Manuals+

Reliability Report

Report Title: Qualification of ADI Camas Wafer Fab Bipolar Process for Non-Automotive Products

Report Number: 24165

Revision: C

Date: 25 June 2025

Summary

This report documents the reliability qualification requirements for the release of the BIPOLAR Process at Analog Devices Camas Wafer Fabrication Facility. The products listed below were selected to cover the technology being released.

The products are:

Die/Fab Product Characteristics

Table 1: Die/Fab Product Characteristics - Bipolar at ADI Camas

Product CharacteristicsProduct(s) to be qualified
Generic/Root Part #AD624, AD712, AD8221
Die Id6W624DV*01 A, 6W712DRV*01 A, 6W8221ARV*01 A
Die Size (mm)2.69 x 4.41, 1.83 x 2.87, 1.58 x 2.23
Wafer Fabrication SiteADI-Camas
Wafer Fabrication ProcessBipolar
Die SubstrateSi
Metallization / # LayersAlCu(0.5%)/1, AlCu(1.0%)/1, AlCu(1.0%)/2
PolyimideYes
Passivationdoped-oxide/SiN

Die/Fab Test Results

Table 1.1: Die/Fab Test Results – Bipolar at ADI Camas

Test NameAEC #SpecConditionsGeneric/Root Part #Lot #Fail/SS
High Temperature Operating Life (HTOL)B1JESD22-A108125°C<Tj<135°C, Biased, 1000 HoursAD624Q21497.1.HO1, Q21497.2.HO2, Q21497.3.HO30/77
AD712Q21302.1.HO2_RES, Q21302.2.HO3_RES, Q21302.3.HO1_RES0/77
AD8221N/AN/A
High Temperature Storage Life (HTSL)A6JESD22-A103150°C, 1000 HoursAD624Q21497.1.HS10/77
AD712Q21302.1.HS1_RES0/77
Highly Accelerated Temperature and Humidity Stress Test (HAST)A2JESD22-A110130C 85%RH 33.3 psia, Biased, 96 HoursAD712Q21302.1.HA2_RES, Q21302.2.HA3_RES, Q21302.3.HA1_RES0/77
AD8221N/AN/A
AD624N/AN/A
Unbiased HAST (UHST)A3JESD22-A118130C 85%RH 33.3 psia, 96 HoursAD712Q21302.1.UH2_RES, Q21302.2.UH3_RES, Q21302.3.UH1_RES0/77
AD8221N/AN/A
AD624N/AN/A
Temperature Cycling (TC)A4JESD22-A104-65°C/+150°C, 500 CyclesAD624Q21497.1.TC1, Q21497.2.TC2, Q21497.3.TC30/77
AD712Q21302.1.TC2_RES, Q21302.2.TC3_RES, Q21302.3.TC1_RES0/77
AD8221N/AN/A

1These samples were subjected to preconditioning at MSL 1 with 3x reflow peak temp of 260°C prior to the start of the stress test

Package/Assembly Product Characteristics

Table 2.1: Package/Assembly Product Characteristics - 16-SBDIP at ANALOG DEVICES (ADPI)

Product CharacteristicsProduct(s) to be qualified
Generic/Root Part #AD624
Package16-SBDIP
Body Size (mm)21.34 x 7.87 x 3.56
Assembly LocationADPI
Substrate MaterialB20255-5B
Lid Shield MaterialB21242-C
Die AttachHenkel JM7000 conductive
Leadframe MaterialN/A
Lead FinishAu
Wire Bond Material/Diameter (mils)B2012M-04_Aluminum / 1.25

Table 2.2: Package/Assembly Product Characteristics - 8-SOIC_N at ASE (AET)

Product CharacteristicsProduct(s) to be qualified
Generic/Root Part #AD712
Package8-SOIC_N
Body Size (mm)5.00 x 4.00 x 1.50
Assembly LocationASE (AET)
MSL/Peak Reflow Temperature (°C)MSL 1 / 260°C
Mold CompoundHitachi CEL 9240HF10AK
Die AttachHitachi EN 4900GC conductive
Leadframe MaterialCopper
Lead Finish100 Sn
Wire Bond Material/Diameter (mils)Heraeus AW7 4N Gold / 1.30

Package/Assembly Test Results

Table 3.1: Package/Assembly Product Characteristics - 16-SBDIP at ANALOG DEVICES (ADPI)

Test NameAEC #SpecConditionsGeneric/Root Part #Lot #Fail/SS
Temperature Cycling (TC)A4JESD22-A104-65°C/+150°C, 500 CyclesAD624Q21497.1.TC1, Q21497.2.TC2, Q21497.3.TC30/77

Table 3.2: Package/Assembly Product Characteristics - 8-SOIC_N at ASE (AET)

Test NameAEC #SpecConditionsGeneric/Root Part #Lot #Fail/SS
Solder Heat Resistance (SHR)A1J-STD-020MSL1AD712Q21302.1.SH2_RES, Q21302.2.SH3_RES, Q21302.3.SH1_RES0/77
Highly Accelerated Temperature and Humidity Stress Test (HAST)1A2JESD22-A110130C 85%RH 33.3 psia, Biased, 96 HoursAD712Q21302.1.HA2_RES, Q21302.2.HA3_RES, Q21302.3.HA1_RES0/77
Unbiased HAST (UHST)1A3JESD22-A118130C 85%RH 33.3 psia, 96 HoursAD712Q21302.1.UH2_RES, Q21302.2.UH3_RES, Q21302.3.UH1_RES0/77
Temperature Cycling (TC)1A4JESD22-A104-65°C/+150°C, 500 CyclesAD712Q21302.1.TC2_RES, Q21302.2.TC3_RES, Q21302.3.TC1_RES0/77

1These samples were subjected to preconditioning at MSL 1 with 3x reflow peak temp of 260°C prior to the start of the stress test

ESD and Latch-Up Test Results

Table 4: ESD Test Result

ESD ModelGeneric/Root Part #PackageESD Test SpecRC NetworkHighest Pass LevelClass
FICDMAD62416-SBDIPJS-0021Ω, Cpkg1000VC3
AD7128-SOICJS-0021Ω, Cpkg1250VC3
AD82218-SOICJS-0021Ω, Cpkg1250VC3
HBMAD62416-SBDIPJS-0011.5kΩ, 100pF500V1B
AD7128-SOICJS-0011.5kΩ, 100pF1500V1C
AD82218-SOICJS-0011.5kΩ, 100pF1000V1C

Table 5: Latch Up Test Result

LU Test SpecGeneric/Root Part #Passing CurrentPassing Over-voltageTemperature (TA)Class
JESD78AD624± 200 mA± 22.5V25 °CI
JESD78AD712± 200 mA± 22.5V25 °CI
JESD78AD8221± 200 mA± 22.5V25 °CI

Approvals

Reliability Engineer: Eunice Dionisio

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ADI PCN 25 0091 Rev A Qualification ADI Camas Wafer Fab BIPOLAR Process Microsoft Word for Microsoft 365

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