MOVON TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module

MOVON TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module

Product Specification

ItemWi-Fi6 and Bluetooth 5.x SOM
CustomerBIXOLON
ModelWBT-MSB
Version2.0
Date2023. 12. 08

Revision History

RevisionDateChangesWritten by
Rev1.012/26/2022First Release (EVT)Yanim SON
Rev2.012/08/20232nd Release (DVT)Yanim SON

Reference document

NXP 88W9098 (Concurrent Dual Wi-Fi (CDW) and Bluetooth 5.3 Combo SoC) – Data sheet
NXP 88W9098_UM11471_Design Guide for 88Q9098 and 88W9098
SD-WLAN-UART-BT-9098-LNX_5_15_71-IMX8-17.92.1.p136.13-17.92.1.p136.13-MM
88W9098_A1_RF_Performance_Report_WLAN
88W9098_A1_RF_Performance_Report_BT_BLE

Product description

The module is that the System on Module (SOM) designed according as the BIXOLON board to board specification for use with Wi-Fi6/Bluetooth 5.3 networks that provides IEEE 802.11a/b/g/n/ac/ax and

Bluetooth SIG 5.x mobile connectivity. This module is applicable to dedicated to BIXOLON POS, KIOSK and other potable device.

The purpose of this document is to describe the Wi-Fi/Bluetooth features and specifications of the SOM and to provide BIXOLON with the information required to integrate them into products.

So, in this document, only the specifications related to Wi-Fi and Bluetooth are specified, and specification related the host part (SAM9x60D1G, NAND Flash and MFI) is excluded.

But a block diagram, pin maps and power distribution network of whole SOM including SAM9x60D5MI/4FB are provided for system integration.

Application and hardware interface requirements are discussed at a high level only; for more detail, see the following chapter

Overview
  • Board to board Wi-Fi6 and Bluetooth 5.x combo system on module (SOM type)
  • Compact size as 40.5mm x 29.8mm x 5.9mm
  • Compliance IEEE 8021.11a/b/g/n/ac/ax standard the module uses DSSS, OFDM, DBPSK, DQPSK and QAM baseband modulation technologies
  • Compliance Bluetooth 5.3 SIG standard
Key Feature

– Wi-Fi

  • Supports Wi-Fi6 dual MACs, independent MACs support true
  • Not support dual band CDW (Only support 1×1 Wi-Fi RF front-end and RF PHY)
  • Supports a 1X1 MISO configuration in both the Wi-Fi 2.4GHZ and 5GHz bands
  • Two independent basebands, each band supporting independent Wi-Fi operation at 2.4GHz and 5GHz
  • 5GHz PHY data rates up to 350Mbps@HE80, 2.4GHz PHY data rates up to 180 Mbps@HE20 Based on TCP/SDIO 3.0
  • Uplink and downlink OFDMA and MU-MISO
  • Supports WPA 3
  • Supports OFDM A up to 1024 QAM and Target Wake Time (TWT)
  • Instantaneous 0-DFS

– Bluetooth

  • Bluetooth 5.3 SIG standard/specifications compliant
  • Supports up to EDR 3Mbps
  • Supports Low Energy 2Mbps and Long Range
  • Up to 16 Bluetooth LE links in the connection mode

– Antenna and Co-existence

  • Integrated two antennas as Wi-Fi and Bluetooth
  • Implements advanced Wi-Fi and Bluetooth coexistence hardware in conjunction with algorithms to optimize collaborative performance
  • Wi-Fi/Bluetooth coexistence protocol support

– Host interface

  •  Supports SDIO 3.0 for Wi-Fi host interface and high-speed UART for Bluetooth host interface
Standard Compliance
  • IEEE 802.11 a/b/g/n/ac/ax
  • Bluetooth V5.3 SIG conformance
Application
  • Dedicated BIXOLON portable devices (POS, fixed printer and portable printer)

Product Specifications

SW Block Diagram

(Software structure is depended on Operating Systems)

