CHIPSEA CSM92F40NCC Bluetooth Low Energy Single-Mode Module User Manual

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Contents
REVISION HISTORY…………………………………………………………………………………………………………………………….. 2 1. MODULE OVERVIEW………………………………………………………………………………………………………………………..4
1.1 DESCRIPTION……………………………………………………………………………………………………………………………………. 4 1.2 FEATURES………………………………………………………………………………………………………………………………………… 4 1.3 FUNCTION BLOCK DIAGRAM……………………………………………………………………………………………………………… 5 2. PIN ASSIGNMENTS…………………………………………………………………………………………………………………………… 6 3. ELECTRICAL SPECIFICATIONS……………………………………………………………………………………………………… 8 3.1 ABSOLUTE MAXIMUM RATINGS………………………………………………………………………………………………………….. 8 3.2 RATINGS RECOMMEND OPERATING CONDITIONS………………………………………………………………………………….. 8 3.3 DC ELECTRICAL SPECIFICATION (3.3V, 25)………………………………………………………………………………………. 8 3.4 POWER CURRENT CONSUMPTION CHARACTERISTICS (3.3V, 25)…………………………………………………………. 9 3.5 RF CHARACTERISTICS………………………………………………………………………………………………………………………..9 4. MODULE SCHEMATIC DIAGRAM…………………………………………………………………………………………………. 11 5. MODULE DIMENSION INFORMATION…………………………………………………………………………………………. 12 5.1 MODULE DIMENSIONS……………………………………………………………………………………………………………………… 12 6. MODULE APPLICATION INFORMATION……………………………………………………………………………………… 13 6.1 MODULE APPLICATION SCHEMATIC DIAGRAM………………………………………………………………………………………13 6.2 RECOMMENDED PCB PACKAGE DIAGRAM………………………………………………………………………………………….. 14 6.3 APPLICATION ATTENTION…………………………………………………………………………………………………………………..14 7. PRODUCTION PROCESSES……………………………………………………………………………………………………………..15 7.1 REFLOW SOLDERING TEMPERATURE CURVE………………………………………………………………………………………..15 7.2 STORAGE SPECIFICATION………………………………………………………………………………………………………………….. 15 7.3 ULTRASONIC VIBRATION……………………………………………………………………………………………………………………16 8. ORDERING INFORMATION…………………………………………………………………………………………………………….17

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1. Module Overview

1.1 Description

The CSM92F40NCC module is a Bluetooth low power energy(Bluetooth LE) single-mode module based on the chip CST92F40 which designed by Chipsea. It is compatible with Bluetooth standard version 5.1, support 1Mbps and 2Mbps data rates. It integrates CortexTM-M4 core, rich feature peripheral units, such as UART, ADC, I2S, I2C, DMA, Timer and so on. The module use chip antenna, has the advantages of small size, low power consumption and high reliability, which is very suitable for IoT application scenarios such as smart wearable devices, smart home, sports fitness, industrial control and so on.

1.2 Features

· Basic features · ARM® CortexTM-M4 32-bit processor · Up to 512KB Flash, 40KB Data SRAM · Support OTA upgrade
· Bluetooth LE features · Support Bluetooth LE 5.1 standard · Operating frequency 2402~2480MHz · Two transmission speeds are supported · 1Mbps · 2Mbps · TX power -20 ~ +7dBm
· Power consumption · 1mA in running mode@32MHz · 1.2uA in deep sleep mode@No RAM retention
· Peripherals · Up to 15 general purpose GPIO · Pinmux freely configure all kinds of digital peripheral interface · All GPIO output state can be retained in sleep mode · Rich digital peripherals such as 2*UART, I2C, I2S, QSPI, 3*Timer and so on · 12-bits ADC, 4 single-end external input channel · Integrate 32MHz crystal

· Operating environment · Supply voltage range 1.9V~3.6V · Minimum supply current: 40mA · Operating temperature range: -40~85
· Package · SMT module · MSL3 level · Dimension: 9mm*13mm*2.3mm
· Certification · BQB · SRRC · CE · FCC
· Reliability test · HTOL/THB/HTS/uHAST/TCT/AC/ESD
· Applications · Smart wearable devices · Smart home · Sports fitness · Industrial control

