E104-BT53A3 User Manual
EFR32BG22, 2.4G, BLE5.2
Low power consumption Bluetooth module
Overview
Brief introduction
E104-BT53A3 is a small-sized SMD Bluetooth BT5.2 module based on Silicon Labs’ original IC EFR32BG22; it uses 38.4MHz industrial-grade high-precision low-temperature drift crystal oscillator to ensure its industrial-grade function and stable performance.
EFR32BG22 chip integrates 32-bit ARM® Cortex®-M33 core and Bluetooth 5.2 RF transceiver and protocol stack, and has rich peripheral resources of UART, I2C, SPI, ADC, DMA, PWM. The module provides almost all IO ports (please check the pin definition for details) to allow users to carry out multi-directional development.
This module is a pure hardware SoC module without firmware program. The functions of Bluetooth-based broadcasting, scanning, connection, and transparent transmission can only be realized after the user’s secondary development.
Features
- Support Bluetooth 5.2 protocol;
- Support Direction Finding;
- Maximum transmit power 6dBm, adjustable by software;
- Support the global license-free ISM 2.4GHz band;
- Built-in high-performance low-power Cortex®-M33 core processor;
- Rich resources, 512KB FLASH, 32KB RAM;
- Support 1.9 ~ 3.6V power supply, 3.3-3.6V can guarantee the best performance;
- Industrial standard design, support long-term use at -40+85;
- The experimental communication distance is 120 meters;
- The module uses a PCB antenna.
Application
- Smart home and industrial sensors;
- security system;
- Wireless remote control, UAV;
- Wireless game remote control;
- Healthcare products;
- Wireless voice, wireless headset;
- Asset tags, beacons, etc.
Parameters
Limit Parameters
| Parameters | Value | Specification | |
| Min | Max | ||
| Power supply voltage (V) | 0 | 4. | Power over 3.6V will damage the Module |
| Blocking power (dBm) | – | 10 | Probability of burn down at close range |
| Working temperature (t) | -40 | +85 | Industrial grade |
Working Parameters
| Parameters | Value | Specification | ||
| Min | Typical | Max | ||
| Working voltage (V) | 1.9 | 3.3 | 3.6 | >3.3V can guarantee the output power |
| Communication level (V) | – | 3.3 | – | Using 5V level has the risk of burning |
| Working temperature (C) | -40 | – | +85 | Industrial design |
| Working frequency band (MHz) | 2402 | 2440 | 2480 | Support ISM frequency band |
| TRX ( mA ) | – | 8. | @Transmit power 6dBm | |
| RX ( mA ) | – | 4. | – | |
| Sleeping Current ( uA ) | – | 0.17 | – | Software is off |
| Max TRX Power (dBm) | – | 6 | – | |
| Receiving sensitivity ( dBm ) | – | -107. | -106dbm sensitivity @125kbps GFSK; -98.9dbm sensitivity (g1Mbith GFSK; -96.2dbm sensitivity ©2Mbitis GFSK; | |
| Air Rate I GFSK (bps) | 125k | – | 2M | Programmable by User |
| Parameters | Specification | Note |
| Reference distance | 120m | Clear and open, antenna gain 5dBi, antenna height 2.5m, air rate I kips |
| Crystal frequency | 38.4MHz | – |
| supporting agreement | BLE 5.2 | – |
| Packaging method | SMD | – |
| Interface method | 1.27mm | – |
| IC full name | EFFt32BG22C224F512 GM32 |
.. |
| FLASH | 512KB | – |
| RAM | 32KB | – |
| Kernel | ARM®Cortex®-M33 | – |
| Dimensions | 13*19mm | – |
| RF interface | PCB | Equivalent impedance is about 50 |
Size and Pin Definition
| Pin Na | Name | Type | Dentition |
| 1 | GND | Input | Ground wire, connect to power reference ground |
| 2 | PB02 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 3 | PBOI | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 4 | PBOO | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 5 | PA00 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 6 | PA01 | Input | SWCLIK, serial line debugging clock input debugging and programming (see EFR32BG22 manual for details) |
| 7 | PA02 | Input | SWDIO, serial line debugging and programming debugging (see EFR32BG22 manual for details) |
| 8 | PA03 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 9 | GND | Input | Ground wire, connect to power reference ground |
| 10 | GND | Input | Ground wire, connect to power reference ground |
| 11 | PA04 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 12 | PA05 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 13 | PA06 | input Output | MCU GPIO (see EFR32BG22 manual for details) |
| 14 | VCC | Input | Power supply, range 1.9 ~ 3.6V (recommended to add ceramic filter capacitors externally) |
| I5 | VCC | Input | Power supply, range 1.9 ~ 3.6V (recommended to add ceramic filter capacitors externally) |
| 16 | GND | Input | Ground wire, connect to power reference ground |
Hardware and Software
Hardware Notice
- If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, it may still damage the module);
- Try to stay away from the TTL protocol which is also 2.4GHz in some physical layers, for example USB3.0;
- It is recommended to use a DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded
- Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection may cause permanent damage to the module;
- Please check the power supply to ensure that it is between the recommended power supply voltage, if exceeding the maximum value will cause permanent damage to the module;
- Please check the power supply stability, the voltage cannot fluctuate significantly and frequently;
- When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, so that the whole machine is conducive to long-term stable work;
- The module should be as far away as possible trom the power supply, transformer, high-frequency wiring and other parts with large electromagnetic interference
- High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is absolutely necessary to pass under the module, it is assumed that the module is soldered to the top layer, and the copper layer is laid on the top layer of the contact part of the module (all copper And well grounded), must be close to the digital part of the module and the wiring is on the Bottom Layer;
- Assuming that the module is soldered or placed on the Top Layer, it is also wrong to randomly route on the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees;
- Assuming that there are devices with large electromagnetic interference around the module, it will greatly affect the performance of the module. It is recommended to stay away from the module according to the intensity of the interference. If the situation permits, appropriate isolation and shielding can be done;
- It is assumed that there are traces with high electromagnetic interference around the module (high-frequency digital, high-frequency analog, and power traces), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the intensity of the interference. Isolation and shielding;
- The antenna installation structure has a great impact on the performance of the module. Make sure that the antenna is exposed, preferably vertically. When the module is installed inside the cabinet, you can use a high-quality antenna extension cord to extend the antenna to the outside of the cabinet;
- The antenna must not be installed inside the metal shell, which will greatly weaken the transmission distance.
