Material Declaration Form

STMicroelectronics

General Information

IPC 1752 Form type* Distribute Sectionals* Material information Version 2 Subsectionals* A-D
Manufacturing information [required]

Supplier Information

Company name* STMicroelectronics Response Date* 2025-08-25
Contact name* Refer to Supplier Comment section Contact email* Refer to Supplier Comment section
Contact phone* Refer to Supplier Comment section Representative title MDRFMaterial Declaration champion
Authorized representative* MDRF CHAMPION Representative email* Refer to Supplier Comment section
Representative phone* Refer to Supplier Comment section

Supplier comment: Online Technical Support - STMicroelectronics

Uncertainty Statement

While STMicroelectronics has endeavored to provide information which is accurate and up to date, this document and its contents are provided on a strict 'as is' and 'as available' basis. STMicroelectronics disclaims all warranties, express or implied related to this document and its contents, including but not limited to implied warranties of completeness, truth, accuracy, merchantability, fitness for a particular purpose and non-infringement. ST shall have no responsibility and assumes no liability for any cost, loss or damage of any kind which could arise, directly or indirectly, from the use or inability to use this document and/or its contents.

Product Details

Mfr item number STM32G473CET3 Mfr item name 685B*469XXXX Version A Manufacturing site 998Z date 2025-08-25
Amount 178 Unit of measure mg Unit type Each ST ECOPACK grade ECOPACK® 2

Manufacturing Information

J-STD-020 MSL rating 3 Classification temperature 260 Number of reflow cycles 3
Bulk solder termination Tin (Sn), matte Terminal plating Copper Alloy Terminal base alloy 0
Not Applicable Package designator QFP Package size 7x7 Number of instances 48 Shape Gull wing
Comment Package: 5B LQFP 48 7x7x1.4 1 0110596

Compliance Declarations

RoHS Directive 2011/65/EU - 8 June 2011 - Annex II amended by Delegated Directive 2015/863 - 31 March 2015

1 - Product(s) meets EU RoHS requirement without any exemptions

2 - Product(s) meets EU RoHS requirements except lead in solder and this usage may qualify under the lead in solder '7b' exemption (other selected exemptions may apply)

3 - Product(s) meets EU RoHS requirements by application of the selected exemption(s)

4 - Product(s) does not meet EU RoHS requirements and is not under exemptions

Exemption Id. Description Response
true
false
false
false

REACH - 25th June 2025

1 - Product(s) does not contain REACH Substances Of Very High Concern above the limits per the definition within REACH

CategoryLevel_Name CategoryLevel_Threshold amount in product (mg) Application ppm in product Response
#N/A true

Material Composition Declaration

Note: Substance present with less 0.001mg will not be declared in this document.

Homogeneous material Material group Mass Unit of measure Level Substance category Substance CAS Exempt Mass Unit of measure Concentration in homogeneous material (ppm) Concentration in product (ppm)
Die or dies M-011 Other inorganic materials 15.274 mg supplier die Silicon (Si) 7440-21-3 13.926 mg 911738 44915
supplier metallization Aluminium (Al) 7429-90-5 0.062 mg 4032 199
supplier metallization Copper (Cu) 7440-50-8 0.575 mg 37634 1854
supplier metallization Tantalum (Ta) 7440-25-7 0.185 mg 12097 596
supplier metallization Titanium (Ti) 7440-32-6 0.007 mg 448 22
supplier metallization Tungsten (W) 7440-33-7 0.007 mg 448 22
supplier Passivation Silicon Nitride 12033-89-5 0.144 mg 9409 464
supplier Passivation Silicon Oxide 7631-86-9 0.370 mg 24194 1192
Glue epoxy (EN4900GC) Other Organic Materials 0.883 mg supplier Organic Compounds Acrylic resin Proprietary 0.062 mg 70000 199
supplier Organic Compounds Polybutadiene derivative Proprietary 0.018 mg 20000 57
supplier Organic Compounds Butadiene copolymer Proprietary 0.013 mg 15000 43
supplier Organic Compounds Acrylate Proprietary 0.048 mg 54000 154
supplier Organic Compounds Epoxy resin Proprietary 0.026 mg 30000 85
supplier Organic Compounds Peroxide Proprietary 0.007 mg 8000 23
supplier Organic Compounds Additive Proprietary 0.016 mg 18000 51
supplier Metals Silver 7440-22-4 0.693 mg 785000 2233
Encapsulation (EME-G700LAL-A) Other Organic Materials 109.041 mg supplier Organic Compounds Epoxy Resin Proprietary 5.997 mg 55000 35909
supplier Organic Compounds Phenol Resin Proprietary 2.290 mg 21000 13711
supplier Glass Silica(Amorphous)A 60676-86-0 87.233 mg 800000 522308
supplier Glass Silica(Amorphous)B 7631-86-9 12.976 mg 119000 77693
supplier Organic Compounds Carbon Black 1333-86-4 0.545 mg 5000 3264
Bonding Wire (Cu) Bonding Wire 0.305 mg supplier Metals Copper 7440-50-8 0.294 mg 965500 1928
supplier Metals Palladium 7440-05-3 0.009 mg 31000 62
supplier Metals Gold 7440-57-5 0.001 mg 3500 7
Plating anode (Sn) Other inorganic materials 1.078 mg supplier Metals Tin 7440-31-5 1.078 mg 1000000 6067
Leadframe (C194 + Ag) Copper & its alloys 51.000 mg supplier Metals Copper 7440-50-8 49.595 mg 972450 279037
supplier Metals Iron 7439-89-6 1.153 mg 22600 6485
supplier Metals Zinc 7440-66-6 0.077 mg 1500 430
supplier Metals Phophorus 7723-14-0 0.015 mg 300 86
supplier Metals Siliver 7440-22-4 0.158 mg 3100 890
SVHC Metals Lead 7439-92-1 0.003 mg 50 14
v1 Microsoft Excel for Microsoft 365

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