EBYTE E104-BT55SP CC2340R5 Wireless Module User Manual

1. Introduction

The EBYTE E104-BT55SP is an ultra-small, low-power, and high-performance Wireless System-on-Chip (SoC) module designed for 2.4GHz applications, featuring BLE5.3 Bluetooth connectivity. It integrates the advanced CC2340R5 RF chip from Texas Instruments, making it suitable for a wide range of multi-protocol wireless communication needs in embedded systems and IoT devices. This manual provides essential information for the proper setup, operation, and maintenance of your E104-BT55SP module.

2. Key Features

• Core Technology: Adopts TI CC2340R5 RF chip with a high-performance 48MHz Arm® Cortex®-M0+ core.
• Memory: 512 KB Flash and 36 KB RAM for robust application development.
• Wireless Connectivity: 2.4GHz frequency band with BLE5.3 Bluetooth Low Energy support.
• Multi-Protocol Support: Compatible with Bluetooth®5.3 Low Energy, Zigbee®, Wi-SUN®, SimpleLink™ TI 15.4-stack, Wireless M-Bus, Sub-1GHz, IEEE 802.15.4, Proprietary systems, Sidewalk, and other multiprotocol applications.
• Integrated Antenna: Features an integrated PCB antenna for compact design.
• Compact Size: Ultra-small SMD package with dimensions of 14.5mm x 10.0mm.
• Low Power Consumption: Optimized for energy-efficient operation with low transmit, receive, and standby currents.
• High Performance: Transmitting power up to 8dBm and communication distance up to 170m.
• Robust Design: Equipped with a professional radio frequency shield providing strong anti-electromagnetic interference, anti-static properties, and EMC compatibility.
• Rich Peripherals: Offers UART, I2C, SPI, ADC, DMA, PWM for versatile integration.
• Industrial Grade Components: Built with high-quality components including TI original imported chip, high-precision low-temperature crystal oscillator, and premium capacitive/inductive devices (Murata, TDK, AVX).

3. Specifications

4. Setup and Installation

The E104-BT55SP is an SMD (Surface Mount Device) module designed for integration into custom PCBs. Proper handling and soldering techniques are crucial for reliable operation.

4.1. Hardware Integration

• PCB Design: Ensure your PCB layout follows best practices for RF modules, including proper grounding, impedance matching (50Ω characteristic impedance for RF traces), and power supply decoupling.
• Soldering: The module should be soldered using standard reflow soldering processes. Adhere to the recommended temperature profiles to prevent damage to the module. Manual soldering is not recommended due to the fine pitch and thermal requirements.
• Power Supply: Provide a stable and clean power supply within the specified voltage range. Refer to the detailed datasheet for exact voltage requirements.
• Pin Connections: Connect the module's pins to your host microcontroller or other components as per your application's design. Pay close attention to the pinout diagram in the official user manual for correct connections (e.g., UART for communication, GPIOs for control).

4.2. Software Setup

• Development Environment: Set up your development environment for the TI CC2340R5 chip, typically using TI's Code Composer Studio (CCS) or other compatible IDEs.
• SDK and Libraries: Utilize the provided Software Development Kit (SDK) and relevant libraries for BLE5.3 or other supported protocols to develop your application firmware.
• Firmware Upload: Program the module with your custom firmware using appropriate debugging and programming tools (e.g., JTAG/SWD debugger).

Note: For detailed pinout diagrams, recommended PCB footprints, and soldering profiles, please refer to the official E104-BT55SP User Manual PDF.

5. Operating the Module

Operating the E104-BT55SP module primarily involves programming its integrated CC2340R5 SoC to perform desired wireless communication tasks. The module acts as a powerful, low-power radio and microcontroller for your application.

5.1. Bluetooth Low Energy (BLE) Operation

• BLE Stack: Implement your BLE application using the provided BLE stack within the SDK. This includes configuring advertising, scanning, GATT services, and characteristics.
• Connection Management: Manage BLE connections, including initiating connections, accepting connections, and handling disconnections.
• Data Transfer: Use GATT read/write operations or notifications/indications to transfer data between the module and other BLE devices.