Specification Overview
ItemDescription
Hardware
Wi-Fi6 and Bluetooth 5.3 SoC
Wi-Fi6 and Bluetooth SoCNXP 88W9098-A2-NYGC/MPIndependent ARM-based Wi-Fi and Bluetooth CPUs Integrated Buck regulator for core power supply
Separate power block for independent of Wi-Fi/Bluetooth OFDMA 1024QAM and Fully MU-MIMO
Target Wake Time (TWT) WPA3
Bluetooth 5.3
BDR and EDR: 1Mbps, 2Mbps and 3Mbps Bluetooth Low Energy (LE): 1Mbps and 2Mbps Bluetooth Low Energy Long Range
Bluetooth Two wide-bands speech links Up to 16 Bluetooth links
Wi-Fi/Bluetooth coexistence protocol
148-pins 11.0mm x 11.0mm x 0.85mm HVQFN
InterfaceWi-FiSDIO3.0
BluetoothHigh speed UART
GPIOsBT/Wi-Fi RST for each network independent reset BT/Wi-Fi HOST WKU for control Host wakes up or sleep
PDN for control module power turns on or off
Host AP SoC/Memory/Power
Host AP SoCMicrochip SAM9x60D5M-I/4FBARM926EJ-S Arm Thumb processor running up to 600 MHz Integrates with up to 64Mb SDR-SDRAM in package
High Bandwidth Multi-port DDR2/LPDDR Controller 8bit EBI supporting 8bit NAND Flash connected on D16-D23 One USB Device High Speed, three USB Host High Speed with dedicated On-Chip Transceivers
One dual-port 16-channel DMA Controller Two 10/100 Mbps Ethernet Mac Controller Thirteen FLEXCOMs (USART, SPI and TWI)
Up to 112 programmable I/O Lines multiplexed with up to three peripheral I/Os
TFBGA 233-ball 14mmx14mmx1.2mm
Power supplyDC 3.3V, DC 1.8VPlease refer to page.17 in this document for details
MemoryNAND FlashVoltage Supply: 3.3V (2.7V~3.6V)
F59L1GB1A-25BIGMemory Cell Array: (128M + 4M) x 8bit Data Register: (2K + 64) x 8bit Program/Erase Lockout During Power Transitions ECC Requirement: – 1 bit/528 Byte Boot from NAND support Automatic Memory Download BGA 63-ball 9mmx11mmxx1.0mm
MFIMFI343S00177Apple MFI CP3.0 signal communication codec chip
Radio Interface
RF PHY / Front-endWi-Fi and BluetoothSupports concurrent use 1X1 Wi-Fi and Bluetooth as 2 antennas.
Diplexers, bandpass filters, PAMs, LNAs and SPDT switches are assembled for simultaneous use of Wi-Fi and Bluetooth.
Baseband/MACsWi-FiTwo independent direct conversion Wi-Fi radios to support true independent operation in the 2.4 GHz and 5 GHz Bands.
Supports Wi-Fi6 1×1 MU-MISO DL and UL as just 1 spatial stream.
Up to 1×1 802.11ax 80MHz 1024QAM.
BluetoothSupports Bluetooth 5.3
Supports up to Bluetooth power class 1.5
Packet types: 1Mbps (GFSK), 2Mbps(pi/4-DQPSK), 3Mbps (8DPSK).
Fully functional AFH using Packet Error Rate.
System interface
Board to board connectorNL BS05-30C-2.2H30pin, 2.2T B2B socket
System environment
Operating conditionOperating temperature-40°C ~ +85°C
Storage temperature-40°C ~ +85°C
Humidity10~90% Relative/Non-condensing
CertificationAlliance
Appearance
DimensionLength40.5mm±0.1mm
Width29.8mm±0.1mm
Height5.9mm±0.3mm
PackageBoard to Board connection
Software
System SW
OSLinux, Android
ProtocolWi-Fi802.11 a/b/g/n/ac/ax
BluetoothBluetooth 5.3 Classic/BLE
NetworkingWi-Fi2.4Ghz / 5Ghz
BluetoothBR and EDR 1Mbps, 2Mbps and 3Mbps LE 1Mbps/2Mbps, Long Range
Power class 1.5
EncryptionWi-FiAES, TKIP
BluetoothAES
SecurityWi-FiWEP, WPA2, WPA3
BluetoothSecurity Mode 4
ManagementWi-FiStation mode / Access Point mode / P2P (Wi-Fi direct) mode
BluetoothTBD
Supported OS and BrowserLinux, Android
IndicationNot support
OTANone

– Wi-Fi RF performance

Wi-Fi 2.4GHz
ItemFunctional ItemDetailed SpecificationRemark
StandardIEEE802.11b/g/n/ax
Band ClassFrequency range2.401~2.483GHz
Channels1~13ch
Channel BW802.11b/g20MHz
802.11n/ax20MHz/40MHz
RF802.11bModulationDSSS/CCK
Rate11/5.5/2/1MbpsAuto fallback
Max. Sensitivity-84dBmConducted, 11M
Output power16dBmConducted, 11M

