Ushine UP100 LoRaWAN Gateway Module User Manual

 

UP100 LoRaWAN Gateway Module users manual

Introduction

UP100 is a LoRaWAN Gateway Module with mini-PCIe form factor based on Semtech SX1303 and SX1261 for Listen Before Talk feature, which enables easy integration into an existing router or other network equipment with LPWAN Gateway capabilities. It can be used in any embedded platform offering a free mini-PCIe slot with USB/SPI connection. Furthermore, ZOE-M8Q GPS chip is integrated onboard.
This module is an complete and cost-efficient gateway solution offering up to 10 programmable parallel demodulation paths, 8 x 8 channel LoRa packet detectors, 8 x SF5-SF12 LoRa demodulators, and 8 x SF5-SF10 LoRa demodulators. It is capable of detecting an uninterrupted combination of pockets at 8 different spreading factors and 10 channels with continuous demodulation of up to 16 packets. This product is best for smart metering fixed networks and internet-of-Things (IoT) applications.

Features

  • Designed based on mini-PCIe form factor
  • Tx power up to 20.91dBm @SF12, BW 500KHz
  • Supports global license-free frequency band (US915, AS923, AU915, KR920)
  • Supports optional USB/SPI interfaces
  • Listen Before Talk
  • Fine Timestamp

Board Overview

UP100 is a compact LoRaWAN Gateway Module, making it suitable for integration in systems where mass and size constraints are essential. It has been designed with the mini-PCIe form factor, so it can easily become a part of products that comply with the standard, where they allow for cards with a thickness of at least 5.2mm.
The board has two UFL interfaces for the LoRa and GNSS antennas and a standard 52 pin connector (mini-PCIe).

Block Diagram

The UP100 LoRaWAN gateway module is equipped with one SX1303 chip and two SX1250s. The first chip is utilized for the RF signal and the core of the device, while the latter provides the related LoRa modem and processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and one UFL connectors are available for external antenna integration.


                         Figure 2: Block Diagram

Hardware

The hardware is categorized into several parts. It discusses the interfacing, pinouts, and its corresponding functions and diagrams. It also covers the parameters and standard values of the board.

Interfaces

  • SPI Interface – SPI interface mainly provides for the HOST_SCK, HOST_MISO, HOST_MOSI, HOST_CSN pins of the system connector. The SPI interface gives access to the configuration register of SX1303 via a synchronous full-duplex protocol. Only the slave side is implemented.
  • USB Interface – The USB interface mainly provides for the USB_D+, USB_D- pins of the system connector. The USB interface gives the access the configuration register of SX1303 via an MCU STM32L412. Only the slave side is implemented.
  • UART and I2C interface – UP100 integrates a ZOE-M8Q GPS module which has UART and I2C interface. The PINs on the golden finger provide a UART connection and an I2C connection, which allows direct access to the GPS module. The PPS signal is not only connected to SX1303 internally but also connected to the golden finger which can be used by the host board.
  • GPS_PPS – UP100 includes the PPS input for received packets time-stamped and Fine Timestamp.
  • RESET – UP100 SPI card includes the RESET active-high input signal to reset the radio operations as specified by the SX1303 Specification. UP100 USB card’s RESET is controlled by MCU.
  • Antenna RF Interface – The module have one RF interface over a standard UFL connector with a characteristic impedance of 50Ω. The RF port supports both Tx and Rx, providing the antenna interface.

Pinout Diagram


                                  Figure 3: Pinout Diagram

Pinout Description

TypeDescription
IOBidirectional
DIDigital input
DODigital output
OCOpen collector
ODOpen drain
PIPower input
POPower output
NCNo connection

 

Pin No.UP100TypeDescriptionRemarks
1SX1261_BUSYDONo connection by defaultReserved for future

applications

23V3PI3.3V DC supply 
3SX1261_DIO1IONo connection by defaultReserved for future

applications

4GND Ground  
5SX1261_DIO2IONo connection by defaultReserved for future

applications

6GPIO(6)IONo connection by defaultConnect to the SX1302’s

GPIO(6)

7SX1261_NSSDINo connection by defaultReserved for future

applications

8NC No connection 
9GND Ground 
10NC No connection 
11SX1261_NRESETDINo connection by defaultReserved for future

applications

12NC No connection 
13MCU_NRESETDIRESET signal for MCU of

UP100-US915U

Active low
14NC No connection 
15GND Ground 
16NC No connection 
17NC No connection 
18GND Ground 
19PPSDOTime pulse outputLeave open if not in use
20NC No connection 
21GND Ground 
22SX1303_RESETDISX1303_RESETActive high, ≥100ns for

SX1302 reset

23RESET_GPSDIGSP module ZOE-M8Q

reset input

Active low, leave open if

not in use

243V3PI3.3V DC supply 
25STANDBY_GPSDIGPS module ZOE-M8Q

external interrupt input

Active low, leave open if

not in use

26GND Ground 
27GND Ground 
28GPIO(8) Connect to the SX1303’s

GPIO(8)

