TPL5010-Q1 AEC-Q100 Nano-Power System Timer with Watchdog Function
SNAS679–SEPTEMBER 2016 The TPL5010-Q1 Nano Timer is a low power, AEC-Q100 qualified timer with a watchdog feature ideal for system wake up in duty cycled or battery powered applications. In such systems, the microcontroller timer can be used for system wake-up, but if the timer sleep current is high, up to 60-80% of the total system current can be consumed by the microcontroller timer in this sleep mode. Consuming only 35 nA, the TPL5010-Q1 can replace the functionality of the integrated microcontroller timer and allow the microcontroller to be placed in a much lower power mode. Such power savings extend the operating life of batteries and enable the use of significantly smaller batteries, making the TPL5010-Q1 ideal for power sensitive applications. The TPL5010-Q1 provides selectable timing intervals from 100 ms to 7200 s and is designed for interrupt-driven applications. Some standards (such as EN50271) require implementation of a watchdog for safety, and the TPL5010-Q1 realizes this watchdog function at almost no additional power consumption. The TPL5010-Q1 is available in a 6-pin SOT23 package. Device Information (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Application Diagram: A block diagram illustrates a battery connected to a power management unit supplying VDD and GND. The TPL5010-Q1 is shown with its pins (VDD, GND, DELAY/M_RST, RSTn, WAKE, DONE) connected to the power management unit and a microcontroller (µC). The DELAY/M_RST pin is connected to an external resistor (REXT) to ground. The RSTn pin has a pull-up resistor (Rp) connected to VDD. TPL5x10Q Family of AEC-Q100 Nano-Power System Timers SOT23 6-Pin DDC Top View Diagram shows the TPL5010-Q1 in a 6-pin SOT23 package with pins numbered 1 to 6. Pin 1: VDD, Pin 2: GND, Pin 3: DELAY/M_RST, Pin 4: DONE, Pin 5: WAKE, Pin 6: RSTn. (1) G= Ground, P= Power, O= Output, I= Input. Over operating free-air temperature range (unless otherwise noted)(1) (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with ANSI/ESDA/JEDEC JS-001 specification. Over operating free-air temperature range (unless otherwise noted) (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. TA= 25°C, VDD-GND=2.5 V (unless otherwise stated)(1) (1) Values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No specification of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically. (1) Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through correlations using statistical quality control (SQC) method. Timing Diagram: A waveform diagram illustrating the timing relationships between VDD, WAKE, DONE, RSTn, and DELAY/M_RST signals, showing pulse durations, rise/fall times, and delays relevant to the device's operation. Graphs showing typical characteristics: The TPL5010-Q1 is a system wakeup timer with a watchdog feature, ideal for low power applications. The TPL5010-Q1 is ideal for use in interrupt-driven applications and provides selectable timing from 100 ms to 7200 s. The functional block diagram shows the internal components: a Low Frequency Oscillator, a Frequency Divider, a Decoder & Manual Reset Detector, and Logic Control. These blocks are interconnected, with inputs from VDD and DELAY/M_RST, and outputs to RSTn, WAKE, and DONE, all referenced to GND. The DONE, WAKE, and RSTn signals are used to implement the watchdog function. The TPL5010-Q1 is programmed to issue a periodic WAKE pulse to a µC which is in sleep or standby mode. After receiving the WAKE pulse, the µC must issue a DONE signal to the TPL5010-Q1 at least 20 ms before the rising edge of the next WAKE pulse. If the DONE signal is not asserted, the TPL5010-Q1 asserts the RSTn signal to reset the µC. A manual reset function is realized by momentarily pulling the DELAY/M_RST pin to VDD. The WAKE pulse is sent out from the TPL5010-Q1 when the programmed time interval starts (except at the beginning of the first cycle or if in the previous interval the DONE has not been received). This signal is normally low. The DONE pin is driven by a µC to signal successful processing of the WAKE signal. The TPL5010-Q1 recognizes a valid DONE signal as a low-to-high transition. If two or more DONE signals are received within the time interval, only the first DONE signal is processed. The DONE signal resets the counter of the watchdog only. If the DONE signal is received when the WAKE is still high, the WAKE will go low as soon as the DONE is recognized. To implement the reset interface between the TPL5010-Q1 and the µC, a pull-up resistance is required. 