DX-LR01-900 Module Technical Manual

Update Record

Contact Information

Company: Shenzhen Daxia Longque Technology Co., Ltd.

Email: Manager@szdx-smart.com

Tel: 0755-2997 8125

Website: http://en.szdx-smart.com/

Address: Room 601, Block A1, Huafeng Zhigu, Hangkong Road, Hangcheng Street, Bao'an District, Shenzhen

1. Module Introduction

1.1. Overview

The DX-LR01-900M is a low-power LoRa module designed for intelligent wireless data transmission by Shenzhen Daxia Longque Technology Co., Ltd. It utilizes the ASR6601 SOC chip, integrating a Sub-1GHz RF transceiver, an Arm China STAR-MC1 microprocessor, built-in Flash storage, and SRAM. This module supports interfaces such as UART, I2C, and I2S, along with IO port control and ADC acquisition. It offers advantages like low power consumption, high performance, long-distance communication, and networking capabilities, making it suitable for various IoT applications including smart meters, smart logistics, smart buildings, smart cities, and smart agriculture.

1.2. Features

• ASR6601 SoC
• Arm China STAR-MC1 architecture
• 32-bit ARM STAR core, maximum frequency 48 MHz
• High power PA with ultra-large output power: +22 dBm
• Maximum receiving sensitivity: -138 dBm
• Supports UART, I2C, I2S, LPUART, SSP, QSPI interfaces
• Supports sleep mode
• External Antenna
• Operating voltage: 3V-3.7V (typical 3.3V)
• Supports operating frequency range: 150-960 MHz
• Open space visible distance up to 8 km (reference only)
• City distance up to 2.9 km (reference only)

1.3. Application

• Smart Meter
• Smart Logistics
• Smart Buildings
• Smart City

1.4. Functional Block Diagram

The DX-LR01-900M module's functional block diagram illustrates its main components: Power supply, Baseband, Memory, RF Part, and Peripheral Interface.

1.5. Basic Parameters

1.6. Transmission Method

• Transparent Transmission: Data is transmitted when the sending and receiving channels are the same.
• Fixed-point Transmission: Data is sent to a specific target address and channel. Data format: target address (2 bytes hex) + target channel (1 byte hex) + data (hex).
• Broadcast Transmission: Data is sent to all receivers on the same target channel. Data format: target channel (1 byte hex) + data (hex).

2. Application Interface

2.1. Module Pin Definition

The module has 30 pins, including GPIO pins, UART TX/RX, RSTN, AUX, GND, VBAT, and ANT.

2.2. Pin Definition

2.3. Power Design

2.3.1. Power Interface

2.3.2. Power Supply Stability Requirements

The DX-LR01-900M operates within a 3V-3.7V range, requiring a stable input voltage of at least 3V. To mitigate voltage drops during RF burst transmissions, it is recommended to use two chip multilayer ceramic capacitors (MLCCs) with excellent ESR performance (100uF and 0.1uF) placed close to the VBAT pin.

2.3.3. RST Reset Pin Description

2.3.4. AUX Module RF Status Indicator Pin Description

• Low level: Module is in receiving idle state or data transmission idle state, ready to send data or waiting for a response.
• High level: Module is accumulating data for receiving or transmitting. Wait for the pin to go low.

2.4. Power Consumption

• Sleep Mode: MCU and RF enter sleep. Wake up via serial port (4 bytes required). Not saved, requires re-entry via instructions.
• Air Wake-up Mode: Module performs CAD detection every 4 seconds. If data is detected, it enters receiving mode, then automatically sleeps. RF sleeps, MCU does not. This mode is saved.
• High-efficiency Mode: Module is always in receiving state. Switches to transmit state upon receiving data from the master control, then returns to receiving state.

2.5. Hardware Physical Interface

2.5.1. General Digital IO Port

The module features 20 general-purpose digital IO ports, configurable for various functions like button control, LED driving, or main controller interrupt signals. Keep unused ports floating.

2.5.2. I2C Interface

The ASR6601 includes an I2C master mode supporting standard (100Kbps) and fast (400Kbps) modes, with multi-master and bus arbitration. SDA is the data line, and SCL is the clock line. The module also supports I2C slave mode with the same speed capabilities. The slave reception is the default mode.

2.5.3. UART Interface

The ASR6601 supports UART and IrDA modes with independent transmit and receive FIFOs. It supports standard asynchronous communication bits (5-8 data bits), parity checks, 1 or 2 stop bits, DMA, false start bit detection, Line Break generation/detection, and hardware flow control. The UART clock frequency must meet specific requirements for baud rate generation.

2.5.4. SSP Interface

The ASR6601 supports an SSP interface in both MASTER and SLAVE modes. It supports multiple frame formats, configurable data width, and output rates up to 16 MHz. It includes 16-bit wide and 8-deep TX/RX FIFOs. Key pins are SSP_NSS (chip select), SSP_CLK (clock), SSP_TX (transmit), and SSP_RX (receive).

2.5.5. LPUART

The ASR6601 includes an LPUART interface, a low-power serial peripheral supporting baud rates up to 9600 at a 32K clock. It supports CTS/RTS flow control and DMA requests. In ultra-low power mode, LPUART can be awakened by received data. Data transmission includes a start bit, data bits, an optional parity bit, and a stop bit.

2.5.6. Analog-to-Digital Converter (ADC)

The ADC is a 12-bit converter supporting 8 external and 7 internal channels. It can sample VBAT/3 and supports a maximum sampling rate of 1 MSPS. It offers single-ended and differential modes, with configurable sampling sequences and modes (continuous, single, non-continuous). It supports software and hardware triggering, DMA, and interrupt requests.