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1.3 Function Block Diagram

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Figure 1.2 CSM92F40NCC module Function Block Diagram (chip antenna)

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2. Pin assignments

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Figure 2.1 CSM92F40NCC module Pin assignments (Top View)

Pin No.
1 2
3
4 5 6 7
8

Pin name
GND P02
P03
RST_N/P10 P13 P14 P04
P05

Type
P I/O AI AI I/O AI AI I I/O AI I/O AI I/O I/O
I
I/O O

Description GND ground Digital GPIO 2
Microphone P input
GPADC input 8 Digital GPIO 3
Microphone N input
GPADC input 9 Reset signal Digital GPIO 10 GPADC input 5 Digital GPIO 13 GPADC input 2 Digital GPIO 14 Digital GPIO 4 ISP mode BOOT select pin, low level enter into ISP mode, default internal pull-up Digital GPIO 5 UART TX pin in ISP mode

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Pin No.
9
11 10 11 12 13
14 15 16 17 18 19

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Pin name

Type

Description

I/O Digital GPIO 6

P06

UART RX pin in ISP mode

Digital GPIO 9

P09

AI GPADC input 1

VDD

P Power supply 1.8V~3.6V

GND

P GND ground

P17

I/O Digital GPIO 17

I/O Digital GPIO 0

P00

SWD debug CLK

I/O Digital GPIO 1
P01
I/O SWD debug data

P18

I/O Digital GPIO 18

P19

I/O Digital GPIO 19

P07

I/O Digital GPIO 7

P20

I/O Digital GPIO 20

GND

P GND ground

Table 2.1 CSM92F40NCC Pin Description

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3. Electrical Specifications
3.1 Absolute Maximum Ratings

The module could be damaged by extra stress more than the absolute maximum ratings working conditions, please be sure the design follow this rule.

Ratings

Min

Max

Unit

Supply voltage(VDD)

-0.3

3.9

I/O pin voltage

-0.3

VDD

Output current sunk by I/O pin

18.6

Output current source by I/O pin

18.6

Total current into VDD power lines (source)

105

Total current out of VSS ground lines (sink)

105

Storage Temperature

-40

125

ºC

Human Body Mode

±4000

–

ESD

Charge Device Mode

±1000

–

MSL

Table 3.1 CSM92F40NCC Absolute Maximum Ratings

3.2 Ratings Recommend Operating Conditions

Ratings

Min

Typ

Max

Unit

Supply voltage (VDD)

1.9

3.3

3.6

External minimum power supply current (IVDD)

Operation Temperature (T)

-40

ºC

Table 3.2 CSM92F40NCC Recommend Operating Conditions

3.3 DC Electrical Specification (3.3V, 25)

Parameter

Min

Typ

Max

Unit

Input low level voltage (VIL)

VSS

0.3*VDD

Input high level voltage (VIH)

0.7*VDD

VDD

I/O pull-up equivalent resistor (RPU) @gpio_pl_ctrl[1:0]=00

5.6

I/O pull-up equivalent resistor (RPU) @gpio_pl_ctrl[1:0]=01

I/O pull-up equivalent resistor (RPU) @gpio_pl_ctrl[1:0]=10

380

I/O pull-up equivalent resistor (RPU) @gpio_pl_ctrl[1:0]=11

3.7

I/O pull-down equivalent resistor (RPD)

200

RST_N pull-up equivalent resistor (RPU)

I/O pin capacitance (Cin)

Output low level voltage (VOL@IIO=1mA)

0.12

Output high level voltage (VOH@IIO=1mA)

3.17

Table 3.3 CSM92F40NCC DC Electrical Specification

Note: The IO output current capacity can be configured through the register, and there are 2 levels to choose from:

2mA, 4mA.

