کیس اچپی ورکاستیشن HP Z2 Mini G9 – دکمه ها
QuickSpecs
Overview
HP Z2 G9 Mini Workstation Desktop PC HP Z2 G9 Mini Workstation Desktop PC
Front-Side View
1. Power button
3. Antenna
2. Universal audio jack (with CTIA & OMTP headset support) 4. 1 USB-A 10Gbps port (charge port supports up to 5V/2.1A)
5. 2 USB-C® 20Gbps port (charging supported up to 5V/3A)
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QuickSpecs
Overview
HP Z2 G9 Mini Workstation Desktop PC
Rear View
1. Cover release latch
5. Security cable slot
2. Power connector
6. (1) 1GbE LAN
3. (2) DisplayPort 1.4
7. (3) USB-A 10Gbps port
4. Flex IO left side, choice of:
8. PCIe, choice of:
(1) VGA, (1) HDMI 2.0b, (1) DisplayPortTM 1.4, (1) Dual USB-
Graphic Cards3, (1) Dual USB-A 10Gbps port, (1) Serial port
A 5Gbps port, (1) 1GbE LAN, (1) USB-C® 10Gbps port (Alt 9. Antenna Mode), (1) ThunderboltTM 3 with USB4 40Gbps, (1) 1Gbps
Fiber LC NIC, (1) 2.5GbE LAN, (1) USB-based Serial port, (1)
10GbE LAN
1 Onboard Display support DP1.4/HBR2. Flex I/O module Display support DP1.4/HBR3 (Resolution support up to 5120x3200 24bpp @60Hz). 2Available on selected configurations only. 3 Discrete graphics cards require purchase of the Performance Base Unit, which includes a PCIe backplane riser and 280W power supply
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QuickSpecs
Overview
HP Z2 G9 Mini Workstation Desktop PC
HP Z2 G9 Mini Workstation Desktop PC, bottom view Removable VESA cap for access to integrated VESA mounting holes
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QuickSpecs
Overview
HP Z2 G9 Mini Workstation Desktop PC
Form Factor Operating Systems
Mini
Preinstalled:
·
Windows 11 Pro - HP recommends Windows 11 Pro2
·
Windows 11 Home - HP recommends Windows 11 Pro2
·
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2,3
·
Linux®-ready5
· Ubuntu®4,5
o Intel 12th generation processors will support and preinstall Ubuntu 20.04 and 22.04 LTS
o Intel 13th generation processors support and preinstall Ubuntu 22.04 LTS
Web-Supported only:
·
Windows® 10 Enterprise2
Supported Version:
·
HP tested Windows 10, versions 20H2, 21H1, 21H2 and 22H2 on this platform. For
testing information on newer versions of Windows 10, please see:
https://support.hp.com/document/c05195282.
·
Red Hat® Enterprise Linux® Workstation 8 and 95
·
SUSE Linux® Enterprise Desktop 155
· Ubuntu®4,5
o Intel 12th generation processors support Ubuntu 20.04 and 22.04 LTS
o Intel 13th generation processors support Ubuntu 22.04 LTS
1 Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may vary by device. Features and app availability may vary by region. Certain features require specific hardware (see Windows 11 Specifications). 2 Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com. 3This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of your data. 4 Specific versions of certified Ubuntu® will vary based upon the generation of Intel processors for this platform. Not all features are available in all editions or versions of Ubuntu. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS to take full advantage of Ubuntu functionality. Ubuntu may be automatically updated. ISP fees may apply and additional requirements may apply over time for updates. 5For detailed Linux® OS/hardware support information, see: http://www.hp.com/support/linux_hardware_matrix
NOTE: Your product does not support Windows 8 or Windows 7. In accordance with Microsoft's support policy, HP does not support the Windows® 8 or Windows 7 operating system on products configured with Intel® and AMD® 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers on http://www.support.hp.com. A full list of HP products and the Windows 10 versions tested is available on the HP support website. https://support.hp.com/us-en/document/c05195282
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QuickSpecs
Overview
Processors Overview1,2,3,4,5
HP Z2 G9 Mini Workstation Desktop PC
Intel 14th Generation Processors:
Intel® CoreTM i5-14400 (2.5GHz P-Core base frequency, 1.8GHz E-Core base frequency, up to 3.5GHz E-Core Max Turbo frequency, up to 4.7 GHz P-core Max Turbo frequency, 20MB L3 cache, 6 P-cores and 4 E-cores, 16 threads)
