Parametric Data Density 1 kbit – 2 Mbit 4 Kbit – 32 Mbit 2 MB – 2 Gbit 256 kbit – 4 Gbit 128 Mbit – 128 Gbit 8 GB – 1 TB 2 GB – 1 TB 40 GB – 9 TB Density Sweet Spot 64 k – 256 k 1 Mbit 256 Mbit – 512 Mbit 8 MB and 128 MB 1 Gbit and 4 Gbit 16 GB 8 GB – 64 GB 256 GB
Memory Guide EMEA Components Micron® Industrial Multimarket Application Memory The Industrial IoT/Industry 4.0 is transforming the world of manufacturing extending automation and connectivity beyond traditional factory walls and driving strong demand for more data acquisition, communication, real-time analytics and data-driven decisions across a wide range of industrial verticals. It is estimated 20 billion+ new smart connected devices will be deployed over the next decade. The best devices will be those that enable businesses to run more efficiently, require the least amount of maintenance and enable the least possible downtime. Micron memory and storage solutions are the top choice across IIoT verticals like IPC/ factory automation, surveillance, M2M, retail, digital signage, smart grid, transportation/fleet management, healthcare, and aerospace and defense applications. Micron has been a trusted advisor to our industrial customers for more than 25 years. We understand the unique needs of this market and we bring a mindset to deliver sustainable value to our customers because we firmly believe that IQ matters to our customers' success in IIoT. What is Micron's Industrial Quotient (IQ)? We bring to market a mindset and portfolio that delivers sustainable value to our customers with: Application-Specific Tuning Extensive collaboration with global customers to develop in-depth understanding of application use cases and deliver products and features to meet those specific application needs. Ruggedized Products Product enhancements that enable consistent performance across extreme environments: extended temperature, thermal cycling, shock, humidity, etc. High Reliability Design and testing processes that add a high level of endurance and reliability to align with needs of long-lifecycle embedded applications. Extensive Quality Testing Rigorous testing to deliver the consistent performance across products and processes necessary in embedded and mission-critical applications. Product Longevity Extended lifecycle support for eligible products via our Product Longevity Program, which goes a step beyond standard lifecycle support to suit long-life applications. Security by Design Integrating the latest Micron AuthentaTM technology solution in memory to provide platform- and solution-level values that translate to reliable, safety-conscious solutions with best-in-class time to market. Orderable at arrow.com 2 EMEA COMPONENTS·MEMORY GUIDE Arrow Memory Ready for the Future Components EMEA arrow.com Content Arrow 4 Volatile and Non-Volatile Memory Technology 8MPU Memory Solution Guide Volatile and Non-Volatile 11 MPU Technology Coverage and Memory Landscape 11 Target Memory and Controller Markets and Application 15 Memories | Technologies by Supplier 15 Our Partners for Memories ISSI 12 IS25LP/IS25WP Flash Devices Kioxia 13 Uplifting the world with "Memory" Macronix 10 Flash Forward into the Future Micron 02 Industrial Multimarket Application Memory 14 Industry-Validated Memory Solutions Western Digital 6 Industrial and IoT Storage Solutions 3 Non-Volatile Memory Technology Non-Volatile Memory Technology Sub-Technology Serial Eeprom NV-RAM Parallel Nor Flash Serial Nor Flash Application Features Arrow Suppliers Used in many boot-up applications, parameter storage, and as support memory for low density storage applications. Anywhere that RAM product needs to retain memory when the power is turned off. POS Terminals, Power Meters, Industrial Control. Work memory, used in code storage and most embedded applications. Low Power, low voltage, low densities, low cost, space-savers. Three