S925D, S925D2, S910, S915 S925D, S925D2, S910, S915

Instruction Manual: S925D, S925D2, S910, S915 Intermediate Frequency (IF) IC Chips

For Samsung J200, J120F, J710, J730F, G610F, A320, A520, A720, S9, S9+ Smartphones

Introduction

This manual provides essential information for the proper handling, installation, and maintenance of S925D, S925D2, S910, and S915 Intermediate Frequency (IF) IC chips. These high-precision BGA components are designed for use in various Samsung smartphone models. Due to the delicate nature of these chips and the complexity of their installation, professional expertise is highly recommended.

Image showing S915 and S925D2 IC chips with their ball grid array (BGA) underside.
S915 and S925D2 Intermediate Frequency (IF) IC Chips

Setup and Installation

Installing BGA (Ball Grid Array) IC chips requires specialized tools, a controlled environment, and proficient skills. Please read the following instructions carefully before attempting installation.

Important Pre-Installation Considerations:

  • Humidity Control: For small quantities of chips, exposure to air after unpackaging can lead to humidity absorption. To prevent quality issues, it is highly recommended to bake the chips in a baking chamber for at least 24 hours at 100°-110°C (212°-230°F) before use.
  • Temperature for Soldering:
    • Lead-Free/No Pb BGA chips: Ensure the temperature is 245°-260°C (Maximum).
    • Leaded/Pb BGA chips: Ensure the temperature is 180°-205°C (Maximum).
  • Professional Installation: The soldering process is complicated. Soldering or replacing chips must be operated by engineers who have proficient skills. BGA chips are fragile, complicatedly structured, with numerous balls. Any slightly faulty positioning, careless temperature control, or incomplete cleaning of PCB boards will result in insufficient soldering or missing soldering, which can cause the chips to fail.
  • Anti-Static Precautions: Always handle IC chips in an anti-static environment to prevent damage from electrostatic discharge (ESD). Use anti-static mats, wrist straps, and tools.
  • Cleanliness: Ensure the work area, PCB, and tools are meticulously clean and free from dust, debris, or contaminants.
Warm prompt for BGA chip handling and soldering temperatures.
Critical instructions for handling and soldering BGA chips.

Operating Principles

Once correctly installed, the Intermediate Frequency (IF) IC chip functions as a critical component within the smartphone's radio frequency (RF) section. It processes the intermediate frequency signals, which are essential for cellular communication, Wi-Fi, and other wireless functionalities. The chip operates automatically as part of the device's internal circuitry and does not require direct user interaction.

Maintenance and Storage

These IC chips are internal components and do not require routine maintenance after installation. However, proper handling and storage before installation are crucial:

  • Storage: Store chips in their original anti-static packaging in a cool, dry, and humidity-controlled environment. Avoid extreme temperatures and direct sunlight.
  • Handling: Always use anti-static precautions when handling the chips. Avoid touching the BGA pads directly. Prevent physical shock or bending, as this can damage the delicate internal structure or the solder balls.

Troubleshooting

If the device experiences issues after an IC chip replacement, consider the following common troubleshooting steps:

  • No Functionality/Intermittent Signal: This often indicates an issue with the soldering. Re-check all solder joints for proper connection and ensure no bridges or cold joints are present. Verify that the correct soldering temperature profile was used.
  • Device Not Powering On: While less common for an IF IC, severe short circuits during installation could prevent the device from powering on. Inspect the surrounding components and the chip for any visible damage or misplaced solder.
  • Incorrect Chip Type: Double-check that the installed chip model (S925D, S925D2, S910, or S915) is the correct one for the specific Samsung device model being repaired.
  • Humidity Damage: If the chip was not baked before installation and exposed to high humidity, internal damage might have occurred, leading to malfunction.
  • Physical Damage: Inspect the chip and the PCB for any signs of physical damage that might have occurred during handling or installation.

Given the complexity, if issues persist, it is strongly recommended to consult with an experienced micro-soldering technician.

Specifications

FeatureDetail
Product TypeIntermediate Frequency (IF) IC Chip
ModelsS925D, S925D2, S910, S915
CompatibilitySamsung J200, J120F, J710, J730F, G610F, A320, A520, A720, S9, S9+
CertificationCE
Package Dimensions (approx.)10 cm (Length) x 8 cm (Width) x 1 cm (Height)
Package Weight (approx.)0.02 kg

Warranty and Support

Please note the following regarding warranty and support for these IC chips:

  • Installation Warranty: IC chip products are sold without an installation warranty. This is due to the high precision required for installation and the potential for damage during the soldering process.
  • Quality Guarantee: We are committed to a 100% quality guarantee for unpacked goods. If you find quality problems with the product upon receipt and before installation, please contact us immediately for a refund or resolution.
After-sales service details including product quality guarantee and no installation warranty for IC chips.
After-sales service details and warranty information.

Contact Information:

For any questions or support, you can contact us via the following methods:

  • Email: lxc15999612225@163.com
  • WhatsApp: (Refer to image for QR code)
  • WeChat: (Refer to image for QR code)
QR codes for WhatsApp and WeChat, and an email address for contact.
Contact information for support.

User Tips

  • Seek Professional Help: If you are not experienced in micro-soldering or BGA rework, it is highly advisable to have these chips installed by a qualified technician. Improper installation can permanently damage both the chip and the device.
  • Verify Compatibility: Always confirm the exact model of the IC chip required for your specific Samsung device before purchase and installation.
  • Test Before Final Assembly: If possible, perform preliminary tests after soldering the chip to ensure basic functionality before fully reassembling the device.

Frequently Asked Questions (FAQ)

Q: What is an Intermediate Frequency (IF) IC chip?
A: An IF IC chip is a crucial component in a smartphone's radio frequency (RF) section, responsible for processing signals at an intermediate frequency to enable wireless communication functions like cellular, Wi-Fi, and Bluetooth.
Q: Can I install this chip myself?
A: Installation of BGA IC chips requires advanced micro-soldering skills, specialized equipment, and a controlled environment. It is strongly recommended that only experienced professionals attempt this repair to avoid damaging the chip or the device.
Q: How do I know which chip model to choose?
A: You must identify the exact model number of the faulty IF IC chip in your device. The compatible models listed (S925D, S925D2, S910, S915) are specific and not interchangeable across all Samsung devices.
Q: What should I do if the chip doesn't work after installation?
A: First, re-verify all installation steps, especially soldering temperatures and joint quality. Ensure the chip was handled with anti-static precautions and baked if exposed to humidity. If issues persist, consult a professional micro-soldering technician.

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