Intel® CoreTM i5-14500 (2.6GHz P-Core base frequency, 1.9GHz E-Core base frequency, up to 3.7GHz E-Core Max Turbo frequency, up to 5GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i5-14600 (2.7GHz P-Core base frequency, 2GHz E-Core base frequency, up to 3.9GHz E-Core Max Turbo frequency, up to 5.2GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i5-14600K (3.5GHz P-Core base frequency, 2.6GHz E-Core base frequency, up to 4.2GHz E-Core Max Turbo frequency, up to 5.3GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i7-14700 (2.1GHz P-Core base frequency, 1.5GHz E-Core base frequency, up to 4.2Ghz E-Core base frequency, up to 5.3Ghz E-Core base frequency,33MB L3 cache, 8 P-cores and 12 E-cores, 28 threads)
Intel® CoreTM i7-14700K (3.4GHz P-Core base frequency, 2.5GHz E-Core base frequency, up to 4.3GHz E-Core Max Turbo frequency, up to 5.5 GHz P-core Max Turbo frequency, 33MB L3 cache, 8 P-cores and 12 E-cores, 28 threads)
Intel® CoreTM i9-14900 (2GHz P-Core base frequency, 1.5GHz E-Core base frequency, up to 4.3GHz E-Core Max Turbo frequency, up to 5.4 GHz P-core Max Turbo frequency, 36MB L3 cache, 8 P-cores and 16 E-cores, 32 threads)
Intel® CoreTM i9-14900K (3.2GHz P-Core base frequency, 2.4GHz E-Core base frequency, up to 4.4GHz E-Core Max Turbo frequency, up to 5.6 GHz P-core Max Turbo frequency, 36MB L3 cache, 8 P-cores and 16 E-cores, 32 threads) Intel 13th Generation Processors:
Intel® CoreTM i5-13400 (2.5GHz P-Core base frequency, 1.8GHz E-Core base frequency, up to 3.3GHz E-Core Max Turbo frequency, up to 4.6 GHz P-core Max Turbo frequency, 20MB L3 cache, 6 P-cores and 4 E-cores, 16 threads)
Intel® CoreTM i5-13500 (2.5GHz P-Core base frequency, 1.8GHz E-Core base frequency, up to 3.5GHz E-Core Max Turbo frequency, up to 4.8 GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i5-13600 (2.7GHz P-Core base frequency, 2GHz E-Core base frequency, up to 3.7GHz E-Core Max Turbo frequency, up to 5 GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i5-13600K (3.5GHz P-Core base frequency, 2.6GHz E-Core base frequency, up to 3.9GHz E-Core Max Turbo frequency, up to 5.1 GHz P-core Max Turbo frequency, 24MB L3 cache, 6 P-cores and 8 E-cores, 20 threads)
Intel® CoreTM i7-13700 (2.1GHz P-Core base frequency, 1.5GHz E-Core base frequency, up to 4.1Ghz E-Core base frequency, up to 5.1Ghz E-Core base frequency,30MB L3 cache, 8 P-cores and 8 E-cores, 24 threads)
Intel® CoreTM i7-13700K (3.4GHz P-Core base frequency, 2.5GHz E-Core base frequency, up to 4.2GHz E-Core Max Turbo frequency, up to 5.3 GHz P-core Max Turbo frequency, 30MB L3 cache, 8 P-cores and 8 E-cores, 24 threads)
Intel® CoreTM i9-13900 (2GHz P-Core base frequency, 1.5GHz E-Core base frequency, up to 4.2GHz E-Core Max Turbo frequency, up to 5.2 GHz P-core Max Turbo frequency, 36MB L3 cache, 8 P-cores and 16 E-cores, 32 threads)
Intel® CoreTM i9-13900K (3GHz P-Core base frequency, 2.2GHz E-Core base frequency, up to 4.3GHz E-Core Max Turbo frequency, up to 5.4 GHz P-core Max Turbo frequency, 36MB L3 cache, 8 P-cores and 16 E-cores, 32 threads) Intel 12th Generation Processors:
Intel® CoreTM i9-12900 (1.8GHz E-core base frequency, 5.0 GHz P-core base frequency, up to 3.8 GHz E-core Max Turbo frequency, up to 5.0 GHz P-core Max Turbo frequency, 30MB L3 cache, 8 P-cores and 8 E-cores, 24 threads)
Intel® CoreTM i7-12700 (1.6 GHz E-core base frequency, 2.1 GHz P-core base frequency, up to 3.6 GHz E-core Max Turbo frequency, up to 4.8 GHz P-core Max Turbo frequency, 25MB L3 cache, 8 P-cores and 4 E-cores, 20 threads)
Intel® CoreTM i5-12500 (3.0 GHz P-core base frequency, up to 4.6 GHz P-core Max Turbo frequency, 18MB L3 cache, 6 P-cores and 0-E-cores, 12 threads)
Intel® CoreTM i3-12100 (3.3 GHz P-core base frequency, up to 4.3 GHz P-core Max Turbo frequency, 12MB, 4 P-cores. 8 threads)
1 Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application
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QuickSpecs
HP Z2 G9 Mini Workstation Desktop PC
Overview
workload and your hardware and software configurations. Intel's numbering, branding and/or naming is not a measurement of higher performance.
2 Intel Turbo Boost performance varies depending on hardware, software and overall system configuration. See http://www.intel.com/technology/turboboost for more information.
3 Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro supported processor, vPro enabled chipset, vPro enabled wired LAN and/or Wi-Fi 6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to run. Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro
4 Error Correction Memory
5TDP configured down to 90W.
Base Units
Standard Base Unit supports only Intel integrated graphics. Performance Base Unit includes a PCIe Backplane Riser for discrete graphics cards.