industry standard serial buses: I²C, SPI and Microwire. STMicro has battery backed up products. Infineon uses capacitor to route contents into on-board, also FRAM technology. Everspin uses magnetic solution. High read speeds, high bit reliability, parallel read, mature technology and production processes. ON Semiconductor, STMicro, Microchip Everspin, Infineon (Cypress), STMicro Infineon (Cypress), ISSI, Macronix, Micron, Microchip Code and parameter storage. Leading volume replacement parallel NOR Flash. Used in boards with limited space. Low pin count, smaller packages, increased densities range, reads serially. Dialog (Adesto), Infineon (Cypress), ISSI, Macronix, Micron, Microchip, Winbond NAND Flash NAND Cards eMMC - UFS Storage Memory chips used when there's a need for high densities for data storage, not used to execution of data. Slower read speed, but faster writes. Not as high data integrity as NOR, supplies now on longevity programs suitable for industrial customers. Removeable Storage Memory for Security, Camera and image storage, industrial control, Test instrumentation, Medical and many other applications requiring removeable storage. Embedded Memory Card. Non Removable memory card solution, suitable for internal storage. Dominant types are Micro SD cards Class 10 offers best speed and endurance, we can offer CF and SD cards but are lower densities and expensive Emmc now using standard NAND wafer and new 3D NAND which can be stacked to 96 layer and increasing . Densities continue to increase as the die technology changes. ISSI, Kioxia, Macronix, Micron, Samsung, SkyHigh, Winbond Kioxia, Micron, Panasonic, TDK, Western Digital, Virtium ISSI, Kioxia, Macronix, Micron, Samsung, SkyHigh, Western Digital SSD High end data storage applications, server, data centre, robotics, video surveillance, Industrial machine, AI edge storage. Low power consumption compare to HDD technology. Faster performance, densities continue to grow giving you more storage for simliare cost. Intel, Kioxia, Micron, Panasonic, Samsung, TDK, Western Digital, Virtium Parametric Data Density 1kbit2Mbit Density Sweet Spot Major Packages 64k256k SO8N, TSSOP8, DFN2X3, DFN5, WLCSP and bare die packages. 4Kbit32Mbit 1Mbit SOIC, SSOP, PDIP, EIAJ8, TDFN8 and bare die. 2MB2Gbit 256Mbit512Mbit TSOP, FBGA, LFBGA What you need to know Low cost entry level boot and execute solution used where limited memory capacity is required. Non-Volatile SRAMs are expensive and can generate high NSB if the design requires this product, FRAM and magentic RAM are a more cost effective solution. Legacy NOR flash not recommend for new design all new processors have no parallel interface. Note: Kioxia formerly Toshiba, Western Digital formerly SanDisk, Dialog formerly Adesto, Infineon formerly Cypress 256kbit4Gbit 8MB and 128MB 8-SOP, 8-USON, 8-WSON, 24-TFBGA.WLSCP and bare die. 128Mbit128Gbit 1Gbit and 4Gbit TSOP, FBGA Low pin count, small packages make Serial Flash a space saver. All new processors and FPGA use Serial and standard interface Enter level NAND solution, used in application for local storage. 8GB1TB 16GB Cards various form factors including Secure Digital, Mini-SD, Compact Flash A wide variety of solutions for removeable storage needs, replacement for EOL and support leading edge technology. 2GB1TB 40GB9TB 8GB64GB 256GB 100 ball BGA and 153 BGA, 100 TFBGA Small embedded form factor allows for maximum storage in minimal space. Higher density storage than SLC NAND good support for IOT-AI applications . All leading edge manufactures moving away from 2.5 inch SATA . 