1. Introduction
Thank you for choosing the ESP32-C3F WiFi Bluetooth Module. This manual provides essential information regarding the safety, usage, technical specifications, and maintenance of your module. Please read it carefully before use and keep it for future reference.
2. Safety & Warnings
⚠ WARNING
To reduce the risk of injury, fire, electric shock, or property damage, please read and follow all safety information and instructions before using this product.
- This product is intended for users aged 16 years and above.
- Not suitable for children under 3 years. Small parts may present a choking hazard.
- Keep away from fire, high temperature, water, moisture, and corrosive environments.
- Do not disassemble, modify, or repair the product without authorization.
- Use the product only for its intended purpose. Misuse may cause injury or damage.
- If the product (especially electronic parts) is damaged, overheated, emits smoke, unusual odor, or noise, stop using it immediately and contact customer support.
- Keep packaging materials (plastic bags, foam, etc.) away from children to avoid suffocation risk.
- For indoor use only unless otherwise specified.
3. Product Overview
The ESP32-C3F is a compact and powerful single-core Wi-Fi and Bluetooth 5 (LE) microcontroller System-on-Chip (SoC), built on the open-source RISC-V architecture. It integrates a 32-bit RISC-V single-core processor operating at up to 160 MHz, along with built-in 4MB SPI flash, 400KB SRAM, and 384KB ROM.



Key Features:
- Processor: 32-bit RISC-V single-core, up to 160 MHz.
- Memory: Built-in 4MB SPI flash, 400KB SRAM, 384KB ROM.
- Wireless Connectivity: Wi-Fi (IEEE 802.11b/g/n) and Bluetooth 5 (LE) with mesh support.
- Peripheral Interfaces: GPIO (15), 2xUART, I2C, I2S, SPI, PWM, ADC, USB.
- Operating Temperature: -40℃ to 85℃ (optional -40℃ to 105℃).
4. Setup and Integration
This module is designed for integration into custom electronic projects. Proper setup involves hardware connection and software programming.
4.1 Pinout Diagram
Understanding the pinout is crucial for correct integration. The module features various GPIOs and peripheral interfaces.

4.2 Initial Preparation
- Unpacking: Carefully remove the module from its packaging.
- Power Supply: Connect the module to a stable 3.3V power supply. Ensure correct polarity (VCC and GND).
- Programming Interface: Connect the module to your development board or programmer via the appropriate UART/USB pins (TXD0, RXD0, USB_D+, USB_D-).
5. Operating Instructions
Operating the ESP32-C3F module primarily involves programming its firmware and interacting with its peripherals.
5.1 Power On
Once correctly wired to a power source, the module will power on. For development, typically a reset button or power cycle is used to enter programming mode.
5.2 Programming
The ESP32-C3F can be programmed using various development environments such as ESP-IDF, Arduino IDE, or MicroPython. Refer to the official Espressif documentation and community resources for detailed programming guides.
5.3 Wi-Fi and Bluetooth Functionality
- Wi-Fi: Supports Station mode, SoftAP mode, SoftAP + Station mode, and promiscuous mode. It operates in the 2.4 GHz band with 20 MHz and 40 MHz bandwidth.
- Bluetooth LE: Supports Bluetooth 5 and Bluetooth mesh, with speeds up to 2 Mbps.
These functionalities are controlled via firmware programming.
6. Maintenance & Storage
6.1 Cleaning
- Turn off the device before cleaning.
- Use a soft, lint-free cloth.
- Do not use harsh chemicals or abrasive materials.
6.2 Storage
- Store in a dry place at room temperature (15°C - 35°C).
- Keep away from direct sunlight and moisture.
6.3 Long-term Storage
If not used for a long time, ensure the module is stored in an anti-static bag to prevent damage from electrostatic discharge.
7. Troubleshooting
If you encounter issues with your ESP32-C3F module, consider the following common troubleshooting steps:
- No Power: Verify all power connections (VCC, GND) and ensure the power supply provides the correct voltage (3.3V) and sufficient current.