@EVM<35%

802.11gModulationOFDM
Rate54/48/36/24/18/12/9/6MbpsAuto fallback
Max. Sensitivity-71dBmConducted, 54M
Output power14dBmConducted, 54M @EVM<-27dB
802.11nModulationOFDM
RateMCS0 ~ MCS7
Max. Sensitivity-68dBmConducted, HT20 MCS7
Output powerHT20: 12dBm
HT40: 12dBm
Conducted, HT20 MCS7 @EVM-28dB
Max. throughput30MbpsHT20 MCS7/DL/AP mode
802.11axModulationOFDM
RateMCS0 ~ MCS9
Max. Sensitivity-55dBmConducted, HE20 MCS11
Output powerHE20: 12dBm

HE40: 10dBm

Conducted, HE40 MCS11 @EVM<-32dB
Max. throughput55MbpsVHT40 MCS9/DL/AP mode
Wi-Fi 5GHz
ItemFunctional ItemDetailed SpecificationRemark
StandardIEEE 802.11a/n/ac/ax
Band ClassFrequency range5.150~5.825GHzSupport all DFS bands
Channels36~165ch
Channel BW802.11a20MHz
802.11n20MHz/40MHz
802.11ac/ax20MHz/40MHz/80MHz
RF802.11aModulationOFDM
Rate54/48/36/24/18/12/9/6MbpsAuto fallback
Max. Sensitivity-68dBmConducted, 54M
Output power14 dBmConducted, 54M

@EVM<-27dB

802.11nModulationOFDM
RateMCS0 ~ MCS7
Max. Sensitivity-65dBmConducted, HT20 MCS7
Output powerHT20: 12dBm
HT40: 12dBm
Conducted, HT20 MCS7 @EVM<-28dB
Max throughput58MbpsHT40 MCS7/DL/AP mode
802.11acModulationOFDM
RateMCS0 ~ MCS9
Max. Sensitivity-63dBmConducted, VHT20 MCS8
Output powerVHT20:12dBm VHT40: 10dBm
VHT80: 5dBm
Conducted, VHT20 MCS8 @EVM<-32dB
Max throughput65MbpsVHT80 MCS9/DL/AP mode
802.11axModulationOFDM
RateMCS0 ~ MCS11
Max. Sensitivity-52dBmConducted, HE20 MCS11
Output powerHE20: 12 dBm HE40: 10dBm
HE80: 5dBm
Conducted, HE20 MCS11 @EVM<-35dB
Max throughput68MbpsHE80 MCS11/DL/AP mode

– Bluetooth RF performance 

ItemFunctional ItemDetailed SpecificationRemark
StandardIEEE802.15.1Up to Bluetooth 5.3
Band ClassFrequency range2.401~2.480GHz
Channels0~78ch
Channel BWLE, LE2M, BDR, EDR2 and EDR3
RFPower class4dBm ~ 10dBm
Typical. 8.0dBm
Conducted, Class 1.5
Transmission Rate / ModulationHeader/GFSK 2Mbps/ㅠ/4-DQPSK
3Mbps/8DPSK
Max Rx. Sensitivity0.001% @ -70dBmConducted
RF SpreadFrequency Hopping Spread Spectrum (FHSS)1600hops/sec, 1MHz channel space
ProfileTBD
Max throughputClassicMax 3Mb/s@ EDR3
LEMax 2Mb/s
Pin Assignment

Pin allocations 

Product Specifications

Pin description 

Pin #Port nameVoltage level and I/OWhen is signal neededDescription
1DGNDDigital GroundAlways
2VCC_3.3VAlwaysPower supply for Host chip
3TXDVCC_1.8VHost UARTFor Host chip UART Transmission interface
4VCC_3.3VAlwaysPower supply for Host chip
5RXDVCC_1.8VHost UARTFor Host chip UART Receive interface
6VCC_3.3VAlwaysPower supply for Host chip
7CTSVCC_1.8VHost UARTFor Host chip UART CTS interface
8DGNDDigital GroundAlways
9DGNDDigital GroundAlways
10WIFI_GREENVCC_1.8VIndicatorWiFi indicator
11EMR_DMVCC_3.3VHost USBFor FW download/host USB data negative
12WIFI_REDVCC_1.8VDebug UARTWiFi indicator
13EMR_DPVCC_3.3VHost USBFor FW download/host USB data negative
14NRESETVCC_1.8VresetFor SW reset
15DGNDDigital GroundAlways
16EMR_DETVCC_1.8VDebug USBFor debugging USB detect
17USBB_DPVCC_3.3VDebug USBFor debugging/RF calibration USB bridge data positive interface
18EMR_SWVCC_3.3VRead/write to NANDTo enable/disable the NAND Flash
19USBB_DMVCC_3.3VDebug USBFor debugging/RF calibration USB bridge data negative interface
20DGNDDigital GroundAlways
21DGNDDigital GroundAlways
22DGNDDigital GroundAlways
231.8V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
243.3V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
251.8V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
263.3V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
271.8V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
283.3V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
291.8V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
303.3V_DUTWi-Fi/BT88W9098 Wi-Fi/BT power supply
Electrical Specification