(Power Adapters ordered separately. See Details in the Power Adapter Section)
Convertibility Expansion Slots
Side I/O
Internal I/O Rear I/O Optional I/O
Z2 Mini G9 can either be placed on a flat surface or mounted behind a display or under a desk. (Mounting sold separately)
· 1 PCI Express Gen4 slot x16 mechanical/ x8 electrical (Low-profile HP graphics cards only*) This is only available in the performance base unit. * The HP Mini discrete graphics cards come with custom rear connector bulkhead. (see system board section for more details)
1 USB-A 10Gbps port (charge port supports up to 5V/2.1A) 2 USB-C® 20Gbps port (charging supported up to 5V/3A), 1 Universal audio jack
(1) serial port available with header
(2) DisplayPort 1.4, (1) 1GbE LAN, (3) USB-A 10Gbps port, (1) Flex IO* choose one of the following options: (1) DisplayPortTM 1.4 HBR31, (1) HDMI 2.0b, (1) VGA, (1) Dual USB-A 5Gbps port , (1) USB-C® 10Gbps port (USB Power Delivery, Alt Mode DisplayPortTM), (1) 1 GbE LAN, (1) ThunderboltTM 3 with USB4TM 40Gbps , (1) 2.5 GbE LAN, (1) USB-based Serial port option, (1) 1GbE Fiber LC NIC, (1) 10GbE LAN
PCIe choose one of the following options: (1) Dual USBA 10Gbps , (1) Serial. These options consume 1 rear bulkhead space each. They do not require a Performance Base Unit with PCIe Backplane Riser.
*Actual flex I/O choice depends on configuration selected. 1GbE Fiber LC NIC and 2.5GbE LAN will be available in Q3, 2022 1Onboard Display support DP1.4/HBR2. Flex I/O module Display support DP1.4/HBR3 (Resolution support up to 5120x3200 24bpp @60Hz). Discrete graphics support DP1.4 / HBR3.
On-board RAID Support NVMe RAID 0 Striped Array NVMe RAID 1 Mirrored Array
Chassis Dimensions (H x W x D)
Packaged Dimensions
H: 2.7" [69mm] (Standard desktop orientation) W: 8.3" [211mm] D: 8.6" [218mm]
H: 11.73'' (298mm) W: 6.69'' (170mm) D: 19.65'' (499mm)
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HP Z2 G9 Mini Workstation Desktop PC
Overview
Rack Dimensions Weight Temperature
Humidity Maximum Altitude (nonpressurized)
Power Adapters
5U
Exact weights depend upon configuration Minimum: 2.4kg (5.29lbs.) Maximum: 3.1kg (6.83lbs.)
Operating: 5° to 35° C (40° to 95° F) Above 1524 m (5,000 feet) altitude, the maximum operating temperature is reduced by 1° C (1.8° F) for every 305 m (1,000 feet) increase in elevation Non-operating: -40° to 60° C (-40° to 140° F) Maximum rate of change: 10°C/hr
Operating: 10% to 85% RH, non-condensing, 35° C maximum wet bulb Non-operating: 10% to 90% RH, non-condensing, 35° C maximum wet bulb
Operating (with Rotational Hard Drives): 3,048 m (10,000 feet) Operating (with only Solid-State Drives): 5,000 m (16,404 feet) Non-operating: 12,192 m (40,000 feet) Maximum operating temperature is reduced as altitude increases. See Temperature for details.
Choice of: 180W 89% Average Efficiency 280W 89% Average Efficiency.
Workstation ISV Certifications
Chipset
Memory
All power Adapters are external to the product. · Standard Base Unit System defaults to 180W Power Adapters. When configured with a 125W K SKU Processor, the 280W Power Adapter is required. · Performance Base Units require 280W Power Adapters supporting Discrete Graphics and 125W K SKU configurations.
See the latest list of certifications at http://www.hp.com/united-states/campaigns/workstations/partnerships.html
Intel® W680 chipset
2 SODIMM slots, supporting up to 64GB ECC/non-ECC, DDR5 5600 MT/s
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QuickSpecs
Supported Components
HP Z2 G9 Mini Workstation Desktop PC
Storage *
Factory Configure
d
PCIe Solid State Drives
Z Turbo 512GB 2280 PCIe-4x4 TLC M.2 Z2 G9 Mini Kit SSD
Y
Z Turbo 1TB 2280 PCIe-4x4 TLC M.2 Z2 G9 Mini Kit SSD
Y
Z Turbo 2TB 2280 PCIe-4x4 TLC M.2 Z2 G9 Mini Kit SSD
Y
Z Turbo 512GB 2280 PCIe-4x4 SED OPAL2 TLC M.2 Z2 G9 Mini Kit SSD
Y
Z Turbo 1TB 2280 PCIe-4x4 SED OPAL2 TLC M.2 Z2 G9 Mini Kit SSD
Y
Z Turbo 2TB 2280 PCIe-4x4 SED OPAL2 TLC M.2 Z2 G9 Mini Kit SSD
Y
512 GB HP Z Turbo Drive PCIe® NVMeTM M.2 SSD
Y
1 TB HP Z Turbo Drive PCIe® NVMeTM M.2 SSD
Y
2 TB HP Z Turbo Drive PCIe® NVMeTM M.2 SSD
Y
Z Turbo 4TB 2280 PCIe-4x4 TLC M.2 Z2 G9 MINI Kit SSD
Y
512 GB HP Z Turbo Drive PCIe® NVMeTM Opal 2 M.2 SSD
Y
1 TB HP Z Turbo Drive PCIe® NVMeTM Opal 2 M.2 SSD
Y
2 TB HP Z Turbo Drive PCIe® NVMeTM Opal 2 M.2 SSD
Y
Z Turbo 4TB 2280 PCIe-4x4 SED OPAL2 TLC M.2 Z2 G9
Y
MINI Kit SSD
HP 256GB 2280 PCIe-4x4 Value M.2 Z2 MINI Kit SSD
Y
HP 512GB 2280 PCIe-4x4 Value M.2 Z2 MINI Kit SSD
Y
HP 1TB 2280 PCIe-4x4 Value M.2 Z2 MINI Kit SSD
Y
Support Option Option Kit Notes
Kit Part Number
Y
4M9Z5AA
Y
4M9Z6AA
Y
4M9Z7AA
Y
4M9Z9AA
Y
4N000AA
Y
4N001AA
Y
Y
Y
Y
5S493AA
Y
Y
Y
Y
5S499AA
Y
4N009AA
Y
4N008AA
Y
4N010AA
NOTE1: SATA hardware-assisted RAID is not supported on Linux® systems. The Linux® kernel, with built-in software RAID, provides excellent functionality and performance. It is a good alternative to hardware-assisted RAID. All drives must be identical in type and capacity. Boot volume/RAID array must be less than 2 TB NOTE 2: PCIe M.2 SSD Kit SKUs include a heatsink.