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3.4 Power Current Consumption Characteristics (3.3V, 25)

Parameter

Conditions

Min

7 dBm TX @ 1 Mbps Bluetooth LE

mode

5 dBm TX @ 1 Mbps Bluetooth LE

Tx only run current

mode

(CPU Running from flash, 0 dBm TX @ 1 Mbps Bluetooth LE

Clock = 32MHz, clock source mode

is XTAL32M)

-5 dBm TX @ 1 Mbps Bluetooth LE

mode

-20 dBm TX @ 1 Mbps Bluetooth LE

mode

Rx only run current

(CPU Running from flash, Radio RX @ 1 Mbps Bluetooth LE

Clock = 32MHz, clock source mode

is XTAL32M)

Clock = 64MHz, clock source is

XTAL32M

Run mode current

Clock = 32MHz, clock source is

(CPU Running from flash)

XTAL32M

Clock = 16MHz, clock source is

XTAL32M

Deep sleep mode, No RAM retention,

wakeup by GPIO

Sleep mode current

Deep sleep mode, 40K RAM retention, wakeup by GPIO

Sleep mode, 40K RAM retention,

wakeup by RC32K and GPIO

Table 3.4 Power Current Consumption Characteristics

Typ Max Unit

9.2

6.1

5.0

4.5

1.4

1.2

1.8

2.9

3.5 RF Characteristics

[Supply Voltage = 3.3V @ 25] Parameter Sensitivity, uncoded data at 1 Ms/s Sensitivity, uncoded data at 2 Ms/s Maximum received signal RF output power control range Operating frequency range
Note:

Min
-20
2402 Table 3.5 RF Characteristics

Typ -97(1) -94(1)
0

Max
-1.5 7
2480

Unit dBm dBm dBm dBm
MHz

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1. Because the RF signal is multiplied by the crystal signal, it is easy to be interfered by the crystal harmonic signal in some frequency points, resulting in the problem of reduced receiving sensitivity, such as 2480MHz, 2464MHz, 2448MHz, 2432MHz, 2416MHz. Usually the receiving sensitivity will be reduced by about 1~7dbm at these frequency points.

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4. Module Schematic Diagram
The schematic diagram of the circuit inside the module is as follows.
Figure 4.1 Module schematic diagram

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5. Module Dimension Information
5.1 Module dimensions

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Figure 5.1 CSM92F40NCC module dimensions

Parameter

Dimension

Length Width Height

13mm±0.2mm 9mm±0.2mm 2.3mm±0.15mm

Thickness of PCB

0.8mm

Pin pitch

1.27mm

Bottom dimension of PAD

0.7mm*0.8mm

Table 5.1 Module dimensions

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6. Module Application Information
6.1 Module application schematic diagram

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Figure 6.1 Module application schematic diagram
Note: 1) SWD interface is used for SWD debugging and burning, ISP interface is used for burning. During module application, the ISP interface must be reserved for chip burning on the board. 2) The module pre-burned the program, the program to achieve UART-BLE data transparent transmission function, in which PIN15 is communication UART_TX output, PIN16 is communication UART_RX input, PIN17 is the WAKEUP input (low level wake up), PIN18 is Bluetooth connection status output (High level when Bluetooth is not connected, low level when Bluetooth is connected), and PIN4 is the chip reset pin (active low level).

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6.2 Recommended PCB package diagram

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Figure 6.2 PCB package diagram
6.3 Application attention
1) The PCB under the module antenna area belongs to the clearance area, and copper is prohibited to avoid affecting the RF signal. Copper is recommended under non-antenna areas to improve system power integrity. 2) The antenna should be far away from other circuits to prevent the radiation efficiency from becoming low and affecting the normal use of other circuits. 3) If there are other wireless modules inside the product, it is necessary to plan the frequency reasonably, and pay attention to opening the distance between each other to reduce the influence of the same frequency interference and harmonic interference. 4) There are CMOS devices in the module, pay attention to anti-static during transportation and use. 5) The module is a precision device, the user is strictly prohibited to change the internal design.

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7. Production processes
7.1 Reflow Soldering Temperature Curve
It is recommended that the module be reflow only once. Too many reflow soldering times may cause the module to fail to work or deteriorate performance.

Figure 7.1 Reflow soldering temperature curve

Reflow zone

Description

Ramp-up zone

Temp. <150, Time 60 ~ 90s, Ramp-up rate 1 ~ 3/s

Preheating zone

Temp. 150 ~ 200, Time 60 ~ 120s, Ramp-up rate 0.3 ~ 0.8/s.