Power sequence

– Power up sequence

The external 1.8V_DUT and 3.3V_DUT shall not rise (10 – 90%) faster than 40 microseconds for minimize in-rush current and not slower than 100 milliseconds. PDN must be held low for at least 100 milliseconds after external 1.8V_DUT and 3.3V_DUT has reached specification level before pulled high.

ParameterMinTypMaxUnit
Delay from 1.8V_DUT high (at least 90%) to start of 3.3V_DUT ramp-up0ms
Delay from 3.3V_DUT high (at least 90%) to start of AVDD18 ramp-up0100ms
Delay from 1.8V_DUT high (at least 90%) to start of PDN ramp-up0ms
Delay from AVDD 18 high (at least 90%) to start of Boot ROM10ms

Power down sequence

ParameterMinTypMaxUnit
Recommended delay from PDN low (less than 0.2V) to start of AVDD18 ramp-down0ms
Recommended delay from start of AVDD18 ramp-down to start of 3.3V_DUT ramp-down0ms

Reset

Product Specifications

ParameterMinTypMaxUnit
T1Delay from PDN low (at least 0.2V) to time of VDD_CORE_DUT ramp- down1us
T2Delay from PDN low (at least 0.2V) to time of VDD_CORE_DUT high (at least 90%)0us

DC characteristics

– Power Tree

The module utilizes VDD_3.3V, 3.3V_DUT and 1.8V_DUT power sources.
Do not exceed minimum or maximum voltage. Module will be permanently damaged above this limit.

– Electrical characteristics 

ParameterMinimumTypicalMaximumUnit
External Power supply
DC 3.3V_9098Voltage range3.1353.303.465V
* Current consumption1.2A
DC 1.8VVoltage range1.711.801.89V
* Current consumption1.9A
DC 3.3V_HostVoltage range3.03.303.6V
* Current consumption2.0A
Internal PMU output power_88W9098
3.3V_DUTAVDD33 VPA3.1353.303.465
1.8V_DUTVIO VIO_SD VIO_RF AVDD18 DCDC BUCK IN1.711.801.89V
System CoreCore power (Internal Buck out)1.031.051.155V
Internal PMU output power_SAM9x60D1G/MFI343S00/F59L1G81A-25BIG
VCC_3.3VVDDNF VDDSPI VDDANA VDDIOP1 VDDIN33 VDDBU VDDNAND VDDMFI3.03.303.6V
VCC_1.8VIDIOM DDR VDD VDDIO_P01.701.801.90V
VCC_1.15VVDC CORE1.121.151.21V