*For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
Graphics Adapters
Graphics Cable Adapters HP USB-C to DP Adapter HP DisplayPort to DVI-D Adapter HP DisplayPort To DVI Adapter (Bulk 90) HP DisplayPort to HDMI Adapter HP DisplayPort To VGA Adapter HP DisplayPort to VGA Adapter Bulk Qty.90) HP DisplayPort To VGA Adapter
Factory Option Option Kit Part Support
Configured Kit
Number
Notes
Y
Y
4SH08AA
Y
Y
FH973AA
Y
Y
FH973A6
Y
Y
2JA63AA
Y
Y
AS615AA
Y
Y
AS615A6
Y
Y
F7W97AA
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HP Z2 G9 Mini Workstation Desktop PC
Supported Components
USB-C to VGA Adapter USB-C to HDMI Adapter HP Single miniDP-to-DP Adapter Cable Discrete Graphics Entry 3D Graphics NVIDIA® T400 4GB High End 3D Graphics NVIDIA® T1000 4GB NVIDIA® T1000 8GB NVIDIA RTXTM 2000 Ada 16 GB 4mDP Graphics NVIDIA RTXTM A2000 6GB NVIDIA RTXTM A2000 12GB NVIDIA RTXTM 4000 SFF Ada 20 GB 4mDP Graphics
Y
Y
4SH06AA
Y
Y
4SH07AA
Y
Y
2MY05AA
Y
Y
5Z7E0AA
1
Y
N
1
Y
Y
5Z7D8AA
1
Y
Y
8D6B8AA
1
Y
Y
340L0AA
1
Y
Y
5Z7D9AA
1
Y
Y
8C1W1AA
1
1. Discrete graphics cards require a Performance Base Unit chosen at time of order. Performance Base Units include a PCIe backplane riser and requires aa 280W power adapter. Standard Base Units are not capable of supporting discrete graphics.
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Supported Components
HP Z2 G9 Mini Workstation Desktop PC
Memory
HP 8GB (1x8GB) DDR5-4800 nECC SODIMM HP 16GB (1x16GB) DDR5-4800 nECC SODIMM HP 16GB (1x16GB) DDR5-4800 ECC SODIMM HP 32GB (1x32GB) DDR5-4800 nECC SODIMM HP 32GB (1x32GB) DDR5-4800 ECC SODIMM 8GB DDR5 (1x8GB) 5600 SODIMM NECC Memory 16GB DDR5 (1x16GB) 5600 SODIMM NECC Memory 16GB DDR5 (1x16GB) 5600 SODIMM ECC Memory 32GB DDR5 (1x32GB) 5600 SODIMM NECC Memory 32GB DDR5 (1x32GB) 5600 SODIMM ECC Memory
Factory Configured
Y Y Y Y Y Y Y Y Y Y
Option Option Kit Part Support
Kit
Number
Notes
Y 4M9Y4AA/AT
1
Y 4M9Y5AA/AT
1
Y 4M9Y6AA/AT
1
Y 4M9Y7AA/AT 1,2
Y 4M9Y8AA/AT 1,2
Y
79U70AA
1
Y
79U71AA
1
Y
79U74AA
1
Y
79U72AA
1
Y
79U73AA
1
NOTE 1: Two channels of DDR5 memory are supported. To realize full performance at least one DIMM must be inserted into each channel. NOTE 2: Max memory speed with these modules are 5200MHz
See Processor Overview for ECC memory supported processors
Optical and Removable Storage
Factory
Option Kit Part
Configured Option Kit
Number
HP Slim Tray Optical Drives
HP External Ultra-Slim DVD-RW Drive
N
Y
Y3T76AA
HP USB External DVDRW Drive
N
Y
F2B56AA
Actual speeds may vary. Does not permit copying of commercially available DVD movies or other copyright protected materials. Intended for creation and storage of your original material and other lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer discs burned with this drive may not be compatible with many existing single-layer DVD drives and players.
