bibikoo HLK-ZW101, HLK-ZW111, HLK-ZW0608, HLK-ZW0623, HLK-ZW0642, HLK-ZW0901, HLK-ZW0905, HLK-ZW0906, HLK-ZW0919

Hi-Link Semiconductor Fingerprint Module Instruction Manual

Models: HLK-ZW101, HLK-ZW111, HLK-ZW0608, HLK-ZW0623, HLK-ZW0642, HLK-ZW0901, HLK-ZW0905, HLK-ZW0906, HLK-ZW0919

Brand: bibikoo

1. Overview

The ZW series fingerprint modules are all-in-one semiconductor fingerprint processing modules. Each module integrates an active semiconductor fingerprint capture sensor and a fingerprint identification processing chip. The fingerprint identification algorithm chip utilizes a high-performance, low-power Riscv core, implementing a 360-degree adaptive self-learning algorithm.

The semiconductor sensor employs active RF acquisition, supporting low-power finger detection and eliminating the need for an external finger touch detection chip. This design ensures high integration, a simplified product structure, and enhanced stability and consistency. Additionally, the modules offer a seven-color light effect, which can be customized according to user requirements for different colors and display modes.

Various models of Hi-Link fingerprint modules
Figure 1: Various models of Hi-Link fingerprint modules, including HLK-ZW101, HLK-ZW111, HLK-ZW0608, HLK-ZW0623, HLK-ZW0642, HLK-ZW0901, HLK-ZW0905, HLK-ZW0906, ZW0919.

2. Specifications

2.1 Performance Parameters

Comparison of specifications for HLK-ZW101 and HLK-ZW111 modules
Figure 2: Comparison of specifications for HLK-ZW101 and HLK-ZW111 modules, including resolution, storage, sensor size, image feature extraction, matching speed, interface, connector, typical voltage/current, active/sleep current, FAR, and FRR.
Performance parameters for HLK-ZW101 and HLK-ZW111 modules
Figure 3: Performance parameters for HLK-ZW101 and HLK-ZW111 modules, including pixel resolution, DPI, chip/module package, comparison speed, start-up time, recording time, FRR, FAR, storage capacity, and pressing times.

2.2 Electrical Parameters

Electrical parameters for the fingerprint module
Figure 4: Electrical parameters for the fingerprint module, including sensor supply voltage, fingerprint supply voltage, operating current, static power consumption, operating temperature, operating humidity, storage temperature, storage humidity, ESD non-contact discharge, and ESD contact discharge.

Description of Electrical Parameters:

  • Operating current: The current consumed by the fingerprint module during image acquisition, such as during enrollment or matching processes.
  • Static power consumption: The current consumed when the fingerprint supply voltage is 0V and the sensor supply voltage is 3.3V.

2.3 Comprehensive Model Specifications

Comprehensive specification table for various Hi-Link fingerprint module models
Figure 5: Comprehensive specification table comparing various Hi-Link fingerprint module models (ZW101, ZW111, ZW0608, ZW0623, ZW0642, ZW0901, ZW0906, ZW0922, ZW0919) across parameters like resolution, pixel density, fingerprint standard, responsiveness, interface, power, dimensions, and environmental conditions.

3. Setup and Installation

3.1 Product Appearance and Structural Dimensions

Technical drawing showing top, side, and bottom views of the fingerprint module with detailed dimensions and pin layout
Figure 6: Technical drawing showing top, side, and bottom views of the fingerprint module with detailed dimensions and pin layout.

3.2 Communication Interface Definition

The module uses a standard UART TTL level communication interface. The default baud rate is 57600 bps, with 1 start bit and 1 stop bit, operating at a 3.3V TTL level. The connector type is MX1.0-6P, standing paste.

Refer to the pin definition table below for proper wiring:

Pin definition table for the fingerprint module
Figure 7: Pin definition table for the fingerprint module, detailing V SENSOR, TOUCH OUT, VCC, TX, RX, and GND pins with their respective instructions.
PIN Define Instruction
1 V SENSOR 3.3V touch-powered (requires constant power)
2 TOUCH OUT Wake-up IRQ (true:1, false:0)
3 VCC Fingerprint module VCC
4 TX UART TX (Fingerprint module -> MCU)
5 RX UART RX (MCU -> Fingerprint module)
6 GND GND

4. Operating Instructions

The Hi-Link fingerprint module is designed for integration into various systems requiring biometric authentication. Specific operating procedures will depend on the host system's software implementation. However, the core functions involve fingerprint enrollment and matching.

4.1 Fingerprint Enrollment

  1. Ensure the module is properly powered and connected to your host system via the UART interface.
  2. Initiate the enrollment process through your host system's application or command interface.
  3. Place a finger on the sensor. The module's adaptive self-learning algorithm will capture and process the fingerprint image.
  4. Follow any prompts from your system, which may require lifting and replacing the finger multiple times to capture sufficient data for a robust template.
  5. The module supports a 360-degree adaptive self-learning algorithm, allowing for flexible finger placement during enrollment.
  6. Upon successful enrollment, the fingerprint template will be stored in the module's memory (e.g., 40 pieces for ZW101/ZW111).