* The power supply must be designed for this maximum current

Power dashboard according to Wi-Fi/Bluetooth use cases 

ModeConditions3.3V_DUT (Avg)1.8V_DUT (Avg)Unit
Power down
Power down0.030.26mA
Deep sleep
Bluetooth only0.62.1mA
Wi-Fi only0.62.0mA
Wi-Fi + Bluetooth0.42.0mA
Wi-Fi Uplink (1X1 Tx)
2.4GHz 802.11b, 20MHzTx power=16dBm, 11Mbps133.5193.3mA
2.4GHz 802.11g, 20MHzTx power=14dBm, 54Mbps122.9218.3mA
2.4GHz 802.11n, 20MHzTx power=12dBm, MCS7135.2239.3mA
2.4GHz 802.11ax, 20MHzTx power=5dBm, MCS9136.4247.9mA
5GHz 802.11a, 20MHzTx power=14dBm, 54Mbps149.4293.5mA
5GHz 802.11n, 20MHzTx power=12dBm, MCS7187.1316.5mA
5GHz 802.11n, 40MHzTx power=10dBm, MCS7138.5300.2mA
5GHz 802.11ac, 20MHzTx power=10dBm, MCS9190.4306.3mA
5GHz 802.11ac, 40MHzTx power=10dBm, MCS9114.8289.6mA
5GHz 802.11ax, 80MHzTx power=5dBm, MCS1165.1288.8mA
Wi-Fi Downlink (1X1 Rx)
2.4GHz 802.11b, 20MHz11Mbps14.67170.7mA
2.4GHz 802.11ax, 20MHzMCS97.08261.2mA
5GHz 802.11a, 20MHz54Mbps17.17270.4mA
5GHz 802.11ax,MCS1124.91335.8mA
80MHz
Bluetooth LE
LE advertiseInterval=1.28s1.720.3mA
LE scanInterval=1.28s
Window=11.25ms
1.930.3mA
LE linkInterval=1.28s1.980.3mA
LE Peak transmit@ 4dBm, 1Mbps710.56mA
LE Peak receive1Mbps410.56mA
Bluetooth BR/EDR
Idle20.110.56mA
Page scan2.010.3mA
ACL linkMaster sniff mode Interval=500ms2.740.3mA
SCO HV3 peak Tx@ 4dBm710.56mA
SCO HV3 peak Rx380.56mA
Peak Tx@ 4dBm730.56mA
Peak Rx360.56mA
Mechanical Specifications

Product Drawing

Product Specifications

Recommended B2B plug selection guide 

Please refer to dimension in red box of figure below that is recommended plug dimension.

Product Specifications

<B2B socket of module>

Product Specifications

<Recommended B2B Plug>

Regulatory and compliance

FCC Compliance Statement

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

FCC Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to correct the interference by one of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

FCC Radiation Exposure Statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Industry Canada Statement

This device complies with RSS-247 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Industry Canada Radiation Exposure Statement

This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator & your body

Information on test modes and additional testing requirements

a) The modular transmitter has been fully tested by the module grantee on the required number of channels, modulation types and modes, it should not be necessary for the host installer to retest all the available transmitter modes or settings. It is recommended that the host product manufacturer installing the modular transmitter, perform some investigative measurements to confirm that the resulting composite system does not exceed the spurious emissions limits or band edge limits(e.g., where a different antenna may be causing additional emissions).
b) The testing should check for emissions that may occur due to the intermixing of emissions with the other transmitter, digital circuitry, or due to physical properties of the host product(enclosure).
This investigation is especially important when integrating multiple modular transmitters where the certification is based on testing each of them in a standalone configuration. It is important to note that host product manufactures should not assume that because the modular transmitter is certified that they do not have any responsibility for final product compliance.

Additional testing, Part 15 subpart B disclaimer

The final host/module combination need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

The host integrator installing this module into their product must ensure that the final composite product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation and should refer to guidance in KDB 996369.

This appliance and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter.

  • OEM integrators must ensure that its product is electrically identical to the device, FCC ID:
    TDU-WBT-MSB reference designs . Any modifications to module reference designs may invalidate regulatory approvals in relation to the product, or may necessitate notifications to the relevant regulatory authorities.
  • OEM integrators are responsible for regression testing to accommodate changes to designs, new antennas, and host and submit for C2PC filings.
  • Colocation with other transmitter modules will be addressed through filings for those co-located transmitters when necessary or that colocation of other transmitters will be according to applicable KDB guidelines including those for RF exposure
  • Appropriate labels must be affixed to the product that complies with applicable regulations in all respects. The regulatory label on the final system must include the statement:

“Contains FCC ID: TDU-WBT-MSB”.

“Contains IC Number: 6432A-WBTMSB”.

  1. The module is limited to OEM installation ONLY.
  2. OEM integrators are responsible for ensuring that the end-user has no manual instructions to remove or install module.
  3. The module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
  4. Separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations.

End Product Labeling

The module is labeled with its own FCC ID & IC Number. If the FCC ID & IC number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labeled in a visible area with the following:

“Contains FCC ID: TDU-WBT-MSB”
“Contains IC Number: 6432A-WBTMSB”.

Logo

Documents / Resources

MOVON TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module [pdf] User Guide
TDU-WBT-MSB, TDUWBTMSB, wbt msb, TDU-WBT-MSB Wi-Fi 6 and Bluetooth 5.x System Module, Wi-Fi 6 and Bluetooth 5.x System Module, Bluetooth 5.x System Module, 5.x System Module, Module

References

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