2.5 inch SATA, PCIe M.2, U2, mSATA, BGA SSD will continue to increase density, more and more data will be used therefore more storage will be required. Intel, Kioixia, Micron, Western digital moving away from 2.5 inch SATA, to other form factors. Not recommend for new design Volatile Memory Technology Volatile Memory Technology Sub-Technology DRAM Specific Type SDRAM LPSDRAM Application Used in mature markets low technology factory automation, medical. Features "Synchronous" DRAM DRAM DRAM DDR1/DDR2 LPDDR1/2 DDR1 used in mature Networking/ Telecom legacy product, DDR2 replacement for DDR one used on older processor. DDR = "Double Data Rate" gives two reads per cycle DDR3/DDR4 LPDDR3/4 Surveillance, Drones, AI, IOT, SOM, SBC, Transportation, Factory automation, Medical, Robotics will use this DRAM technology. Multiple packages and speeds to support the requirements of the up to date processors DRAM DDR5 LPDD5 New DRAM technology high end servers, 5G application, future SBC subject to correct processor avaiability Increase performance and bandwith. Lower power consumption improves voltage margins Arrow Suppliers ISSI, Micron, Winbond ISSI, Micron, Samsung, Winbond ISSI, Micron, Samsung, Winbond Micron, Samsung SRAM Synchronous Telecom, Networking, Speed and Bandwidth critical applications. Highest densities, fastest speeds. Latest SRAM technology. Infineon (Cypress), ISSI SRAM Asynchronous Applications where speed is most critical (like CPU cache and router buffers). Conventional SRAM: has high speed, but high power requirements and limited density. Infineon (Cypress), ISSI, ON Semiconductor SRAM Micropower Battery powered applications that require memory. Used where high performance and speed are necessary but power requirements are low. Infineon (Cypress), ISSI, ON Semiconductor Specialty Memory FIFO Specialty Memory Multi-Port Data buffering and flow control DSP circuits, synch and as well as rate and bus matching. asynch applications. Organizes data reads. Infineon (Cypress) Used for simultaneously reading multiple processors. Infineon (Cypress) Parametric Data Density 64Mbit512Mbit 64Mbit2Gbit 1Gbit48Gbit 8Gbit64Gbit Density Sweet Spot 256Mbit512Mbit Speed Sweet Spot 166Mhz Major Packages TSOP, VFBGA What you need to know Mature DRAM technology: Look for applications that use low technology FPGAs or legacy processors. Note: Infineon formerly Cypress 512Mbit 4Gbit16Gbit 200Mhz400Mhz 800Mhz, 933Mhz, 1866Mhz, 2133Mhz and 3000Mhz TSOP, FBGA, TFGBA FBGA, TFBGA, VFBGA, WFBGA DDR2 leads the two technologies, still used on most older industrial, medical and automotive applications. DDR3 is the current industrial DRAM technology used on most processor, DDR4 works with iMX8 processor. 32Gbit 3200Mhz6400Mhz FBGA, TFBGA, VFBGA, WFBGA DDR5 - LPDD5 limited application in the industrial sector. Will be available for mass market 2022 1Mbit288Mbit 18Mbit 4Kbit64Mbit 4Mbit 250Mhz400Mhz BGA, TQFP Market moving to QDR (Quad Data Rate) due to need for higher speeds and densities. 10ns FBGA, TSOP, SOJ Non growth market with limited supplier base. 64Kbit64Mbit 8Mbit 2Kbit1Mbit 1Mbit 55ns 166Mhz VFBGA, TSOP, SOIC PLCC, TQFP, BGA Will go head-to-head with Pseudo Statics, but has the advantage in power consumption. Specialty Memory: Design work needed and rewarded DW programs. 8Kbit36Mbit 4Mbit, 9Mbit 166Mhz TQFP, FBGA, PBGA Variety of features offered depending on part/supplier. 4 EMEA COMPONENTS·MEMORY GUIDE Content|arrow.com 5 Industrial and IoT Storage Solutions e.MMC Embedded Flash Drives iNAND® IX EM122 and EM132 e.MMC 5.1 storage solutions offer dependable and robust embedded storage options to system designers in the Industrial and IoT market. The EM132 is the first 256GB and 3D NAND-based e.MMC in the Industrial and IoT market. Features and Benefits e.MMC 5.1 interface 8GB to 256GB in small form factor Wide temperature range: -25°C to 85°C (I) and -40°C to 85°C (XI) Auto and manual refresh, enhanced health status, smart partitioning Orderable at arrow.com UFS Embedded Flash Drive iNAND IX EM312 the industrial-grade UFS version 2.1 based on 3D NAND technology, delivers higher capacities and up to 2.5 times the