Networking and Communications
Factory Option Kit Option Kit Part
Configured
Number
Integrated Intel® I219LM PCIe GbE Controller (Intel® vPro® with Intel AMT 16.0)
Y
N
HP 1GbE LAN Flex Port 2020
Y
Y
141J6AA/AT
HP Flex 1GbE Fiber LC Single Port
Y
Y
20J15AA
HP 2.5GbE LAN Flex Port
Y
Y
169K0AA
Intel® Wi-Fi 6E AX211 (2x2) and Bluetooth® 5.3 wireless card *,**
Y
N
HP 10GBase-T Flex IO
Y
Y
56Q71AA
Intel BE200 Wi-Fi 7 +Bluetooth 5.4 non-vPro WW
Y
WLAN***
*Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available
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Supported Components
in countries where Wi-Fi 6E is supported. **Intel AX211 must be configured at time of purchase. Not available as an After Market Option *** Not available with 12th Gen Intel ADL processors; Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 7 (802.11BE) functionality requires Windows 11 24H2, select Intel® processor, and a Wi-Fi 7 router, sold separately. Wi-Fi 7 is backwards compatible with prior 802.11 specs. Available in countries where Wi-Fi 7 is supported.
NOTE 1: The integrated network connection is required to support Intel® vPro® Technology. NOTE 2: If AMT is provisioned, then network teaming with the integrated LAN port is not possible. NOTE 3: "Gigabit" Ethernet indicates compliance with IEEE standard 802.3ab for Gigabit Ethernet, and does not connote actual operating speed of 1 Gb/sec. For high-speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required.
Racking and Physical Security
Factory
Option Kit Part
Configured Option Kit
Number
HP B500 PC Mounting Bracket
N
Y
2DW52AA/AT
HP B550 Z Display PC Mounting Bracket*
N
Y
16U00AA/AT
HP Z Display B600 PC Mounting Bracket
N
Y
529H3AA/AT
HP Keyed Cable Lock 10mm
N
Y
T1A62AA
HP Master Keyed Cable Lock 10mm
N
Y
T1A63AA
HP Rack Cable Management Arm
N
Y
35Z34AA
HP Z2 Mini ePSU Sleeve
Y
Y
3RW68AA
HP Z2 Mini Arm/Wall VESA Mount Solution
N
Y
4N004AA/AT
HP Z2 Mini Vertical Stand
N
Y
4N006AA
HP Z2 Mini G9 Rail Rack Kit
N
Y
6C1U0AA/AT
*If physical security is required for IO ports, recommended configuration is B600 PC Mounting Bracket and Z2 Mini VESA Mount Solution.
Input Devices
HP USB 320K Keyboard HP Wireless Business Slim Keyboard and Mouse HP 320M Wired Mouse HP Wired Desktop 320MK Mouse and Keyboard HP 125 Wired Keyboard HP 975 USB+BT Dual Mode Wireless HP 655 Wireless USB BLK KBD/MSE Kit HP 655 Wireless Keyboard and Mouse Combo (Blk Qty.10) HP 125 Wired Mouse HP 128 Laser Wired Mouse HP 935 Creator Wireless Mouse HP 455 Programmable Wireless Keyboard HP 455 Programmable Wireless Keyboard (Bulk Qty.12)
Factory Configured
Y Y Y N Y N N
Option Kit Y Y Y Y Y Y Y
N
Y
Y
Y
Y
Y
N
Y
Y
Y
Y
Y
Option Kit Part Number 9SR37AA
9VA80AA
266C9AA 3Z726AA 4R009AA
4R009A6
265A9AA 265D9AA 1D0K8AA 4R177AA 4R177A6
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QuickSpecs
HP Z2 G9 Mini Workstation Desktop PC
Supported Components
HP Wired Desktop 320MK Mouse and Keyboard
Y
NOTE: Keyboard and Mouse are optional or add on features.
Y
9SR36AA
Other Hardware Software
HP Z2 Mini G9 Serial Port Adapter HP Z2 Mini G9 Dual Type-A SuperSpeed USB 10Gbps Port HP Serial Port v3 Flex IO HP USB-C 3.2 Gen2 Alt Flex Port 2020 HP Dual USB-A 3.2 Gen1 Flex 2020 HP HDMI Flex Port HP DP Flex Port 2020 HP VGA Flex Port 2020 HP TBT3 v3 Flex IO HP Z2 Power Cord Kit C13-C14 2.0m 15A 100-127V Countries Straight Desktop Power Cord C13-C14 2.0m 10A 200-240V Countries Straight Desktop Power Cord HP 280W Slim Smart 7.4mm AC Adapter HP 1GbE LAN Flex Port 2020 HP Flex 1GbE Fiber LC Single Port HP 2.5GbE LAN Flex Port HP Z2 Mini Remote System Controller
Factory Configured
Y Y Y Y Y Y Y Y Y Y Y
Y
Y Y Y Y Y
Option Kit Y Y N Y Y Y Y Y Y Y Y
Y
Y Y Y Y Y
Option Kit Part Number 4M9Y9AA
4M9Z0AA/AT
141K6AA/AT 141J8AA/AT 69D47AA/AT 141J7AA/AT 141K7AA/AT
440A5AA 1N1D5AA 8R881AA
8R882AA
4J0P0AA 141J6AA/AT
20J15AA 169K0AA 7K6E4AA
Factory Configured Option Kit
Support Notes
HP Performance Advisor
Y
N
1
HP PC Hardware Diagnostics UEFI (Windows OS only)
Y
N
2
HP PC Hardware Diagnostics Windows
N
3
HP Wolf Security
Y
N
HP Notifications
Y
N
HP Desktop Support Utility
Y
N
HP Documentation
Y
N
HP Image Assistant
N
N
HP Support Assistant
N
N
myHP
Y
N
HP Easy Clean
Y
N
Kingsoft WPS Office
Y
N
4
Adobe Substance 3D Collection Plan
N
Y
6
WSL2/Ubuntu Data Science Stack
Y
N
7
NOTE 1: Supports and is preinstalled with Windows 10 only. Also available as a free download from http://www.hp.com/go/performanceadvisor NOTE 2: Windows OS only NOTE 3: Not available in Russia
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Supported Components
NOTE 4: Only available in China NOTE 6: Not available in China NOTE 7: Optional Software
HP Z2 G9 Mini Workstation Desktop PC
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QuickSpecs
Supported Components
HP Z2 G9 Mini Workstation Desktop PC
Operating Systems HP BIOS
Windows 11 Pro HP recommends Windows 11 Pro2
Windows 11 Home HP recommends Windows 11 Pro2
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2,3
Linux®-ready5