100 kΩ is recommended to minimize current. During the POR and the reading of the REXT, the RSTn signal is LOW. RSTn is asserted (LOW) for either one of the following conditions: 1. If the DELAY/M_RST pin is high for at least two consecutive cycles of the internal oscillator (approximately 20 ms). 2. At the beginning of a new time interval if DONE is not received at least 20 ms before the next WAKE rising edge (see Figure 8). During startup, after POR, the TPL5010-Q1 executes a one-time measurement of the resistance attached to the DELAY/M_RST pin to determine the desired time interval for WAKE. This measurement interval is tR_EXT. During this measurement, a constant current is temporarily flowing into REXT. Startup Timing Diagram: Shows WAKE, DONE, RSTn, and DELAY/M_RST signals during startup, including POR, resistance reading (tR_EXT), and the subsequent timing. During normal operating mode, the TPL5010-Q1 asserts periodic WAKE pulses in response to valid DONE pulses from the µC. If either a manual reset is applied (logic HIGH on DELAY/M_RST pin) or the µC does not issue a DONE pulse within the required time, the TPL5010-Q1 asserts the RSTn signal to the µC and restarts its internal counters. See Figure 8 and Figure 10. The time interval between 2 adjacent WAKE pulses (rising edges) is selectable through an external resistance (REXT) between the DELAY/M_RST pin and ground. The value of the resistance REXT is converted one time after POR. The allowable range of REXT is 500 Ω to 170 kΩ. At least a 1% precision resistance is recommended. See Timer Interval Selection Using External Resistance for how to set the WAKE pulse interval using REXT. The time between 2 adjacent RESET signals (falling edges) or between a RESET (falling edge) and a WAKE (rising edge) is given by the sum of the programmed time interval and the tRSTn (reset pulse width). If VDD is connected to the DELAY/M_RST pin, the TPL5010-Q1 recognizes this as a manual reset condition. In this case, the time interval is not set. If the manual reset is asserted during the POR or during the reading procedure, the reading procedure is aborted and is re-started as soon as the manual reset switch is released. A pulse on the DELAY/M_RST pin is recognized as a valid manual reset only if it lasts at least 20 ms (observation time is 30 ms). A valid manual reset resets all the counters inside the TPL5010-Q1. The counters restart only when the high digital voltage at DELAY/M_RST is removed and the next tRSTn is elapsed. Manual Reset Timing Diagram: Illustrates WAKE, DONE, RSTn, and DELAY/M_RST signals during manual reset, showing valid and invalid manual reset pulses and their effect on RSTn. A resistance in the range between 500 Ω and 170 kΩ needs to be connected to select a valid time interval. At the POR and during the reading of the resistance, the DELAY/M_RST is connected to an analog signal chain through a mux. After the reading of the resistance, the analog circuit is switched off, and the DELAY/RST is connected to a digital circuit. The manual reset detection is supported with a de-bounce feature, which makes the TPL5010-Q1 insensitive to glitches on the DELAY/M_RST pin. When a valid manual reset signal is asserted on the DELAY/M_RST pin, the RSTn signal is asserted LOW after a delay of tM_RST. It remains LOW after a valid manual reset is asserted + tDB + tRSTn. Due to the asynchronous nature of the manual reset signal and its arbitrary duration, the LOW status of the RSTn signal may be affected by an uncertainty of about ±5 ms. A valid manual reset puts all the digital output signals at their default values: WAKE = LOW, RSTn = asserted LOW. The manual reset may be implemented using a switch (momentary mechanical action). The TPL5010-Q1 offers 