performance of e.MMC-based products. PCIe SSD Western Digital IX SN530, PC SN530, CL SN720, CL SN520, and PC SN730 NVMeTM SSDs are designed to capture massive amounts of sensor and imaging (video) data from POS, delivery robots, factory automation, industrial PCs and laptops and gaming devices some generating terabytes of data per day. Features and Benefits UFS 2.1 interface for high data speeds 16GB to 256GB in small form factor Wide temperature range: -25°C to 85°C (I) and -40°C to 85°C (XI) Fast boot, auto refresh, manual refresh, enhanced health status Orderable at arrow.com Features and Benefits PCIe Gen3x4 NVMe 1.4 M.2 2280, M.2 2242 and M.2. 2230 form factors High capacities up to 2TB TLC and SLC configurations for higher endurance of up to 24 PBW (IX SN530) Temperature range: -40°C to 85°C (IX SN530) 0°C to 85°C (CL series) 0°C to 70°C (PC SN730 & PC SN530) Orderable at arrow.com 6 EMEA COMPONENTS·MEMORY GUIDE SATA SSD Western Digital PC SA530 and SanDisk X600 SATA SSDs deliver leadingedge performance, high capacity, and enhanced endurance. In capacities of up to 1TB, the PC SA530 3D NAND SATA SSD is optimized for the demanding power management requirements of ultra-thin and small form factor products. SD Cards Industrial SD Card IX LD332 and LD342 are ideal for Industrial and IoT applications that require a removable storage media like drones, drive recorder, digital signage, aviation, and body and dash cams. microSDTM Cards Industrial microSD Card IX QD332, QD334 and QD342 offer industrialgrade extended temperature flexibility to support customers that not only want a removable solution but also a small form factor with extreme endurance. SLC, MLC, and TLC solutions are available. Content|arrow.com Features and Benefits X600128GB PC SA530256GB to 1TB 2.5" and M.2 2280 form factors Sequential R/W up to 560/530MB/s Random R/W up to 95K/84K IOPS Orderable at arrow.com Features and Benefits 8GB512GB High endurance (3K P/E Cycle) Wide temperature range: -25°C to 85°C (I) and -40°C to 85°C (XI) BOM control Extended longevity Orderable at arrow.com Features and Benefits 8GB to 256GB Wide temperature range: -25°C to 85°C (I) and -40°C to 85°C (XI) Extreme endurance (Up to 30K P/E cycle) Longevity BOM control Auto/manual refresh, health status, host lock Orderable at arrow.com 7 MPU Memory Solution Guide Volatile and Non-Volatile Memories matching MPUs from Qualcomm Technologies, Inc.* MPU Volatile Memory Suppliers QCS405 ISSI IS43LDxxx Micron MT42Lxxx Winbond W97xHx Micron MT52Lxxx Winbond W63xHx ISSI IS43TRxxx Micron MT41Kxxx Winbond W63xxx QCS410/610 Micron MT53xxx SDA845 Micron MT53xxx SDA660 Micron MT53xxx DRAM LPDDR2 32bit 533MHz 1066MTPS LPDDR3 32bit 933MHz 1866MTPS DDR3L 16bit 933MHz 1866MTPS LPDDR4 32bit (dual channel) 2133MHz 4267MTPS LPDDR4 64bit 1866MHz 4267MTPS 366ball POP LPDDR4 32bit (dual channel) 1866MHz 4267MTPS Typical density Non-Volatile Memory Suppliers 2Gb 8Gb 8Gb 16Gb 32Gb 64Gb 24Gb 64Gb Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia TC58N TC58B (BENAND) Micron MT29Fxxxx Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia THGAxxx Micron MTFCxxxx Micron i200/300 WesternDigital IX QDxxx Kioxia THGAxxx Micron MTFCxxxx Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia THGAxxx Micron MTFCxxxx Memories matching MPUs from NXP MPU Volatile Memory Suppliers i.MX 8M Mini/ Nano/Plus Micron MT53xxx ISSI IS43TRxxx Micron MT41Kxxx Winbond W63xxx Micron MT40Axxx DRAM LPDDR4 16/32bit 1866MHz 4267MTPS DDR4 16/32bit 1600MHz 3200MTPS** DDR3L 16/32bit 933MHz 1866MTPS i.MX8 Micron MT53xxx LPDDR4 64bit 1866MHz 4267MTPS i.MX8X Micron MT53xxx ISSI IS43TRxxx Micron MT41Kxxx Winbond W63xxx LPDDR4 16bit 1866MHZ 4267MTPS DDR3L 16bit 933MHz 1866MTPS Typical density Non-Volatile Memory Suppliers 4Gb 32Gb 32Gb 64Gb 8Gb 32Gb Infineon FL-S FS-S Micron MT25Qxxx Winbond W25Qxxx Kioxia THGBMxxx Micron MTFCxxx