2.6. Reference Connection Circuit

Typical application circuits are provided for connecting the module to an MCU via UART and for serial port level conversion.

3. Electrical Characteristics, RF Characteristics and Reliability

3.1. Maximum Ratings

Exceeding absolute maximum ratings may cause permanent damage. These are stress ratings only; functional operation outside indicated conditions is not implied. Prolonged exposure to maximum rating conditions may affect reliability.

Recommended Operating Conditions

3.2. Electrostatic Protection

ESD protection is crucial due to static electricity. Measures should be taken during R&D, production, and testing. Anti-static protection should be incorporated at interfaces and susceptible points in the circuit design, and anti-static gloves should be worn during production.

4. Mechanical Dimensions and Layout Recommendations

4.1. Module Mechanical Ruler

The module's mechanical dimensions are provided in millimeters, with a general tolerance of ±0.3 mm for dimensions without specified tolerances.

4.2. Recommended Package

Recommended package dimensions and layout for PCB mounting are illustrated.

4.3. Module Top View/Bottom View

Visual representations of the module's top and bottom views are provided for reference.

4.4. Hardware Design Layout Recommendations

To ensure optimal performance of the SUB-G wireless band and external antenna, follow these layout recommendations:

1. Avoid metal enclosures directly surrounding the module. Keep the antenna away from metal parts and internal metal wiring or screws.
2. Position the module antenna near the PCB edge or exposed from the PCB, avoiding the center of the board.
3. Use insulating materials, such as a silk screen layer (TopOverLay), to isolate the module mounting position on the substrate.

5. Storage, Production and Packaging

5.1. Storage Conditions

The module is shipped in a vacuum-sealed bag and has a Moisture Sensitivity Level (MSL) of 3. Recommended storage conditions are 23±5°C and 35-60% relative humidity. Modules stored under these conditions are valid for 12 months. After unpacking, the workshop life is 168 hours under 23±5°C and <60% RH. If these conditions are not met, or for modules requiring pre-baking, refer to the manual for specific procedures to prevent PCB blistering, cracks, and delamination during high-temperature soldering.

5.2. Module Baking Process

If necessary, bake the module at 120±5°C for 8 hours. Modules must be soldered within 24 hours after baking or stored in a drying oven. Handle with ESD protection.

5.3. Reflow

Recommended reflow temperature is 235-250°C, with a maximum not exceeding 250°C. It is advised to mount the module after completing the reflow soldering of the first side of the PCB. A recommended furnace temperature curve and parameters for lead-free SMT reflow soldering are provided.

5.4. Packing Specifications

The DX-LR01-900M modules are packaged in tape and reel, sealed in vacuum bags with desiccant and a humidity card. Each carrier tape is 20 meters long and contains 1000 modules. The reel diameter is 330 mm.

FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

This module has been tested and found to comply with Part 15 requirements for Modular Approval. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01r01

2.2 List of applicable FCC rules

CFR 47 FCC Part 15 Subpart C and Subpart F have been investigated and are applicable to the modular transmitter.

2.3 Specific Operational Use Conditions - Antenna Placement Within the Host Platform

The module is tested for standalone mobile RF exposure use. The antenna must be installed such that 20 cm is maintained between the antenna and users. The transmitter module may not be co-located with any other transmitter or antenna. If these conditions cannot be met, the FCC authorization is no longer valid, and the OEM integrator will be responsible for re-evaluating the end product and obtaining a separate FCC authorization.

2.4 Limited Module Procedures

Not applicable.

2.5 Trace Antenna Designs

Not applicable.

2.6 RF Exposure Considerations

This device complies with FCC radiation exposure limits for an uncontrolled environment. Installation and operation should maintain a minimum distance of 20 cm between the radiator and the user's body.

2.7 Antenna Type and Gain

Only antennas of the same type with equal or lower gain may be used with this module. Other antenna types and/or higher gain antennas may require additional authorization. The certified antenna is a Spring Antenna (Model No. DX-LR01-900) with a maximum gain of 0 dBi in the 903-914.2 MHz frequency range.

2.8 End Product Labelling Compliance Information

When the module is installed in a host device, the FCC ID label must be visible. If not, a second label on the outside of the final device must state: "Contains FCC ID: 2BLPG-DX-LR01-900".

2.9 Information on Test Modes and Additional Testing Requirements

This transmitter is tested in a standalone mobile RF exposure condition. Host manufacturers must perform radiated and spurious emission tests according to FCC Part 15C, 15.209, 15.207 requirements. The host can be legally sold only if these test results comply with the FCC requirements.

2.10 Additional testing, Part 15 Subpart B Disclaimer

The certification of this transmitter module as a subsystem does not cover FCC Part 15 Subpart B requirements for the final host. The final host must be reassessed for compliance with this portion of the rules if applicable. The OEM integrator is responsible for testing their end-product for any additional compliance requirements.

2.11 Manual Information to The End User

OEM integrators must not provide information to the end user regarding the installation or removal of this RF module in the user manual of the end product. The host integrator must follow the integration instructions and ensure the composite system complies with FCC rules.

OEM/Host Manufacturer Responsibilities

OEM/Host manufacturers are responsible for the compliance of the Host and Module. The final product must be reassessed against all FCC rule requirements, including the transmitter module for Radio and RF Exposure, before being placed on the US market.

2.12 How to Make Changes - Important Note

If conditions cannot be met (e.g., certain laptop configurations or co-location with another transmitter), the FCC authorization is void, and the FCC ID cannot be used on the final product. The OEM integrator must re-evaluate the end product and obtain separate FCC authorization.