5.2. Other Protocols

For other supported protocols like Zigbee, Wi-SUN, or proprietary systems, refer to the specific protocol stacks and examples provided in the TI SimpleLink™ CC23xx SDK. Each protocol will have its own set of APIs and configuration parameters.

5.3. Peripheral Usage

The CC2340R5 chip offers various peripherals (UART, I2C, SPI, ADC, DMA, PWM) that can be configured and used by your application firmware to interact with external sensors, actuators, or other microcontrollers.

Note: Detailed programming guides, API references, and example code are available in the official SDK and documentation from EBYTE and Texas Instruments.

6. Maintenance

The E104-BT55SP module is designed for long-term, reliable operation with minimal maintenance. However, following these guidelines can help ensure its longevity:

• Environmental Conditions: Operate the module within its specified temperature and humidity ranges. Avoid exposure to extreme temperatures, high humidity, or corrosive environments.
• Cleanliness: Keep the module and surrounding PCB free from dust, dirt, and moisture. If cleaning is necessary, use a soft, dry brush or compressed air. Avoid liquid cleaners.
• Physical Handling: Handle the module with care to prevent physical damage. Avoid excessive mechanical stress or impact.
• Firmware Updates: Periodically check for firmware updates or bug fixes from EBYTE or Texas Instruments to ensure optimal performance and security.

7. Troubleshooting

If you encounter issues with your E104-BT55SP module, consider the following troubleshooting steps:

7.1. No Power/Module Not Responding

• Check Power Supply: Verify that the power supply voltage is within the specified range and is stable. Ensure proper current delivery.
• Check Connections: Inspect all power and ground connections for proper soldering and continuity.
• Reset: Try power cycling the module or asserting the reset pin (if available and connected).

7.2. Communication Issues (BLE/Other Protocols)

• Antenna Placement: Ensure the PCB antenna is not obstructed by metal objects or placed too close to other RF components that could cause interference.
• Firmware Check: Verify that the correct firmware is loaded and that the communication protocol (e.g., BLE advertising, connection parameters) is configured correctly.
• Range: Test communication at closer distances to rule out range limitations or environmental interference.
• Interference: Check for other 2.4GHz devices in the vicinity that might be causing interference.
• Peripheral Configuration: If using UART, I2C, or SPI, ensure baud rates, addresses, and clock speeds are correctly configured on both the module and the host device.

7.3. Development/Programming Problems

• Debugger Connection: Ensure your debugger (e.g., JTAG/SWD) is correctly connected and recognized by your IDE.
• Driver Issues: Verify that all necessary drivers for your debugger and development tools are installed and up to date.
• IDE Configuration: Double-check your IDE project settings, compiler options, and linker scripts.

8. User Tips

• Start with Examples: Begin your development by modifying the provided example projects in the SDK. This helps in understanding the basic functionality and configuration.
• Power Management: Leverage the low-power features of the CC2340R5 chip, such as sleep modes and efficient peripheral usage, to maximize battery life in your applications.
• Antenna Design: While the module has an integrated PCB antenna, ensure your overall product enclosure and PCB layout do not negatively impact its performance. Avoid placing metal directly above or too close to the antenna area.
• Documentation: Always refer to the latest datasheets, application notes, and user manuals from EBYTE and Texas Instruments for the most accurate and up-to-date information.

9. Warranty and Support

For warranty information, technical support, or further assistance with the E104-BT55SP module, please contact EBYTE Official Store directly or visit their official website. Ensure you have your product details and any relevant purchase information ready when seeking support.

10. Additional Resources

For the most comprehensive and detailed technical information, including pin descriptions, electrical characteristics, detailed application circuits, and programming guides, please download the official user manual PDF:

Download E104-BT55SP Official User Manual (PDF)