2 possible approaches according to the power consumption constraints of the application. In order to set the time interval, the external resistance REXT is selected according to the following formula: REXT = 100 √[ –b + √(b2 – 4a(c – 100T)) / 2a ] where: Table 2 lists the coefficients for Equation 1 based on the time interval range. Example: For a required time interval of 8 s, coefficient set 2 is used, resulting in REXT = 10.18 kΩ. Tables 3 and 4 provide example values of tIP and their corresponding REXT values, including closest real values and parallel combinations of 1% tolerance resistors. The TPL5010-Q1 can generate 1650 discrete timer intervals from 100 ms to 7200 s. The first 9 intervals are multiples of 100 ms, while the remaining 1641 intervals cover 1 s to 7200 s. Quantization error is associated with these discrete intervals and can be evaluated using the provided formulas. Since theoretical REXT values may not be standard, using parallel resistor combinations is common. Standard resistor tolerances affect time interval accuracy. The accuracy can be evaluated by calculating min/max REXT values, then the corresponding time intervals (TADC_MIN, TADC_MAX), and finally the error using the provided formulas. Example calculation shows how to determine the uncertainty of an equivalent parallel resistance and its impact on the time interval accuracy. NOTE: Information in the following application sections is not part of the TI component specification. TI customers are responsible for determining suitability of components for their purposes and should validate and test their design implementation to confirm system functionality. In battery-powered applications, low current consumption is a key constraint. The TPL5010-Q1 is ideal for applications needing to monitor environmental conditions at fixed time intervals. It can replace microcontroller timers for wake-up functions, consuming only tens of nA, significantly improving system power consumption. The TPL5010-Q1 can be used with environment sensors to create low-power data loggers, such as air quality loggers. In these applications, the microcontroller and sensor front end often remain in an idle state, waiting for the next logging interval. Figure 13 illustrates a data logging application using a µC and a gas sensor (LMP91000). Figure 13: Data-Logger Diagram: A system diagram shows a lithium-ion battery, power management, TPL5010-Q1 timer, a microcontroller (µC), voltage reference, and a gas sensor (LMP91000). It includes connections for REXT, pull-up resistors, and communication interfaces, as well as a display and keyboard. The primary design driver is low current consumption to maximize battery life. Data acquisition rates typically range from 1 s to 10 s. The TPL5010-Q1 facilitates this by enabling the µC to operate in its lowest power mode, while the TPL5010-Q1 manages watchdog and timing functions. When battery life is critical, selecting a low-power voltage reference, µC, and display is essential. The first step is calculating power consumption for each device mode. For example, the LMP91000 consumes most power during gas measurement, with idle states (stand-by, deep sleep) for other times. Similarly, µCs like the MSP430 family can enter low-power modes. The TPL5010-Q1 can implement watchdog and wake-up timing in these scenarios. After power budget calculation, the appropriate time interval can be selected to meet application constraints and maximize battery life. Figure 14: Effect of TPL5010-Q1 on Current Consumption: A graph comparing current consumption over time, showing that using the TPL5010-Q1 significantly reduces the baseline current consumption compared to a system without it. The TPL5010-Q1 requires a voltage supply between 1.8 V and 5.5 V. A multilayer ceramic bypass X7R capacitor of 0.1 µF between VDD and GND pins is recommended. The DELAY/M_RST pin is sensitive to parasitic capacitance. Traces connecting this pin to ground for resistance measurements should be kept as short as possible to minimize capacitance, which can affect time interval setup. Signal integrity on WAKE and RSTn pins is also improved by keeping trace