 
29GND Ground 
30I2C_CLKIOHOST CLKConnect to GPS module ZOE-M8Q’s SCL

internally, leave open if

not in use

31UART_TXDIHOST UART_TXConnect to GPS module ZOE-M8Q’s UART_RX

internally, leave open if

not in use

32I2C_DATAIOHOST DATAConnect to GPS module ZOE-M8Q’s SDA

internally, leave open if

not in use

33UART_RXDOHOST UART_RXConnect to GPS module
    ZOE-M8Q’s UART_TX

internally, leave open if

not in use

 
34GND Ground 
35GND Ground 
36USB_DMIOUSB differential data (-)Require differential

impedance of 90Ω

37GND Ground 
38USB_DPIOUSB differential data (+)Require differential

impedance of 90Ω

393V3PI3.3V DC supply 
40GND Ground 
413V3PI3.3V DC supply 
42NC No connection 
43GND Ground 
44NC No connection 
45HOST_SCKIOHost SPI SCK 
46NC No connection 
47HOST_MISOIOHost SPI MISO 
48NC No connection 
49HOST_MOSIIOHost SPI MOSI 
50GND Ground 
51HOST_CSNIOHost SPI CSN 
523V3PI3.3V DC supply 

Operating Frequencies

The board supports the following LoRaWAN frequency channels, allowing easy configuration while building the firmware from the source code.

RegionFrequency (MHz)
North AmericaUS915
AsiaAS923
AustraliaAU915
KoreaKR920

RF Characteristics

The following table gives typically sensitivity level of the UP100 concentrator module.

Signal bandwidth (KHz)Spreading factorSensitivity (dBm)
12512-139
1257-125
2507-123
50012-134
5007-120

Electrical Requirements

Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating section may cause permanent damage. These are stress ratings only. Operating the module at these or any conditions other than those specified in the Operating Conditions sections of the specification should be avoided. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

The operating condition range defines those limits within which the functionality of the device is guaranteed. Where application information is given, it is advisory only and does not form part of the specification.

Absolute Maximum Rating

The limiting values given below are following the Absolute Maximum Rating System (IEC 134).

SymbolDescriptionConditionMinMax
3V3Module supply voltageInput DC voltage at 3V3 pins-0.3V3.6V
USBUSB D+/D- pinsInput DC voltage at USB interface

pins

 3.6V
RESETUP100 reset pinInput DC voltage at RESET input pin-0.3V3.6V
SPISPI interfaceInput DC voltage at SPI interface pin-0.3V3.6V 
GPS_PPSGPS PPS inputInput DC voltage at GPS_PPS input pin-0.3V3.6V
Pho_ANTAntenna ruggednessOutput RF load mismatch

ruggedness at ANT1

 10:1

VSWR

TstgStorage temperature -40 °C85 °C

WARNING:

The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes exceeding the power supply voltage specification, given in table above, must be limited to values within the specified boundaries by using appropriate protection devices

Maximum ESD

ParameterMinTypicalMaxRemarks
ESD_HBM  1000VCharged Device Model JESD22-C101 CLASS III
ESD_CDM  1000VCharged Device Model JESD22-C101 CLASS III

NOTE:

Although this module is designed to be as robust as possible, electrostatic discharge (ESD) can damage this module. This module must be protected at all times from ESD when handling or transporting. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD handling precautions should be used at all times.

Power Consumption

ModeConditionMinTypicalMax
Active mode (TX)The power of the TX channel is 20 dBm and

3.3V supply.

511mA512mA513mA
Active mode (RX)TX disabled and RX enabled70mA81.6mA101mA

Power Supply Range

Input voltage at 3V3 must be above the normal operating range minimum limit to switch on the module.

SymbolParameterMinTypicalMax
3V3Module supply operating input voltage3V3.3V3.6V

Mechanical Characteristics

The board weighs 8.5 grams, it is 30 mm wide and 50.95 mm tall. The dimensions of the module fall completely within the PCI Express Mini Card Electromechanical Specification, except for the card’s thickness (maximum 5.2 mm at its thickest).

Operating Conditions

ParameterMinTypicalMaxRemarks
Normal operating Temperature-40 °C+25 °C+85 °CNormal operating temperature range (fully functional and meet 3GPP specifications)

NOTE:

Unless otherwise indicated, all operating condition specifications are at an ambient temperature of 25°C. Operation beyond the operating conditions is not recommended and extended exposure beyond them may affect device reliability.

Schematic Diagram

UP100 gateway module refers to Semtech’s reference design for SX1303. The SPI interface can be used on the mini-PCIe connector. The next figure shows the minimum application schematic of the UP100. You should use at least 3.3V/1A DC power, connect the SPI interface to the main processor.

                     Figure 5: Schematic Diagram

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:

  • Reorient or relocate the receiving
  • Increase the separation between the equipment and
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is
  • Consult the dealer or an experienced radio/TV technician for

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

  • The antenna must be installed such that 20 cm is maintained between the antenna and users, and
  • The transmitter module may not be co-located with any other transmitter or antenna.
  • Module approval valid only when the module is installed in the tested host or compatible series of host

As long as 3 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID:

Manual Information To the End User

2A5CK-UP100”. The grantee’s FCC ID can be used only when all FCC compliance requirements are met.
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

 

Read More About This Manual & Download PDF:

Documents / Resources

Ushine UP100 LoRaWAN Gateway Module [pdf] User Manual
UP100, 2A5CK-UP100, 2A5CKUP100, UP100 LoRaWAN Gateway Module, UP100, LoRaWAN Gateway Module

References

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