RSV0016A RSV (R-PUQFN-N16) 4220314 (Rev. F)
Mechanical Drawing
MPQF205F, MPQF205
Texas Instruments, Incorporated [MPQF205,F.]
mpqf205f ?ts=1611312585355 RSV0016A
B PIN 1 INDEX AREA
PACKAGE OUTLINE
UQFN - 0.55 mm max height
SCALE 5.000
ULTRA THIN QUAD FLATPACK - NO LEAD
1.85 1.75
A
2.65 2.55
0.55
C
0.45
SEATING PLANE
0.05
0.05 C
0.00
5 4
2X 1.2
SYMM
8
15X
0.45 0.35
9
(0.13) TYP
2X 1.2
SYMM
12X 0.4 1
16 0.55
0.45
12
13 PIN 1 ID (45° X 0.1)
16X
0.25 0.15
0.07
0.05
CAB
4220314/C 02/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
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RSV0016A
EXAMPLE BOARD LAYOUT
UQFN - 0.55 mm max height
ULTRA THIN QUAD FLATPACK - NO LEAD
(0.7)
SYMM
16
13
SEE SOLDER MASK DETAIL
16X (0.2) 1
12X (0.4)
(R0.05) TYP
4
12
SYMM (2.4)
9
15X (0.6)
5
8
(1.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN SCALE: 25X
0.05 MAX ALL AROUND
METAL EDGE
0.05 MIN ALL AROUND
METAL UNDER SOLDER MASK
EXPOSED METAL
SOLDER MASK OPENING
EXPOSED METAL
SOLDER MASK OPENING
NON SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DEFINED
SOLDER MASK DETAILS
NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
4220314/C 02/2020
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RSV0016A
EXAMPLE STENCIL DESIGN
UQFN - 0.55 mm max height
ULTRA THIN QUAD FLATPACK - NO LEAD
(0.7)
16
13
16X (0.2) 1
12X (0.4) (R0.05) TYP
4
12
SYMM
(2.4)
9
15X (0.6)
5
8
SYMM
(1.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL SCALE: 25X
4220314/C 02/2020 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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