lengths short between the TPL5010-Q1 and the µC. Figure 15: Layout Diagram: A PCB layout example shows the placement of the TPL5010-Q1, a manual reset switch, capacitor C1, external resistor REXT, and pull-up resistor RP, along with routing to a microcontroller and ground plane. To receive notifications of documentation updates, navigate to the device product folder on ti.com, click 'Alert me' in the upper right corner, and register for a weekly digest. Review the revision history in any revised document for change details. TI community resources are available via links. TI E2E™ Online Community (e2e.ti.com) fosters collaboration among engineers for questions, knowledge sharing, and problem-solving. Design Support provides access to E2E forums, design support tools, and technical support contact information. E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. These devices have limited built-in ESD protection. Leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to MOS gates. Refer to SLYZ022 – TI Glossary for definitions of terms, acronyms, and abbreviations. The following pages provide mechanical, packaging, and orderable information, which is the most current data available for the designated devices. This data is subject to change without notice. Packaging Information (1) Marketing status definitions: ACTIVE, LIFEBUY, NRND, PREVIEW, OBSOLETE. Important Information and Disclaimer: Information provided is based on TI's knowledge and belief, sourced from third parties, and TI makes no warranty as to its accuracy. TI has taken reasonable steps to provide representative information. TI and its suppliers consider certain information proprietary. TI's liability is limited to the purchase price of the TI parts. Other Qualified Versions: Catalog: TPL5010. Package Outline: A detailed mechanical drawing of the SOT-23 package shows dimensions, pin numbering, and features like the seating plane and gage plane. Example Board Layout and Stencil Design: Diagrams illustrate land patterns, solder mask details, and solder paste examples for the SOT-23 package on a PCB, including recommendations for layout and stencil design.1 Features
2 Applications
3 Description
PART NUMBER PACKAGE BODY SIZE (NOM) TPL5010-Q1 SOT23 (6) 3.00 mm x 3.00 mm 4 Revision History
DATE REVISION NOTES September 2016 * Initial release. 5 Device Comparison Table
PART NUMBER SUPPLY CURRENT (Typ) SPECIAL FEATURES TPL5010-Q1 35 nA Low Power Timer
Watchdog Function
Programmable Delay Range
Manual ResetTPL5110-Q1 35 nA Low Power Timer
MOS-Driver
Programmable Delay Range
Manual Reset
One-Shot Feature6 Pin Configuration and Functions
PIN NO. NAME TYPE (1) DESCRIPTION APPLICATION INFORMATION 1 VDD P Supply voltage 2 GND G Ground 3 DELAY/ M_RST I Time Interval set and Manual Reset Resistance between this pin and GND is used to select the time interval. The reset switch is also connected to this pin. 4 DONE I Logic Input for watchdog functionality Digital signal driven by the µC to indicate successful processing of the WAKE signal. 5 WAKE O Timer output signal generated every tIP period. Digital pulsed signal to wake up the µC at the end of the programmed time interval. 6 RSTn O Reset Output (open drain output) Digital signal to RESET the µC, pull-up resistance is required 7 Specifications
7.1 Absolute Maximum Ratings
MIN MAX UNIT Supply voltage (VDD-GND) –0.3 6.0 V Input voltage at any pin (2) –0.3 VDD + 0.3 V Input current on any pin –5 5 mA Tstg Storage temperature –65 150 °C TJ Junction temperature (3) 150 °C
(2) The voltage between any two pins should not exceed 6V.
(3) The maximum power dissipation is a function of TJ(MAX), ΘJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ΘJA. All numbers apply for packages soldered directly onto a PC board.7.2 ESD Ratings
VALUE UNIT V(ESD) Electrostatic discharge Human-body model, per AEC Q100-002 (1) ±2000 V Charged-device model (CDM), per AEC Q10-011 ±750 7.3 Recommended Operating Conditions
MIN NOM MAX UNIT Supply voltage (VDD-GND) 1.8 5.5 V Temperature –40 125 °C 7.4 Thermal Information
