1. Product Overview
The MEMO Mobile Phone Cooler Heat Sink is a superconducting uniform heating plate designed to enhance the cooling performance of your mobile phone, especially during gaming or intensive use. It works by expanding the cooling area and accelerating heat dissipation when used in conjunction with a compatible radiator (back-clip or magnetic).
Image: MEMO Mobile Phone Cooler Heat Sink in use with a clip-on radiator.
Video: Manufacturing process of the heat sink plate, showing the "legendary" logo being applied.
2. Safety Warnings and Information
- Environment: Do not use the device in high-temperature or humid environments.
- Children: Keep out of reach of children to prevent accidental operation.
- Flammable Materials: Do not place the cooler on flammable materials.
3. Setup and Installation
The heat sink plate is designed for easy attachment to your mobile phone.
3.1. Attaching the Heat Sink Plate
- Clean the back surface of your mobile phone to ensure it is free of dust and grease.
- Depending on the type of heat sink plate you have:
- Type 1 (Vapor chamber-back clip): This type features thermally conductive silicone grease on the back. Carefully tear off the transparent protective film from the back of the plate.
- Type 2 (Vapor Chamber-Magnetic Type): This type has a built-in invisible magnetic ring and uses water-washed glue on the back. Tear off the protective sticker. The glue is reusable after washing and drying.
- Type 3 (Vapor Chamber-Upgraded Double Type): This upgraded version also uses water-washed glue on the upper and lower parts, with thermally conductive silicone grease in the middle for enhanced thermal conductivity. It features an external invisible integrated magnetic ring for stronger magnetism. Tear off the protective sticker. The glue is reusable.
- Carefully attach the heat sink plate to the back of your mobile phone, ensuring a seamless and tight fit. The strong adhesive ensures it stays in place without falling off.
Image: The heat sink plate showing strong adhesion to a phone.
Image: Magnetic disk with silicone protection, ensuring no harm to the phone.
4. Operating Instructions
This heat sink plate is designed to be used in conjunction with a separate mobile phone radiator (back-clip or magnetic type) to achieve optimal cooling.
- Once the heat sink plate is securely attached to your mobile phone, attach your compatible back-clip or magnetic radiator over the heat sink plate.
- Connect the radiator to a power source via its USB port (if applicable).
- Turn on the power switch of your radiator to initiate the cooling process. The heat sink plate will efficiently transfer heat from your phone to the radiator for rapid dissipation.
Image: Composite soaking plate accelerating heat dissipation when used with a radiator.
5. Precautions and Maintenance
5.1. General Precautions
- Intended Use: This product is designed for mobile phone use only. Do not use it with other devices.
- Ventilation: Ensure adequate ventilation around your mobile phone and radiator during operation to prevent overheating.
- Storage: Unplug the power cord of your radiator when not in use for extended periods.
5.2. Cleaning and Care
- For Type 2 and Type 3 plates with water-washed glue, if the adhesive loses its stickiness, gently wash the glue surface with water and let it air dry. This will restore its adhesive properties for repeated use.
- Wipe the surface of the heat sink plate with a soft, dry cloth to remove dust or smudges. Avoid using harsh chemicals or abrasive materials.
6. Troubleshooting
- Cooler not operating:
- Check whether the power connection to your radiator is secure and that the radiator itself is switched on.
- Insufficient airflow (from radiator):
- If your radiator has adjustable speeds, try switching to a higher speed setting. Ensure no obstructions are blocking the radiator's fan or vents.
- Excessive noise (from radiator):
- Excessive noise from the radiator may be caused by excessive dust accumulation inside. Refer to your radiator's manual for cleaning instructions or contact its manufacturer for assistance.
7. Specifications
| Feature | Detail |
|---|---|
| Product Name | Mobile Phone Cooler Heat Sink (Soaking Plate) |
| Brand | MEMO |
| Product Function | Expand the Cooling Area, Accelerate Heat Dissipation |
| Applicable Products | Smart Phones (for use with back-clip or magnetic radiators) |
| Product Material | Metal |
| Product Weight | 20g |
| Product Size | 60mm x 106mm (Thickness: 1mm) |
| Battery | No (Passive component) |
| Certifications | CE, FCC, RoHS, KC |
| Product Types |
|
Image: Product size diagram (60mm x 106mm).
Image: The heat sink plate demonstrating its ultra-thin 1mm profile.
Image: Description of Type-1 heat sink plate, designed for back-clip radiators without magnetic suction.
Image: Description of Type-2 heat sink plate, featuring magnetic suction for both back-clip and magnetic radiators.
Image: Description of Type-3 heat sink plate, an upgraded magnetic version for both back-clip and magnetic radiators with stronger magnetism.
8. User Tips
No specific user tips were available from provided reviews or Q&A content.
9. Warranty and Support
For assistance, please contact customer service. Details regarding specific warranty periods may vary by region and retailer. Please retain your proof of purchase for any warranty claims.
A user manual in PDF format is available for download: User manual (PDF)