Macronix MX52LMxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia TC58N TC58B (BENAND) Micron MT29Fxxxx Infineon FL-S FS-S Micron MT25Qxxx Micron MT35Xxxx Winbond W25Qxxx Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia TC58N TC58B (BENAND) Micron MT29Fxxxx Infineon FL-S FS-S Micron MT25Qxxx Micron MT35Xxxx Winbond W25Qxxx Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesternDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia TC58N TC58B (BENAND) Micron MT29Fxxxx Memories matching MPUs from ST MPU Volatile Memory Suppliers DRAM Typical density STM32MP1 ISSI IS43LDxxx Micron MT42Lxxx Winbond W97xHx Micron MT52Lxxx Winbond W63xHx ISSI IS43TRxxx Micron MT41Kxxx Winbond W63xxx LPDDR2 32bit 533MHz 1066MTPS LPDDR3 32bit 933MHz 2133MTPS DDR3L 16bit 933MHz 1866MTPS 1Gb 8Gb Please note available devices with higher speed grade backward compatible with lower speed grade requirements. * Qualcomm SDA845, Qualcomm SDA660, Qualcomm QCS405, Qualcomm QCS610 and Qualcomm QCS410 are products of Qualcomm Technologies, Inc. and/or its subsidiaries. ** I.mx8M Nano supports 16bit only QCS410 are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Non-Volatile Memory Suppliers Infineon FL-S FS-S Micron MT25Qxxx Winbond W25Qxxx Kioxia THGBMxxx Macronix MX52LMxxx Micron MTFCxxx WesterDigital SDINBDA6xxx Micron i200/300 WesternDigital IX QDxxx Kioxia TC58N TC58B (BENAND) Micron MT29Fxxxx Storage eMMC 5.1 2ports SDC 4/8-bit SLC NAND (parallel) eMMC 5.1 2port SDC 4/8-bit 1x UFS 2.1 gear 3 1-lane 2 Ports SDC 4-bit 2x UFS 2.1 gear3 1/2-Lane eMMC 5.1 2port SDC 4/8-bit 1x UFS 2.1 gear 3 1-lane Storage Flex/Quad SPI 2x eMMC 5.1 3ports SDC 4/8-bit RAW MLC/SLC NAND Quad/Octal FlexSPI eMMC 5.1 2ports SDC 4/8-bit RAW NAND Quad/Octal FlexSPI eMMC 5.1 2ports SDC 4/8-bit RAW NAND Storage Dual/Quad SPI eMMC 4.51 3ports SDC 4/8-bit SLC NAND 8-bit ECC 8 EMEA COMPONENTS·MEMORY GUIDE Content|arrow.com 9 Flash Forward into the Future Macronix delivers high quality, innovative and performance driven products, ideal for diverse applications from computing, consumer, networking, and industrial, to mobile, embedded, automotive, and Internet of Things (IoT). NOR Product Range Comprehensive Serial NOR Flash memory portfolio meets the requirements of high performance, reliable quality, low pin count and small form factor. Parallel NOR Flash provides customers with cost-effective, high performance and reliable products that offer low-power consumption, high endurance and reliability. Serial NOR 3V, 2.5V and 1.8V from 512KB to 2GB Features: Hi performance Multi I/O and Duplex (DTR) family Parallel NOR 5V, 3V and 1.8V from 2MB to 1GB. SLC NAND Product Range Macronix SLC NAND Flash complements its world-leading Serial and Parallel NOR Flash offerings. Our rigorous quality management system ensures that Macronix SLC NAND is one of the most robust and reliable NAND devices in the market. MX30LF/MX60LF family of 3V parallel SLC NAND, ranging in densities from 512MB to 8GB; MX30UF family of 1.8V SLC NAND, offered in densities from 1GB to 4GB. eMMC Product Range Macronix integrates its MLC NAND Flash and controller in a BGA package with a standard interface to the host system. The e·MMCTM memory is ideal for various applications, such as digital TV, set-top boxes, infotainment, industrial and networking applications. It is also available in the 11x10mm BGA package for wearable applications. Orderable at arrow.com 2GB to 8GB eMMC products using Macronix NAND and eMMC controllers. 