Programming
- The core IC of this module is EFR32BG22C224F512GM32, and its programming method is the same as this IC. Users can follow the FR32BG22C224F512GM32 official programming guide;
- For general I/O port configuration, please refer to EFR32BG22C224F512GM32 manual for details;
- Regarding software development, it is recommended that users use the Simplicity Studio officially provided by silicon-labs. This IDE document describes in detail and complete information. Using Simplicity Studio, users need to go to the silicon-labs official website to register an account to use.
- Users can use the development board provided by silicon-labs to download the program, or use the universal JLINK. JLINK program download software is as follows:
FAQ
Communication range is too short
- The communication distance will be affected when obstacle exists.
- Data lose rate will be affected by temperature, humidity and co-channel interference.
- The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
- Seawater has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
- The signal will be affected when the antenna is near metal object or put in a metal case.
- Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
- When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
- The use of the antenna and the module is poorly matched or the quality of the antenna itself is defective.
Module is easy to damage
- Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
- Please check the stability of power supply and ensure the voltage not to fluctuate too much.
- Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
- Please ensure the humidity is within limited range for some parts are sensitive to humidity.
- Please avoid using modules under too high or too low temperature.
Bit error rate is too high
- When there are co-channel signal interference nearby, be away from interference sources or modify frequency and channel to avoid interference:
- Unfavorable power supply may cause code error. Make sure that the power supply is reliable.
- The quality of extension cables and feeders is poor or too long can also cause high bit error rate.
Welding operation guidance
Reflow Soldering Temperature
| Profile Feature | Curve feature | Sn-Pb Assembly | Pb-Free Assembly |
| Solder Paste | Solder paste | Sn63/Pb37 | Sn96.5/Ag3/Cu0.5 |
| Preheat Temperature min (Tsmin) | Minimum preheating temperature | 100°C | 150°C |
| Preheat temperature max (Tsmax) | Maximum preheating temperature | 150°C | 200°C |
| Preheat Time (Tsmin to Tsmax)(ts) | Preheating time | 60-120 sec | 60-120 sec |
| Average ramp-up rate(Tsmax to Tp) | Average rising rate | 3°C/second max | 3°C/second max |
| Liquidous Temperature (TL) | Liquid phase temperature | 183°C | 217°C |
| Time ( tL ) Maintained Above (TL) | Time above liquidus | 60-90 sec | 30-90 sec |
| Peak temperature ( Tp ) | Peak temperature | 220-235°C | 230-250°C |
| Aveage ramp-down rate (Tp to Tsmax) | Average descent rate | 6°C/second max | 6°C/second max |
| Time 25°C to peak temperature | Time of 25 ° C to peak temperature | 6 minutes max | 8 minutes max |
Reflow Soldering Curve
Revision History
| Version | Date | Description | Issued by |
| 1.0 | 2020-05-08 | Initial version |
Contact
| Sales hotline: 4000-330-990 Support: support@cdebyte.com |
Tel: 028-61399028 Website: www.ebyte.com |
Address: Innovation Center B333—D347, 4# XI-XIN road, High-tech district (west), Chengdu, Sichuan, China
Chengdu Ebyte Electronic Technology Co.,Ltd.
Copyright ©2012-2019, Chengdu Ebyte Electronic Technology Co.,Ltd.
Documents / Resources
 |
EBYTE E104-BT53A3 Low Power Consumption Bluetooth Module [pdf] User Manual E104-BT53A3, Low Power Consumption Bluetooth Module, E104-BT53A3 Low Power Consumption Bluetooth Module, EFR32GB22, 2.4G, BLE5.0 |
