ESPRESSIF ESP32-C6-WROOM-1

ESP32-C6-WROOM-1 Module User Manual

Model: ESP32-C6-WROOM-1 / ESP32-C6-WROOM-1U

Brand: ESPRESSIF

1. Introduction

The ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U are powerful, general-purpose Wi-Fi, IEEE 802.15.4, and Bluetooth LE modules. They offer a rich set of peripherals and high performance, making them ideal for various applications including smart home, industrial automation, health care, consumer electronics, and IoT sensor hubs.

The ESP32-C6-WROOM-1 features an on-board PCB antenna, while the ESP32-C6-WROOM-1U comes with a connector for an external antenna. Both modules include an external SPI flash memory of up to 8 MB.

ESP32-C6-WROOM-1 Module Highlights

Figure 1: ESP32-C6-WROOM-1 Module Highlights

2. Key Features

2.1. CPU and On-Chip Memory

  • Embedded Processor: ESP32-C6, 32-bit RISC-V single-core processor, up to 160 MHz.
  • ROM: 320 KB
  • HP SRAM: 512 KB
  • LP SRAM: 16 KB

2.2. Wi-Fi

  • 1T1R in 2.4 GHz band
  • Operating Frequency: 2412 ~ 2484 MHz
  • IEEE 802.11ax compliant
  • 20 MHz-only non-AP mode
  • MCS0 ~ MCS9
  • Downlink and uplink OFDMA
  • MU-MIMO (multi-user, multiple input, multiple output)
  • Beamformee for improved signal quality
  • Channel quality indication (CQI)
  • DCM (dual carrier modulation)
  • Spatial reuse to maximize parallel transmissions
  • Target wake time (TWT) for power saving
  • Fully compatible with IEEE 802.11b/g/n protocol

2.3. Bluetooth

  • Bluetooth LE 5.3 certified
  • Bluetooth mesh
  • High power mode (20 dBm)
  • Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
  • Advertising extensions
  • Multiple advertisement sets
  • Channel selection algorithm #2
  • LE power control

2.4. Integrated Components

  • 40 MHz crystal oscillator
  • SPI flash

2.5. Antenna Options

  • ESP32-C6-WROOM-1: On-board PCB antenna
  • ESP32-C6-WROOM-1U: External antenna via a connector

2.6. Operating Conditions

  • Operating Voltage/Power Supply: 3.0 ~ 3.6 V
  • Operating Ambient Temperature: -40 ~ 85 °C

3. Specifications

3.1. Module Series Comparison

The following table provides a comparison between the ESP32-C6-WROOM-1 (ANT) and ESP32-C6-WROOM-1U (CONN) series modules.

ESP32-C6-WROOM-1 and -1U Series Comparison Table

Figure 2: ESP32-C6-WROOM-1 and -1U Series Comparison

3.2. Electrical Characteristics

Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
TSTOREStorage temperature-4085°C

Recommended Operating Conditions

SymbolParameterMinTypMaxUnit
VDD33Power supply voltage3.03.33.6V
IVDDCurrent delivered by external power supply0.5A
TAOperating ambient temperature-4085°C

DC Characteristics (3.3 V, 25 °C)

Table 13: DC Characteristics (3.3 V, 25 °C)

Figure 3: Table 13: DC Characteristics (3.3 V, 25 °C)

Current Consumption Characteristics

The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.

Current Consumption in Active Mode Tables

Figure 4: Current Consumption for Wi-Fi, Bluetooth LE, and 802.15.4 in Active Mode

Current Consumption in Other Modes Tables

Figure 5: Current Consumption in Modem-sleep and Low-Power Modes

3.3. RF Characteristics

Detailed RF characteristics for Wi-Fi, Bluetooth LE, and 802.15.4 radios are available in the datasheet. This includes TX power, RX sensitivity, maximum RX level, and adjacent channel rejection.

Wi-Fi RF Characteristics Tables

Figure 6: Wi-Fi RF Characteristics (Tables 19, 20, 21)

Wi-Fi RX Sensitivity Table

Figure 7: Wi-Fi RX Sensitivity (Table 22)

Wi-Fi Maximum RX Level and Adjacent Channel Rejection Tables

Figure 8: Wi-Fi Maximum RX Level and Adjacent Channel Rejection (Tables 23, 24)

Bluetooth LE RF Characteristics Tables

Figure 9: Bluetooth LE RF Characteristics (Tables 25, 26)

Bluetooth LE Transmitter and Receiver Characteristics Tables

Figure 10: Bluetooth LE Transmitter and Receiver Characteristics (Tables 27, 28, 29, 30)

Bluetooth LE Receiver Characteristics Table

Figure 11: Bluetooth LE Receiver Characteristics (Table 31)

802.15.4 RF Characteristics and Bluetooth LE Receiver Characteristics Tables

Figure 12: 802.15.4 RF Characteristics and Bluetooth LE Receiver Characteristics (Tables 34, 32, 33)

802.15.4 Transmitter and Receiver Characteristics Tables

Figure 13: 802.15.4 Transmitter and Receiver Characteristics (Tables 35, 36)

4. Pin Definitions

4.1. Pin Layout

The pin diagram below shows the approximate location of pins on the module. The pin diagram is applicable for ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U, but the latter has no keepout zone.

