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MINEWSEMI MS51SF11

MS51SF11 Bluetooth LE Module User Manual

Model: MS51SF11 | Brand: MINEWSEMI

1. Introduction

The MINEWSEMI MS51SF11 is a compact and cost-effective Bluetooth Low Energy (BLE) 5.2 module, powered by the Nordic nRF52833 System-on-Chip (SoC). Designed for a wide range of Internet of Things (IoT) applications, this module offers robust wireless communication capabilities with support for multiple protocols including Bluetooth-Compatible, Zigbee, and Thread. Its small form factor and low power consumption make it ideal for smart home devices, advanced wearables, and various industrial applications.

Top view of the MS51SF11 Bluetooth LE module
Figure 1: MS51SF11 Bluetooth LE Module

2. Specifications

The MS51SF11 module integrates the nRF52833 SoC, providing a powerful and versatile platform for wireless applications. Key specifications are detailed below:

Feature Description
Model Number MS51SF11
Brand MINEWSEMI
SoC Nordic nRF52833 (Cortex-M4F ARM core, 64MHz)
Flash Memory 512 kB
RAM 128 kB
Communication Methods Bluetooth-Compatible (BLE 5.2), Zigbee, NFC, Thread, ANT
Dimensions (L*W*H) 9.8mm * 8.4mm * 1.6mm
Antenna PCB Antenna (with option for external antenna via ANT pin)
GPIO 20
Sensitivity (RX) -96 dBm
Transmission Power -40 to +8 dBm
Current (TX @ 0dBm) 4.9 mA
Current (RX) 4.6 mA
Compatibility All Compatible
Certifications CE, FCC, RoHS, BQB
Diagram showing the dimensions of the MS51SF11 module: 9.8mm length, 8.4mm width, 1.6mm height.
Figure 2: Module Dimensions
Diagram illustrating CE, FCC, and BQB certifications for the MS51SF11 BLE Module.
Figure 3: MS51SF11 Module Certifications

3. Setup and Installation

Proper installation of the MS51SF11 module is crucial for optimal performance and reliability. Follow these guidelines carefully:

3.1 Mechanical Integration

The module's compact size (9.8mm x 8.4mm x 1.6mm) allows for integration into various designs. Refer to the mechanical drawing for precise dimensions and tolerances.

Mechanical drawing of the MS51SF11 module, showing top, side, and bottom views with detailed dimensions in millimeters and a tolerance of ±0.15.
Figure 4: Mechanical Drawing (Unit: mm, Tolerance: ±0.15)

3.2 Pin Assignment

The module features 20 GPIOs and various other pins for power, ground, and communication interfaces. The pin assignment is critical for correct circuit design.

Top view pin assignment diagram for the MS51SF11 module, labeling pins 1-38 including GND, SWDCLK, SWDIO, P0.xx, VBUS, VDDH.
Figure 5: Pin Assignment (Top View)

Key Pins:

  • ANT: Pin 1, for connecting an external antenna if not using the integrated PCB antenna.
  • GND: Pins 2, 9, 18, 26, 33, 34, 35, 36, 37, 38 for ground connections.
  • SWDCLK, SWDIO: Pins 3 and 28 respectively, for Serial Wire Debug (SWD) interface.
  • P0.xx: General Purpose Input/Output pins (e.g., P0.22, P0.14, P0.05, P0.26, P0.27, P0.07, P0.15, P0.17, P0.18, P0.03, P0.25, P0.01, P0.00, P1.03, P1.02, P1.08, P1.06, P1.05).
  • VBUS: Pin 8, typically for USB power input.
  • VDDH: Pin 11, high voltage supply.

3.3 PCB Design Notes for Antenna Placement

The antenna area of the module should not have a GND plane or metal cross wiring. Components should not be placed nearby. It is best to do hollow or clear area treatment, or place it on the edge of the PCB board. The following examples illustrate recommended and non-recommended antenna placements:

Diagram showing various PCB antenna design notes. It illustrates 'Best', 'Recommended', and 'Acceptable' placements where the antenna area is clear of ground planes and components. It also shows 'Not Recommended' and 'Worst' placements where the antenna is obstructed or has copper underneath.
Figure 6: PCB Antenna Design Notes
  • Best/Recommended: Ensure the antenna area is clear of ground planes and other components. Ideally, the antenna should extend beyond the main PCB edge.
  • Not Recommended/Worst: Avoid placing copper or components directly underneath or too close to the antenna area, as this will significantly degrade performance.