Reflow down zone

Peak Temp. 235 ~ 250 ( <245 recommended), Time 30 ~ 70s.

Cooling down zone

Temp. 217 ~ 170, Ramp-down rate 3 ~ 5/s.

Table 7.1 Reflow temperature range

Note: Solder is lead-free solder of tin silver copper alloy. (Sn&Ag&Cu Lead-free solder (SAC305))

7.2 Storage specification

1. Sealed shelf life: 12 months in an environment where the temperature is less than 30 and the relative humidity is less than 60%. 2. The window time after unpacking: 168 hours. Beyond this time need to re-bake before use, baking requirements: 125±5, 24 hours. 3. After the target hardware PCB is unpacked, if the window time exceeds 168 hours, it also needs to be re-baked before use. Note: 1) Window time: the time between the end of the final baking and the beginning of the next reflow welding, conforming to MSL3 level: less than or equal to 30/60% RH 168 hours of workshop life.

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7.3 Ultrasonic vibration
Avoid exposing the module to the vibrations of ultrasonic devices such as ultrasonic welders or ultrasonic cleaners. The vibration of the ultrasonic equipment may resonate with the crystal vibration inside the module, resulting in crystal vibration failure, then resulting in the module failure or performance degradation.

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8. Ordering Information

Part No.

Module Dimensions

Operating Temperature
Range

Moisture Sensitivity
Level

Packing Options

Packing quantity

Antenna Type

CSM92F40NCC

9mm*13mm* 2.3mm

-400C ~850C

MSL3

Tray 1200 Chip Antenna

Federal Communication Commission (FCC) Radiation Exposure Statement The device has been evaluated to meet general RF exposure requirement.When using the product,

maintain a distance of 20cm from the body to ensurecompliance with RF exposure reguirements. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC ID: 2AGM5240192F42. Additionally, the following statement should be included on the label and in the final product’s user manual: “This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.”

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The module is allowed to be installed in mobile and portable applications A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end-use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCCapplication filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together. This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations(e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable.(OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user.
CE 2402-2408MHz EIRP: 2.34dBm.

DISCLAIMER AND COPYRIGHT NOTICE
The information in this document, including the reference URL, is subject to change without notice. This document may refer to the information of a third party, and all the information cited is provided “as is”. CHIPSEA Technologies does not guarantee the accuracy and authenticity of the information. CHIPSEA Technologies makes no warranty on the contents of this document, including its marketability and suitability for a specific purpose, and does not provide any other warranty mentioned elsewhere in the proposal, specification or sample of CHIPSEA Technologies. CHIPSEA Technologies does not guarantee whether this document infringes the rights of a third party, nor is it responsible for any infringement of intellectual property rights caused by the use of the information in this document. This document does not license any intellectual property rights, express or implied, by estoppel or otherwise. The membership mark of Wi-Fi alliance belongs to Wi-Fi alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. It is hereby declared that all trademark names, trademarks and registered trademarks mentioned in the document are the property of their respective owners.
© 2023 CHIPSEA Technologies (Shenzhen) Co., Ltd. All rights reserved.

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Documents / Resources

CHIPSEA CSM92F40NCC Bluetooth Low Energy Single-Mode Module [pdf] User Manual
CST92F40, CSM92F40NCC Bluetooth Low Energy Single-Mode Module, CSM92F40NCC, Bluetooth Low Energy Single-Mode Module, Low Energy Single-Mode Module, Energy Single-Mode Module, Single-Mode Module, Module

References

User Manual

CHIPSEA CSM92F40NCC Bluetooth Low Energy Single-Mode Module User Manual

CSM92F40NCC Bluetooth Low Energy Single-Mode Module

Specifications

Module Overview

1. Description

2. Features

3. Function Block Diagram

Pin Assignments

Electrical Specifications

3.1 Absolute Maximum Ratings

Product Usage Instructions

1. Installation

2. Configuration

3. Programming

FAQ

Q: Can I use a supply voltage higher than 3.6V?

Documents / Resources

References

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