Red Hat® Enterprise Linux® Workstation 8 and 95
SUSE Linux® Enterprise Desktop 155
Ubuntu®4,5 o Intel 12th generation processors support Ubuntu 20.04 and 22.04 LTS
o Intel 13th generation processors support Ubuntu 22.04 LTS
1 Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may vary by device. Features and app availability may vary by region. Certain features require specific hardware (see Windows 11 Specifications). 2 Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com. 3This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of your data. 4 Specific versions of certified Ubuntu® will vary based upon the generation of Intel processors for this platform. Not all features are available in all editions or versions of Ubuntu. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS to take full advantage of Ubuntu functionality. Ubuntu may be automatically updated. ISP fees may apply, and additional requirements may apply over time for updates. 5For detailed Linux® OS/hardware support information, see: http://www.hp.com/support/linux_hardware_matrix
NOTE: Your product does not support Windows 8 or Windows 7. In accordance with Microsoft's support policy, HP does not support the Windows® 8 or Windows 7 operating system on products configured with Intel® and AMD® 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers on http://www.support.hp.com. A full list of HP products and the Windows 10 versions tested is available on the HP support website. https://support.hp.com/us-en/document/c05195282
Additional HP BIOS Features: · Power-On password Helps prevent an unauthorized user from powering on the system. · Administrator password Also known as the BIOS Setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS cannot be updated and changes cannot be made to BIOS settings using BIOS Setup or under the OS. · S4/S5 Maximum Power Savings setting supports EU Lot6 requirement and allows the computer to power down below 0.5W in S4/S5 (when turned off). When S4/S5 Maximum Power Savings feature is enabled below features are turned off: o Power to expansion connectors / slots o Most Wake events other than power buttons and WOL (Wake on LAN supported by embedded Lan controller under S4/S5 Maximum Power Saving Enabled) o USB charging ports
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QuickSpecs
Supported Components
HP Z2 G9 Mini Workstation Desktop PC
HP Sure Start Gen7 Start · BIOS Integrity checking Sure Start protection ensures that only trusted BIOS code is executed and not rootkits, viruses and malware. Verification is done upon boot up, shutdown and while the system is on. · Sure Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for better manageability. Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for better manageability. · Protecting beyond BIOS Integrity checking and repair is extended to other data that should be protected such as network configuration parameters, platform specific information (i.e. system IDs), secure boot credentials, and other code the system needs to boot. · Audit enabled System Audit via Sure Start Event Logs capture data such as incident, repair date and time for troubleshooting and investigating
NOTE: HP Sure Start Gen7 is available on HP Workstation products equipped with Intel® 12th generation processors.
HP Performance Control Modes HP Z Desktop Workstations offers Performance Control Modes in the F10 BIOS menu. Z2 G9 offers Quiet Mode, Performance Mode, Rack Mode and High-Performance Mode. HP recommends using High Performance Mode. Customers can get up to 41% performance improvements using High Performance Mode over Performance Mode*. High Performance Mode is configured as default from the factory.
How to Set HP Performance Control Modes: In the F10 BIOS Menu, the setting titled "Performance Control" is adjustable to High Performance Mode, Performance Mode, Rack Mode or Quiet Mode. These modes are choice points for performance and acoustic trade-offs based on user needs or recommended balanced conditions in performance and noise optimization.
At startup, push the F10 key while system is booting to get to the BIOS Menu. Go to Advanced -> System Options ->scroll down and choose "Performance Control"
Set the Performance Mode you desire and then go back to Main->Save Changes and Exit -> Yes
In HP Performance Advisor software, select BIOS Settings -> Advanced -> System Options -> Performance Controls
The machine will restart in the mode you've chosen.
You can change these modes anytime you prefer to prioritize acoustics (Quiet Mode), want a balance between performance and acoustics (Performance or Rack Mode) or prefer to prioritize performance (High Performance Mode).
For more information on performance control modes, please see the white paper called, HP Performance Control Modes for Z Desktop Workstations.
*Compared to Performance Mode. Performance improvement based on Z2 Tower G9 with 64GB of memory, 1TB NVMe, Windows 11 22H2 OS, RTX A4000, i7-14700 CPU using Blender OpenData CPU Render and Arnold 2023 CPU multi-core benchmarking.
