extension line and feeder quality are poor or too long, so the bit error rate is high.

7 Production guidance

This product is a SMD module. When soldering the module, the soldering personnel must work in accordance with the anti-static operation specification; This product is an electrostatic sensitive product. If the module is not welded according to the specification, the module may be permanently damaged.

8 E30 series

Model No. E30-170T20D E30-170T27D E30-433T20D E30-433T20S3 E30-400M20S(4438)
E30-400M20S(4463)
E30-900M20S
E30-400M30S(4438)
E30-400M30S(4463)
E30-900M30S

IC SI4463 SI4463 SI4463 SI4463 SI4438
SI4463
SI4463
SI4438
SI4463
SI4463

Frequency Hz
170M 170M 433M 433M 433/470M
433/470M
868/915M
433/470M
433/470M
868/915M

Tx power dBm
20 27 20 20 20
20
20
30
30
30

Distance km 2.0 5.0 2.5 2.5 2.5
2.5
2.5
5.6
5.6
5.6

Air data rate bps
1k25k 1k25k 1k25k 1k25k 100bps 500kbps 100bps 1Mbps 100bps 1Mbps 100bps 500kbps 100bps 1Mbps 100bps 1Mbps

Package DIP DIP DIP SMD SMD
SMD
SMD
SMD
SMD
SMD

Size mm 21 * 36 24 * 43 21 * 36 16 * 26 14 * 20
14 * 20
14 * 20
24 * 38.5
24 * 38.5
24 * 38.5

Antenna SMA-K SMA-K SMA-K IPEX/STAMP IPEX/STAMP
IPEX/STAMP
IPEX/STAMP
IPEX/STAMP
IPEX/STAMP
IPEX/STAMP

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E30-900M30S User Manual

9 Antenna recommendation

The antenna plays an important role in the communication process. A good antenna can largely improve the communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and reasonable price.

Model No.

Type

Frequency Hz

Interface

Gain dBi

TX868-JZLW-15 Rubber 868M IPEX 1

3.0

TX915-JZLW-15 Rubber 915M IPEX 1

3.0

TX915-FPC-4510 FPC

915M IPEX 1

2.0

Hight mm 165
165 130

Cable mm 12.5
12.5 10

Function feature
Rubber cabinet antenna, omnidirectional antenna
Rubber cabinet antenna, omnidirectional antenna
Flexible antenna

10 Package method for bulk order

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Revision history

E30-900M30S User Manual

Version 1.0 1.1 1.2 1.3 1.4

Date 2021-08-09 2022-08-23 2023-02-20 2024-11-26 2025-1-13

Description Content updated
Bug fixes Bug fixes Add a description of the RF transceiver logic control Example Modify the description of the airspeed error

Issued by Linson
Yan Bin Ning Hao

About us
Technical support: support@cdebyte.com Documents and RF Setting download link: www.es-ebyte.com Thank you for using Ebyte products! Please contact us with any questions or suggestions: info@cdebyte.com ————————————————————————————————Phone: 4000-330-990 Web: www.cdebyte.com Address: F/2 B2 Building Mould Park, 199# Xiqu Ave, High-tech District, Sichuan, China

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Documents / Resources

EBYTE SI4463 900MHz 1W SPI Wireless Module [pdf] User Manual
E30-900M30S, E30-170T27D, E30-433T20D, E30-433T20S3, E01-2G4M27D, SI4463 900MHz 1W SPI Wireless Module, SI4463, 900MHz 1W SPI Wireless Module, SPI Wireless Module, Wireless Module, Module

References

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