THERMAL METRIC (1) TPL5010-Q1 SOT23 6 PINS UNIT ΘJA Junction-to-ambient thermal resistance 163 °C/W ΘJC(top) Junction-to-case (top) thermal resistance 26 °C/W ΘJB Junction-to-board thermal resistance 57 °C/W ΨJT Junction-to-top characterization parameter 7.5 °C/W ΨJB Junction-to-board characterization parameter 57 °C/W 7.5 Electrical Characteristics
PARAMETER TEST CONDITIONS MIN (2) TYP (3) MAX (2) UNIT POWER SUPPLY IDD Supply current (4) Operation mode 35 50 nA Digital conversion of external resistance (Rext) 200 400 µA TIMER tIP Time interval period (5) 1650 selectable time Intervals 100 ms Max time interval 7200 s Time interval setting accuracy (6) Excluding the precision of Rext ±0.6% Timer interval setting accuracy over supply voltage 1.8 V ≤ VDD ≤ 5.5 V +25 ppm/V tOSC Oscillator accuracy –40°C ≤ TA ≤ 125°C –0.5% 0.5% Oscillator accuracy over temperature (5) 1.8 V ≤ VDD ≤ 5.5 V 150 ppm/°C Oscillator accuracy over supply voltage (5) ±0.4 %/V Oscillator accuracy over life time (7) 0.24% tDONE Minimum DONE pulse width (5) 100 ns tRSTn RSTn pulse width 320 ms tWAKE WAKE pulse width 20 ms t_Rext Time to convert Rext(5) 100 ms DIGITAL LOGIC LEVELS VIH Minimum logic high threshold DONE pin 0.7 x VDD V VIL Maximum logic low threshold DONE pin 0.3 x VDD V VOH Logic output high-level WAKE pin Iout = 100 µA
Iout = 1 mAVDD – 0.3
VDD – 0.7V VOL Logic output low-level WAKE pin Iout = –100 µA
Iout = –1 mA0.3
0.7V VOLRSTn RSTn logic output low-level IOL = –1 mA 0.3 V IOHRSTn RSTn high-level output current VOHRSTn = VDD 1 nA VIHM_RST Minimum logic high threshold DELAY/M_RST pin (5) 1.5 V
(2) Limits are specified by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are specified through correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.
(4) The supply current excludes load and pull-up resistor current. Input pins are at GND or VDD.
(5) This parameter is specified by design and/or characterization and is not tested in production.
(6) The accuracy for time interval settings below 1 second is ±100 ms.
(7) Operational life time test procedure equivalent to 10 years.7.6 Timing Requirements
MIN (1) NOM (2) MAX (1) UNIT trRSTn Rise Time RSTn (3) Capacitive load 50 pF, Rpull-up 100 kΩ 11 µs tfRSTn Fall time RSTn (3) Capacitive load 50 pF, Rpull-up 100 kΩ 50 ns trWAKE Rise time WAKE (3) Capacitive load 50 pF 50 ns tfWAKE Fall time WAKE (3) Capacitive load 50 pF 50 ns tDDONE DONE to RSTn or WAKE to DONE delay Min delay (4) 100 ns Max delay (4) tIP-20 ms tM_RST Minimum valid manual reset (3) Observation time 30 ms 20 ms tDB De-bounce manual reset 20 ms
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped production material.
(3) This parameter is specified by design and/or characterization and is not tested in production.
(4) In case of RSTn from its falling edge, in case of WAKE, from its rising edge.7.7 Typical Characteristics
8 Detailed Description
8.1 Overview
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 WAKE
8.3.2 DONE
8.3.3 RSTn
8.4 Device Functional Modes
8.4.1 Startup
8.4.2 Normal Operating Mode
8.5 Programming
8.5.1 Configuring the WAKE Interval with the DELAY/M_RST Pin
8.5.2 Manual Reset
8.5.2.1 DELAY/M_RST
8.5.2.2 Circuitry
8.5.3 Timer Interval Selection Using External Resistance
8.5.4 Quantization Error
8.5.5 Error Due to Real External Resistance
9 Application and Implementation
9.1 Application Information
9.2 Typical Application
9.2.1 Design Requirements
9.2.2 Detailed Design Procedure
9.2.3 Application Curves
10 Power Supply Recommendations
11 Layout
11.1 Layout Guidelines
11.2 Layout Example
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
12.2 Community Resources
12.3 Trademarks
12.4 Electrostatic Discharge Caution
12.5 Glossary
13 Mechanical, Packaging, and Orderable Information
Orderable Device Status Package Type Package Drawing Pins Package Qty Eco Plan Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking Samples TPL5010QDDCRQ1 ACTIVE SOT-23-THIN DDC 6 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 13VX TPL5010QDDCTQ1 ACTIVE SOT-23-THIN DDC 6 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 13VX
(2) RoHS compliance and Green definitions.
(3) MSL, Peak Temp definitions.
(4) Device marking details.
(5) Multiple device markings explanation.
(6) Lead finish/Ball material options.