ESP32-C6-WROOM-1 Pin Layout Top View

Figure 14: Pin Layout (Top View)

4.2. Pin Description

The module has 29 pins. For detailed peripheral pin configurations, refer to the ESP32-C6 Series Datasheet.

NameNo.TypeFunction
GND1PGround
3V32PPower supply
EN3IHigh: chip enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO44I/O/TMTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD
IO55I/O/TMTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP
IO66I/O/TMTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK
IO77I/O/TMTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID
IO08I/O/TGPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0
IO19I/O/TGPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1
IO810I/O/TGPIO8
IO1011I/O/TGPIO10
IO1112I/O/TGPIO11, LP_GPIO2, LP_USB_D-
IO1314I/O/TGPIO13, USB_D+
IO915I/O/TGPIO9
IO1816I/O/TGPIO18, SDIO_CMD, FSPICS2
IO1917I/O/TGPIO19, SDIO_CLK, FSPICS3
IO2018I/O/TGPIO20, SDIO_DATA0, FSPICS4
IO2119I/O/TGPIO21, SDIO_DATA1, FSPICS5
IO2220I/O/TGPIO22, SDIO_DATA2
IO2321I/O/TGPIO23, SDIO_DATA3
NO22NC
IO1523I/O/TGPIO15
RXD024I/O/TU0RXD, GPIO17, FSPICS1
TXD025I/O/TU0TXD, GPIO16, FSPICS0
IO326I/O/TGPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3
IO227I/O/TGPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ
GND28PGround
EPAD29PPower supply: I: input; O: output; T: high impedance.

Table 1: Pin Definitions (excerpt from datasheet)

4.3. Strapping Pins

The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive output lines. At each startup or reset, the chip requires some initial configuration parameters, which are set by the strapping pins. These parameters are passed over via the strapping pins. After reset, the strapping pins operate as regular IO pins.

Table 4: Default Configuration of Strapping Pins and Table 5: Description of Timing Parameters for the Strapping Pins

Figure 15: Strapping Pin Configurations and Timing Parameters

4.4. Chip Boot Mode Control

GPIO8 and GPIO9 control the boot mode after the reset is released.

Table 7: Boot Mode Control and Table 8: ROM Messages Printing Control

Figure 16: Boot Mode Control and ROM Messages Printing Control

5. Module Schematics

5.1. Block Diagrams

The block diagrams illustrate the internal architecture of the ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U modules.

ESP32-C6-WROOM-1 and -1U Block Diagrams

Figure 17: ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U Block Diagrams

5.2. Reference Schematics

The following figures provide the reference design schematics for the modules.

ESP32-C6-WROOM-1 Schematics

Figure 18: ESP32-C6-WROOM-1 Schematics

ESP32-C6-WROOM-1U Schematics

Figure 19: ESP32-C6-WROOM-1U Schematics

5.3. Peripheral Schematics

This is a typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface).

Peripheral Schematics

Figure 20: Peripheral Schematics

Note on Soldering: Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion between other pins and the baseboard may be poor.

Note on Power Supply: To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 μF. However, specific parameters should be adjusted based on the power-up timing of the module and the power-up and reset sequence timing of the chip. For ESP32-C6's power-up and reset sequence timing diagram, please refer to ESP32-C6 Series Datasheet > Section Power Supply.

6. Physical Dimensions and PCB Land Pattern

6.1. Physical Dimensions

The following figures show the physical dimensions of the ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U modules.

ESP32-C6-WROOM-1 and -1U Physical Dimensions

Figure 21: ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U Physical Dimensions

6.2. Recommended PCB Land Pattern

This section provides the recommended PCB land patterns for your reference.

ESP32-C6-WROOM-1 Recommended PCB Land Pattern

Figure 22: ESP32-C6-WROOM-1 Recommended PCB Land Pattern

ESP32-C6-WROOM-1U Recommended PCB Land Pattern

Figure 23: ESP32-C6-WROOM-1U Recommended PCB Land Pattern

6.3. Dimensions of External Antenna Connector

The ESP32-C6-WROOM-1U uses the first generation external antenna connector. This connector is compatible with U.FL Series from Hirose, MHF I connector from I-PEX, and AMC connector from Amphenol.

Dimensions of External Antenna Connector

Figure 24: Dimensions of External Antenna Connector

7. Product Handling

7.1. Storage Conditions

The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.

After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and 60%RH. If the above conditions are not met, the module needs to be baked.

7.2. Electrostatic Discharge (ESD)

  • Human body model (HBM): ±2000 V
  • Charged-device model (CDM): ±500 V

7.3. Soldering Profile

Solder the module in a single reflow. The following figure shows the recommended reflow profile.

Reflow Profile Temperature Graph

Figure 25: Reflow Profile

7.4. Ultrasonic Vibration

Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or even failure. As a consequence, the module may stop working or its performance may deteriorate.