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QuickSpecs
HP Z2 G9 Mini Workstation Desktop PC
Supported Components
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Software HP Support Assistant 14 HP Image Assistant HP Desktop Support Utility HP Documentation HP Notifications HP PC Hardware Diagnostics UEFI HP PC Hardware Diagnostics Windows HP Performance Advisor1 myHP HP Easy Clean20 WSL/Ubuntu Data Science Stack HP Privacy Settings Touchpoint Customizer for Commercial
Manageability Features HP Driver Packs2 HP UWP Pack HP System Software Manager (SSM) HP BIOS Config Utility (BCU) HP Manageability Integration Kit Gen43 HP Smart Support5 HP Client Catalog (download) HP Image Assistant (download) HP Cloud Recovery HP Client Management Script Library (download) HP BIOSphere Gen6 13
Client Security Software HP Client Security Suite Gen74 including: (including Credential Manager, HP Password Manager6, HP Spare Key) HP Power On Authentication Microsoft Defender7
Security Management HP Secure Erase 16 HP Wolf Pro Security Edition (optional) 18 HP Wolf Security for Business22 Includes: HP Sure Click11 HP Sure Sense12 HP Sure Run Gen59 HP Sure Recover Gen4 10 HP Sure Start Gen78 HP Tamper Lock HP Sure Admin 17 HP Client Security Manager Gen 74
1 HP Performance Advisor Software HP Performance Advisor is ready to help you get the most out of your HP Workstation from day one--and every day after. Learn more or download at: http://hp.com/PerformanceAdvisor 2 HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement. 3 HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html 4 HP Client Security Manager Gen7 requires Windows and is available on the select HP PCs.
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Supported Components
HP Z2 G9 Mini Workstation Desktop PC
5 HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.
6 HP Password Manager requires Internet Explorer or Chrome or FireFox. Some websites and applications may not be supported. User may need to enable or allow the add-on / extension in the internet browser.
7 Microsoft Defender Opt in and internet connection required for updates.
8 HP Sure Start Gen 7 is available on select HP PCs and workstations. See product specifications for availability.
9 HP Sure Run Gen5 is available on select Windows 11 based HP Pro, Elite and Workstation PCs with select Intel® or AMD processors
10 HP Sure Recover Gen4 is available on select HP PCs and requires Windows 10 and an open network connection. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data. Network based recovery using Wi-Fi is only available on PCs with Intel Wi-Fi Module
11 HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details. 12 HP Sure Sense requires Windows 11 Pro or Enterprise and supports Microsoft Internet Explorer, Google ChromeTM, and ChromiumTM. Supported attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode, when Microsoft Office or Adobe Acrobat are installed. 13 HP BIOSphere Gen6 features may vary depending on the platform and configurations. 14 HP Support Assistant requires Windows and Internet access. 16 Secure Erase For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane. 17 HP Sure Admin requires Windows 11, HP BIOS, HP Manageability Integration Kit from http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android or Apple store. 18 HP Wolf Pro Security Edition is available preloaded on select SKUs and, depending on the HP product purchased, includes a paid 1-year or 3-year license. The HP Wolf Pro Security Edition software is licensed under the license terms of the HP Wolf Security Software End-User license Agreement (EULA) that can be found at: https://support.hp.com/usen/document/ish_3875769-3873014-16 as that EULA is modified by the following: "7. Term. Unless otherwise terminated earlier pursuant to the terms contained in this EULA, the license for the HP Wolf Pro Security Edition (HP Sure Sense Pro and HP Sure Click Pro) is effective upon activation and will continue for either a twelve (12) month or thirty-six (36) month license term ("Initial Term"). At the end of the Initial Term you may either (a) purchase a renewal license for the HP Wolf Pro Security Edition from HP.com, HP Sales or an HP Channel Partner, or (b) continue using the standard versions of HP Sure Click and HP Sure Sense at no additional cost with no future software updates or HP Support. 20 HP Easy Clean requires Windows 10 RS3 and higher and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See user guide for cleaning instructions. 22 HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP Pro, Elite, RPOS and Workstation products. See product details for included security features
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QuickSpecs
System Technical Specifications
HP Z2 G9 Mini Workstation Desktop PC
System Board
System Board Form Factor
198.65 x 192.21 mm (7.82 x 7.567 inch)
Processor Socket
Single LGA-1700
CPU Bus Speed
DMI 4.0
Chipset
Intel® PCH W680
Super I/O Controller
Nuvoton SIO21
Memory Expansion Slots 2 DDR5 memory slots
Memory Type Supported DDR5, SODIMM ECC & non-ECC
Memory Modes
Non-Interleaved for single channel. Interleaved when both channels are populated.
Memory Speed Supported 5600MT/s DDR5 for single ranked DIMMs (8GB and 16GB modules), 5200MT/s for dual ranked DIMMs (32GB modules)
Memory Protection
ECC available on data
Maximum Memory
64GB*
Memory Configuration (Supported)
PCI Express Connectors
*Maximum memory capacities assume 64-bit operating systems, such as Genuine Windows® 11 Professional 64 bit, Red Hat Linux 64-bit.
8GB, 16GB and 32GB non-ECC and 16GB and 32GB ECC SO DIMMs are supported. ECC and non-ECC memory DIMMs cannot be mixed in the same system · 1 PCI Express Gen4 slot x16 mechanical/ x8 electrical (Low-profile, full length, Riser only) · 2 M.2 NVMe Storage (PCIe Gen4 x4) · 1 M.2 WLAN (Intel CNVi)
In the PCIe Gen4 (x16 mechanical/x8 electrical) slot, it intent to supported HP certified dGFX card.