10 EMEA COMPONENTS·MEMORY GUIDE MPU Technology Coverage and Memory Landscape DRAM Wireless Technologies BT LPDDR2 LDDR3L + LPDDR3 LPDDR4 ZigBee Power-line WiFi LTE 5G Core Frequency 800 MHz Linux & RTOS Processing/computing Linux/Android Things 2.4 GHz Linux/Android NVM Solution SPI NOR Serial NAND Octal NOR/NAND MCP Target Memory and Controller Markets and Application Smart City Digital Signage Motorcontrol All machine vision Memory Automotive Infotainment Security Handheld Scanner Gateaway Industrial Control Panel Content|arrow.com 11 IS25LP/IS25WP Flash Devices Industry Standard Serial Interface IS25LP(WP)01G: 1G-bit/128M-byte IS25LP(WP)512M: 512M-bit/64M-byte IS25LP(WP)256E: 256M-bit/32M-byte IS25LP(WP)128/128F: 128M-bit/16M-byte IS25LP(WP)064A/064D: 64M-bit/8M-byte IS25LP(WP)032D: 32M-bit/4M-byte IS25LP(WP)016D: 16M-bit/2M-byte IS25LP(WP)080D: 8M-bit/1M-byte IS25LP040E: 4M-bit/512K-byte IS25LP020E: 2M-bit/256K-byte IS25LP010E: 1M-bit/128K-byte Orderable at arrow.com ISSI introduces its new Family of IS25LP (2.5/3V) and IS25WP (1.8V) series of flash devices. The family builds upon the success of ISSI's IS25LQ (2.5/3V) and IS25WQ (1.8V) family by introducing leading edge features such as double data rate (DTR/DDR) interface modes, SFDP support, and the popular 2 cycle instruction input (QPI mode). All ISSI SPI flash come with the long lifecycles and stability customers have come to expect from ISSI. The new product family offers read speeds up to 166MHz in Single/Dual/ Quad I/O and 80MHz in double data rate (DTR/DDR) modes, delivering up to 664MB/s (equivalent 83MB/sec) of read throughput (IS25LP256E). ISSI's SPI NOR Flash are ideal for a broad range of applications, such as Automotive, Industrial, Medical, Communications, Networking, Smart Meters, FPGA, Digital Cameras, Printers, Bluetooth, and IOT. The family is also ideal for code shadowing, execute in place (XIP), and data storage operations. Applications Instrument Clusters Infotainment consoles Telematics Safety Systems (ADAS) Smart TV STB HDD Printers Gaming Industrial Controls Medical Devices Military & Aerospace Wireless Access Points 4G LTE Base Stations Routers & Switches Home Networking Energy Smart Grid Management 12 EMEA COMPONENTS·MEMORY GUIDE Uplifting the world with "Memory" KIOXIA delivers flash-based products for next-generation storage applications. Having invented NAND flash over 30 years ago, KIOXIA is now one of the world's largest flash memory suppliers and continues to move the technology forward. e-MMC Highly-efficient Storage e-MMC is a family of advanced and highly efficient NAND flash memory with an integrated controller for enhanced memory management. Based on an interface standardized by JEDEC, KIOXIA's e-MMC offers the optimal solution for applications where higher data volumes need to be stored in an efficient way. BiCS FLASH The Future of High-Density Flash Memory With BiCS FLASH 3D, a three-dimensional vertical flash memory cell structure, KIOXIA focuses on innovation, quality and reliability. This structure is an important component in almost all electronic devices where data need to be stored and enables it to surpass the capacity of mainstream 2D (planar) flash memory. KIOXIA's TLC 3-bit-per-cell 512GB (64GB) BiCS FLASH enhances the reliability of write/erase endurance while boosting write speeds. The company also offers a 1.33TB BiCS FLASH device that features 4-bit-per-cell, quadruple-level-cell (QLC), technology. SLC NAND Reliable, High-Performing, Low-Density NAND Single-level cell (SLC) NAND flash memory is the original NAND architecture. A 1-bit-per-cell, non-volatile memory, SLC provides the high endurance that makes it ideally suited for a variety of consumer and industrial applications where longevity of supply is important. UFS High-Performance Storage UFS (Universal Flash Storage) is a JEDECstandard, non-volatile managed flash device. It was developed to be the highperformance replacement to e-MMC for embedded memory solutions. When compared to e-MMC, UFS delivers a faster interface, higher performance for reads and writes, higher density, better power efficiency and support for full duplexing. Orderable at arrow.com KIOXIA's SLC NAND product family includes two interface options: PARALLEL and