4.2 Fingerprint Matching

  1. To verify or identify a fingerprint, place the finger on the sensor.
  2. The module will perform active RF acquisition and low-power finger detection.
  3. The captured fingerprint will be compared against stored templates using the internal algorithm.
  4. The comparison speed is typically very fast (e.g., <0.8s for ZW101/ZW111).
  5. The host system will receive a match/no-match result or an identification ID.

4.3 Light Effect Customization

The module provides a seven-color light effect. Consult the module's SDK or communication protocol documentation for details on how to customize the colors and display modes via the UART interface to suit your application's needs.

5. Maintenance

  • Cleaning: Keep the sensor surface clean and free from dust, dirt, or moisture. Use a soft, lint-free cloth for cleaning. Avoid abrasive materials or harsh chemicals.
  • Environmental Conditions: Operate and store the module within the specified temperature and humidity ranges to ensure optimal performance and longevity. Refer to the electrical parameters table for specific ranges (e.g., Operating Temperature: -20°C to 70°C, Operating Humidity: 40% to 85%RH non-condensing).
  • Power Supply: Ensure a stable and correct power supply (3.3V VCC and V_TOUCH) to prevent damage to the module.
  • Handling: Handle the module with care to avoid physical damage, especially to the sensor surface and connector pins.

6. Troubleshooting

  • Module Not Responding:
    • Check power connections (VCC, GND) and ensure correct voltage.
    • Verify UART connections (TX, RX) and ensure they are not swapped.
    • Confirm the baud rate setting on your host system matches the module's default (57600 bps).
  • Fingerprint Not Recognized/Low Accuracy:
    • Ensure the sensor surface is clean and dry.
    • Make sure the finger is placed firmly and completely on the sensor during enrollment and matching.
    • Re-enroll the fingerprint if issues persist, ensuring good quality captures.
    • Check the False Rejection Rate (FRR) and False Acceptance Rate (FAR) specifications for expected performance.
  • Compatibility Issues:
    • Verify that the module's communication protocol and template format are compatible with your target system or electronic lock.
    • Consult the module's technical documentation or contact support for specific compatibility requirements.

7. User Tips

  • Template Format: If integrating with existing systems, always confirm if the module supports specific template output formats (e.g., ISO 19794-2) to ensure seamless compatibility.
  • System Integration: Before purchasing for a specific application like an electronic lock (e.g., Raybuke h4 Tuya), verify compatibility with the lock's manufacturer or the module's vendor to avoid integration challenges.
  • Development Resources: Utilize the provided SDK and documentation for efficient development and customization of the module's features, including the multi-color LED effects.

8. Warranty and Support

Warranty: This product comes with a 3-year warranty from the date of purchase.

Technical Support: For technical assistance, detailed documentation, or specific inquiries regarding integration and customization, please contact the Shenzhen Hi-Link module Store or your authorized distributor. Provide your product model and any relevant system details when seeking support.

Related Documents - HLK-ZW101, HLK-ZW111, HLK-ZW0608, HLK-ZW0623, HLK-ZW0642, HLK-ZW0901, HLK-ZW0905, HLK-ZW0906, HLK-ZW0919

Preview HLK-TX510-028S Face Recognition Module Mini App User Manual
User manual for the Shenzhen Hi-Link Electronic Co., Ltd. HLK-TX510-028S Face Recognition Module, detailing setup, hardware connections, and usage of the WeChat mini app for device configuration and feature management.
Preview Shenzhen Hi-Link HLK-B30 User Manual: 802.11n+BLE 4.2 Wireless Module
Comprehensive user manual for the Shenzhen Hi-Link HLK-B30, a low-consumption wireless module featuring 802.11n Wi-Fi and Bluetooth 4.2. Covers product description, technical specifications, hardware details, application areas, and testing procedures.
Preview HONOR 9X PRO User Guide: Features, Operations, and Settings
Comprehensive user guide for the HONOR 9X PRO smartphone, covering setup, features, camera, connectivity, security, and system settings. Learn to maximize your device's potential.
Preview HLK-A S-1WR3 & HLK-B LS-1WR3 1W Isolated DC/DC Power Module Datasheet
Datasheet for Hi-link's HLK-A S-1WR3 and HLK-B LS-1WR3 series of 1W, constant voltage input, isolated and unregulated single/dual output DC/DC power modules. Features include high efficiency, wide operating temperature, short circuit protection, and small SIP package. Suitable for various electronic applications requiring isolated power. Includes detailed specifications, application circuits, and considerations.
Preview HLK-LD2451 Serial Communication Protocol
This document details the serial communication protocol for the Hi-Link HLK-LD2451 radar module, essential for secondary development. It covers command structures, data output formats, and configuration methods via TTL serial interface.
Preview HONOR HLK-L41 Quick Start Guide
Get started quickly with your HONOR HLK-L41 smartphone. This guide provides essential setup instructions, device information, and safety precautions.