8. Setup and Operation

This section provides general guidance for setting up and operating your ESP32-C6-WROOM-1 module. For detailed programming and development, refer to the official Espressif documentation.

8.1. Initial Setup

  1. Power Supply: Connect a stable 3.0 V to 3.6 V power supply to the VDD33 and GND pins. Ensure the power supply can provide up to 0.5 A.
  2. Enable Pin (EN): Pull the EN pin high to enable the chip. Do not leave this pin floating. For stable power-up, consider adding an RC delay circuit as described in the Peripheral Schematics section.
  3. Antenna Connection:
    • ESP32-C6-WROOM-1: Utilizes the on-board PCB antenna. No external connection is needed.
    • ESP32-C6-WROOM-1U: Connect an appropriate external antenna to the U.FL/MHF I/AMC connector.
  4. Programming Interface: Connect a USB-to-serial converter to the UART pins (U0TXD, U0RXD) for flashing firmware and serial communication. Alternatively, use the dedicated JTAG pins for debugging.
  5. Boot Mode: Configure the boot mode using GPIO8 and GPIO9 as per the 'Chip Boot Mode Control' table in the Pin Definitions section.

8.2. Basic Operation

Once powered and configured, the module can be programmed using the Espressif IDF (IoT Development Framework). This framework provides tools and APIs for developing applications that leverage the module's Wi-Fi, Bluetooth LE, Zigbee, and Thread capabilities.

  • Wi-Fi: Configure the module to connect to a 2.4 GHz Wi-Fi 6 (802.11ax) network or operate as a soft-AP.
  • Bluetooth LE: Develop applications for Bluetooth Low Energy communication, including advertising and connecting to other BLE devices.
  • Zigbee/Thread: Utilize the 802.15.4 radio for Zigbee or Thread network applications.
  • GPIOs: Use the 23 available GPIOs for various peripheral interfaces and control.

9. Maintenance

The ESP32-C6-WROOM-1 module is designed for long-term operation with minimal maintenance. However, proper handling and environmental conditions are crucial for its longevity.

  • Environmental Control: Ensure the module operates within the recommended ambient temperature range of -40 °C to 85 °C. Avoid exposure to high humidity or condensing environments.
  • Cleaning: If cleaning is necessary, use a soft, dry cloth. Avoid using harsh chemicals or solvents. Do not expose the module to ultrasonic cleaning.
  • Firmware Updates: Regularly check for official firmware updates from Espressif to ensure optimal performance, security, and access to new features. Follow the Espressif IDF documentation for update procedures.
  • Physical Inspection: Periodically inspect the module for any signs of physical damage, corrosion, or loose connections.

10. Troubleshooting

This section provides general troubleshooting tips for common issues. For more in-depth debugging, refer to the Espressif documentation and community forums.

10.1. Module Not Powering On/Responding

  • Check Power Supply: Verify that the VDD33 pin receives a stable 3.0 V to 3.6 V and GND is properly connected.
  • EN Pin State: Ensure the EN pin is pulled high. If it's floating or low, the chip will be powered off.
  • Short Circuits: Inspect the PCB for any accidental short circuits, especially around the module pins.
  • Soldering Issues: Check solder joints for cold joints or bridges.

10.2. Wi-Fi/Bluetooth/802.15.4 Connectivity Issues

  • Antenna Connection: For ESP32-C6-WROOM-1U, ensure the external antenna is correctly connected and suitable for the 2.4 GHz band.
  • RF Interference: Check for potential sources of RF interference in the operating environment.
  • Firmware: Ensure the correct firmware for your application and module variant is flashed.
  • Power Output: Verify that the power supply is sufficient, especially during high-power RF transmissions.

10.3. Programming/Flashing Errors

  • UART Connection: Double-check the TX/RX connections to your USB-to-serial converter.
  • Boot Mode: Ensure the module is in the correct boot mode for flashing (typically by pulling GPIO0 low during reset).
  • Driver Issues: Verify that the correct USB-to-serial drivers are installed on your computer.
  • Software/Toolchain: Ensure your Espressif IDF or other programming tools are correctly installed and configured.

11. User Tips

  • Start with Official Examples: When beginning development, utilize the extensive examples provided within the Espressif IDF to quickly understand module functionalities.
  • Consult Datasheet: For any in-depth technical details, always refer to the official ESP32-C6 Series Datasheet and Technical Reference Manual.
  • Community Support: The Espressif community forums (esp32.com) are a valuable resource for troubleshooting and sharing knowledge.
  • Power Supply Stability: Always use a stable and adequately rated power supply to prevent unexpected behavior or damage to the module.

12. Warranty and Support

For detailed warranty information, please refer to the terms and conditions provided by your point of purchase or the official Espressif website. This manual provides general operational guidelines and does not constitute a warranty statement.

12.1. Related Documentation and Resources

Espressif provides comprehensive documentation and resources for their products. It is highly recommended to consult these for detailed technical information, development guides, and support.

12.2. Developer Zone

12.3. Product Information

12.4. Contact Us

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