SERIAL. Parallel Interface Available as raw SLC NAND or as BENAND (Built-in ECC NAND). BENAND is SLC NAND with an internal hardware error correction code (ECC) engine, which removes the burden of ECC from the host processor. Serial Interface KIOXIA's Serial NAND is SLC NAND with a serial peripheral interface (SPI). SPI is an industry standard inter-chip interface that is used in NOR flash and supported by most microprocessors and microcontrollers. The following trademarks, service and/or company names JEDEC, JEDEC Solid State Technology Association are not applied, registered, created and/or owned by KIOXIA Europe GmbH or by affiliated KIOXIA group companies. However, they may be applied, registered, created and/or owned by third parties in various jurisdictions and therefore protected against unauthorized use. Content|arrow.com 13 Micron® Industry-Validated Memory Solutions Micron System Enablement Your system relies on more than high-performance memory solutions to succeed. That's why we work with system and segment experts both internal and external to Micron to develop memory solutions that meet the requirements of your entire system. Speed Time to Market With Validated Memory Solutions To give you a head start on your design, we've collaborated with 70+ semiconductor design teams and solutions providers to validate your NOR, NAND and DRAM memory devices for use with key platforms, including: Microcontrollers Processors ASICs and custom SoCs Programmable logic solutions (e.g., FPGAs, SoCs, CPLDs) Supporting hardware and software Key Partners Validating Micron Memory ADI Allwinner Ambarella AMD Amlogic Broadcom Hisilicon Infineon Intel Lattice Mediatek Microchip NVIDIA NXP Qualcomm Realtek Renesas STMicroelectronics Synaptics Telechips Texas Instruments Xilinx Orderable at arrow.com The prevalidation can minimize your time and costs spent investigating memory compatibility so you can take your design to market faster. Start exploring our industry-validated memory solutions for your design at micron.com/ecosystem. Reap the Benefits of Our Industry Collaborations Through our relationships with preferred partners and key enablers, we're building an ecosystem that not only delivers validated memory solutions, but also promotes collaboration efforts between industry-leading technology experts, which can benefit your systems in big ways: Fully optimized, leading-edge solutions Better performance, reliability and compatibility Simplified system designs Reduced engineering costs Proven, preferred partners 14 EMEA COMPONENTS·MEMORY GUIDE Memories | Technologies by Supplier Dialog (former Adesto) Everspin Infineon (former Cypress) Intel ISSI Kioxia Macronix Microchip Micron ONSemiconductor Panasonic Samsung SkyHigh Memory STMicroelectronics TDK Virtium Western Digital Winbond SRAM DRAM/SDRAM SDRAM DDR/LPDDR DDR2/LPDDR2 DDR3/LPDDR3 DDR4/LPDDR4 DDR5/LPDDR5 Memory Modules MRAM/FRAM/nvSRAM NOR Flash Serial Parallel EPROM/E²PROM NAND Flash SLC NAND eMMC UFS SD Cards MicroSD Card Compact Flash/CFast Solid-State Drives Memory · · · · · · · · · · · · · · · · · · · · · · · · · · ·· · · · · · ···· · · · ··· · · · ··· · · · ··· · ·· · · · · · · · ··· · · ··· ·· · · ·* · ·* ·* · * Industrial Temperature Grade available Our Partners for Memories Content|arrow.com 15 Arrow Electronics, Inc. Components Frankfurter Straße 211 63263 Neu-Isenburg, Germany In Person +49 (0) 6102 5030 0 Call to talk or set up a face-to-face meeting with one of our knowledgeable representatives. Online arrow.com Visit our website for everything from the latest news to line card information. ©2021 Arrow Electronics, Inc. Arrow and the Arrow logo are registered trademarks of Arrow Electronics, Inc. Other trademarks and product information are the property of their respective owners. ARR_Broschuere_MemoryGuide_02/21Adobe InDesign 16.1 (Macintosh) Adobe PDF Library 15.0