- Programming Failure: Check your wiring to the programmer/development board (TX/RX, GPIO0 for boot mode, EN/RST). Ensure your development environment is correctly configured and drivers are installed.
- Wi-Fi/Bluetooth Connectivity Issues: Confirm your antenna connection (if external) and check your firmware logic for correct initialization and connection parameters. Ensure there are no conflicting GPIO uses.
- Module Overheating: Disconnect power immediately. Check for short circuits or incorrect voltage application.
For more detailed troubleshooting, consult the official Espressif documentation for the ESP32-C3 series.
8. Technical Specifications
| Feature | Detail |
|---|---|
| Chip | ESP32-C3FH4 |
| Processor | 32-bit RISC-V single-core, up to 160 MHz |
| SPI Flash | 4MB |
| SRAM | 400KB (16KB for cache) |
| ROM | 384KB |
| Wi-Fi Protocol | IEEE 802.11b/g/n |
| Wi-Fi Bandwidth | 20 MHz, 40 MHz in 2.4 GHz band |
| Wi-Fi Data Rate | Up to 150 Mbps (1T1R mode) |
| Bluetooth | Bluetooth 5 (LE), Bluetooth mesh |
| Bluetooth Speed | 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps |
| Peripheral Interfaces | 15x GPIO, 2x UART, I2C, I2S, SPI, PWM, ADC, USB |
| Module Size | 16mm x 24mm x 3mm |
| Working Temperature | -40℃ to 85℃ (optional -40℃ to 105℃) |
| Origin | Mainland China |
9. User Tips
- When integrating the module, always double-check your wiring, especially for power and communication lines, to prevent damage.
- Utilize the extensive online resources and community forums available for ESP32-C3 development, as they can provide valuable code examples and troubleshooting advice.
- For optimal performance in Wi-Fi and Bluetooth applications, consider proper antenna placement and environmental factors.
10. Disposal & Recycling
This symbol indicates that this product should not be treated as household waste.
According to the WEEE Directive (2012/19/EU), it must be disposed of at an appropriate electronic waste collection point for recycling to prevent potential negative consequences for the environment and human health.
Please dispose of packaging materials responsibly. Recycle paper, cardboard, and plastic where facilities exist. Protect our environment. Thank you for your cooperation.
11. Compliance Information
This product complies with the essential requirements of the following EU Directives and Regulations (where applicable):
- General Product Safety Regulation (EU) 2023/988 (GPSR)
- Toy Safety Directive 2009/48/EC (for toys - if applicable)
- EMC Directive 2014/30/EU (for applicable products)
- ROHS Directive 2011/65/EU and (EU) 2015/863
- WEEE Directive 2012/19/EU
- REACH Regulation (EC) No 1907/2006
The CE marking indicates conformity with applicable EU Directives. (Not all products may require CE marking.)
⚠ Disclaimer (California Proposition 65)
Warning: This product contains lead, a chemical known to the State of California to cause cancer and birth defects or other reproductive harm. Wash hands after handling. For more information go to www.P65Warnings.ca.gov/.
12. Warranty & Support
If you encounter any problems such as product damage, missing parts, or require customization or bulk order discounts, please contact us through the following channels:
- Phone/WhatsApp/WeChat: +86 15079814066
- Email/Skype: sales02@flyfuntech.com
We will reply to you as soon as possible.
For a more detailed universal product safety and user manual, you can refer to the PDF document: Universal Product Safety & User Manual (PDF).
Manufacturer Information:
Shenzhen DIY Maker Co., Limited3rd Floor, Building 81, Hekan Industrial Zone,
No. 41 Wuhe South Road, Bantian, Longgang District,
Shenzhen City, Guangdong Province, 518000 China
EU Responsible Person:
Evatmaster Consulting GmbHBettinastr. 30, 60325 Frankfurt am Main
Germany
13. Company Overview
DIYmalls is committed to providing high-quality electronic components and modules. The following video offers a glimpse into our manufacturing processes and facilities, showcasing our dedication to quality and innovation.
Video: Overview of DIYmalls' manufacturing facilities and product range. This video provides general information about the company's capabilities.