4. Operating Instructions

The MS51SF11 module is designed for integration into various IoT devices. Its operation is primarily determined by the firmware loaded onto the nRF52833 SoC and the application it serves.

4.1 Supported Protocols

The module supports a wide range of wireless communication protocols:

  • Bluetooth Low Energy (BLE 5.2)
  • Zigbee
  • Thread
  • ANT
  • NFC

This multi-protocol support allows for flexible integration into diverse ecosystems, including smart home and lighting applications that utilize mesh network technology.

4.2 Low Power Mode

The module supports various power modes, including a low power mode and a wake-up mode, to optimize battery usage for longer operational life. This feature is particularly beneficial for battery-powered devices.

Diagram illustrating low power mode for extended battery life, showing battery levels decreasing slowly in low power mode compared to normal operation.
Figure 7: Low Power Mode for Longer Use

4.3 Application Examples

The versatility of the MS51SF11 module makes it suitable for numerous applications:

  • Lighting Control: RGB light control, smart lighting systems.
  • Smart Home: Smart door locks, smart home appliances, remote controls.
  • Wearables: Health/Fitness sensor monitor devices, wireless payment enabled devices, pet trackers, medical patches, worker safety devices, elderly health bands.
  • Industrial IoT: Industrial IoT sensors and controllers.
  • Human Interface Devices: Keyboards, mice.
Collage of images showing various applications of the module, including lighting control, car interior furnishing, smart door locks, keyboards, mice, health/fitness devices, wireless payment terminals, industrial IoT sensors, and remote controls.
Figure 8: Diverse Application Scenarios

5. Maintenance and Handling

To ensure the longevity and proper functioning of your MS51SF11 module, observe the following precautions:

  • Electrostatic Discharge (ESD) Protection: Due to the presence of CMOS components, always eliminate static electricity by any method when transporting or working with the module. Use ESD-safe practices.
  • Component Landing: Ensure the landing of components is appropriate to reduce parasitic inductance.
  • Antenna Area: Do not lay copper under the module antenna. This prevents interference with signal radiation and ensures the transmission distance is not adversely affected.
  • Circuit Isolation: The antenna should be kept away from other circuits to prevent low radiation efficiency and ensure the normal operation of other circuits.
  • Module Placement: The module should be placed at the edge of the circuit board as far as possible from other circuits.
  • Power Supply Isolation: It is recommended to use magnetic beads to isolate the power supply of the module to prevent noise interference.
Image detailing cautions for handling the module, including static electricity, component landing, antenna placement, and power supply isolation.
Figure 9: Handling Cautions

6. Troubleshooting

This section provides guidance on common issues you might encounter with the MS51SF11 module.

Problem Possible Cause Solution
Poor Wireless Range/Connectivity
  • Incorrect antenna placement on PCB.
  • Obstructions or metal near the antenna.
  • Interference from other circuits.
  • Review PCB Design Notes (Figure 6) for optimal antenna placement.
  • Ensure no copper or components are directly under or too close to the antenna.
  • Keep the module's antenna away from other radiating circuits.
Module Not Responding
  • Incorrect power supply.
  • Improper pin connections.
  • Firmware issue.
  • ESD damage.
  • Verify power supply voltage and connections according to pin assignment (Figure 5).
  • Double-check all pin connections for accuracy.
  • Re-flash the module with known good firmware.
  • Ensure proper ESD handling during assembly and operation.
High Power Consumption
  • Module not entering low power mode.
  • Parasitic inductance issues.
  • Ensure firmware correctly implements low power modes.
  • Verify component landing and power supply isolation using magnetic beads.

7. User Tips

  • Development: For development and testing, consider purchasing at least two modules (one for transmitting, one for receiving) to fully evaluate communication capabilities.
  • Datasheet Access: Always refer to the latest datasheet and specifications available on the Minewsemi official website for detailed technical information and programming guides.
  • Technical Support: Minewsemi provides free technical support. Do not hesitate to contact them for assistance with integration or troubleshooting.
  • Certification: The module is CE and FCC certified, ensuring compliance with relevant regulatory standards for wireless devices.

8. Warranty and Support

MINEWSEMI is committed to providing high-quality products and support. For any technical inquiries, assistance with integration, or to access detailed documentation such as datasheets, please visit the official Minewsemi website or contact their technical support team directly.

Minewsemi has passed factory certifications including ISO9001 (quality management), ISO14001 (environmental management), and OAHS18001 (occupational health and safety assessment), ensuring a reliable manufacturing process.