Supported Interfaces SATA
None
Serial Attached SCSI Integrated RAID
Integrated Graphics
None
NVMe RAID 0 Striped Array NVMe RAID 1 Mirrored Array
Intel® UHD Graphics 730 (on Core i5-12400/i3-12300/i3-12100 processors); Intel® UHD Graphics 770 (on 13th and 14th Core i5/i7/i9processors);] Based on Unified Memory Architecture (UMA) a region of system memory is reserved and dedicated to the graphics display. Support for Microsoft DirectX 12, OpenGL 4.6 and OpenCL 3.0 on Intel® UHD Graphics 730/770; Based on Unified Memory Architecture (UMA) a region of system memory is reserved and dedicated to the graphics display. 3 DP 1.4 graphics ports integrated in motherboard; Supports up to three simultaneous displays across DisplayPort*/HDMI*/DVI outputs. Max. resolution supported on onboard DP 1.4/HBR2 ports: 4096x2304 @
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HP Z2 G9 Mini Workstation Desktop PC
System Technical Specifications
USB Connector(s)
Network Controller
External SATA (eSATA) IDE connector Floppy connector Serial
2nd Serial HD Integrated Audio Side
Rear
60Hz, 24bpp Max. resolution supported on 19lexion DP 1.4/HBR3 ports: 5120x3200 @ 60Hz, 24bpp
Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 16
None
None
None
1 internal header (requires optional Serial Port Adapter Kit with PCIe Bracket)
None
Yes
1 Type-A SuperSpeed USB 10Gbps port (support charging) 2 Type-C® SuperSpeed USB 20Gbps port (charging supported)
3 Type-A SuperSpeed USB 10Gbps port
Flex IO, choice of: 1 Dual Type-A SuperSpeed USB 5Gbps port, 1 Type-C® SuperSpeed USB 10Gbps port (Alt Mode)
HD Integrated Audio Flash ROM CPU Fan Header Memory Fan Header Chassis Fan Header Front PCI Fan Header Front Control Panel/Speaker Header CMOS Battery Holder Lithium Integrated Trusted Platform Module Power Supply Headers
Realtek ALC3205-A2-CG Yes Yes None None None Yes
PCIe, choose of: Graphic Cards, 1 Dual SuperSpeed USB Type-A 10Gbps , 1 serial
Yes
Integrated TPM 2.0 Convertible to FIPS 140-2 Certified mode through firmware v15.21.
DC Jack for adapter
Power Switch, Power LED Yes & Hard Drive LED Header
Clear Password Jumper Keyboard/Mouse Power Adapter
None
USB
Choice of: 180W 89% Average Efficiency. 280W 89% Average Efficiency.
All power Adapters are External to the product.
· Standard Base Unit System default to 180W Power Adapters. When configured with a 120W K SKU Processor, the 280W Power Adapter is required.
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HP Z2 G9 Mini Workstation Desktop PC
System Technical Specifications
· Performance Base Units require 280W Power Adapters supporting Discrete Graphics and 120W K SKU configurations.
PROCESSORS
Name
Ghz PCore Base Frequenc
y
Ghz ECore Base Frequenc
y
Up to X PCore Max
Turbo Freq
Up to x GHz E-Core Max
Turbo Frequency
L3 Cache (MB)
PCore
s
ECore
s
Total Cores
Processo r
Threads
Memory Speed (MT/s) (DDR5)4
ECC Memory Supporte
d5
Intel 14th Generation Processors
Integrated Graphics
Featuring
Max
Intel® vPro® Technolog
TDP (W)
Turbo Frequen
cy
y3
(GHz)2
Intel® CoreTM i9-14900K
3.2 2.40
5.6
4.4
36 8 16 24 32 5600
Y
Intel® UHD Graphics 770
Y 125 6
Intel® CoreTM i9-14900
2 1.50 5.4
4.3
36 8 16 24 32 5600
Y
Intel® UHD Graphics 770
Y
65 5.8
Intel® CoreTM i7-14700K
3.4 2.50
5.5
4.3
33 8 12 20 28 5600
Y
Intel® UHD Graphics 770
Y 125 5.6
Intel® CoreTM i7-14700
2.1 1.50
5.3
4.2
33 8 12 20 28 5600
Y
Intel® UHD Graphics 770
Y
65 5.4
Intel® CoreTM i5-14600K
3.5 2.60
5.3
4.2
24 6 8 14 20 5600
Y
Intel® UHD Graphics 770
Y
65 5.3
Intel® CoreTM i5-14600
2.7 2.00
5.2
3.9
24 6 8 14 20 5600
Y
Intel® UHD Graphics 770
Y
65 5.2
Intel® CoreTM i5-14500
2.6 1.80
5
3.7
24 6 8 14 20 4800
Y
Intel® UHD Graphics 770
Y
65 5.0
Intel® CoreTM i5-14400
2.5 1.80
4.7
Intel 13th Generation Processors
3.5
20 6 4 20 16 4800
N
Intel® UHD Graphics 730
N/A
65 4.7
Intel® CoreTM i9-13900K
3 2.20 5.4
4.3
36 8 16 24 32 5600
Y
Intel® UHD Graphics 770
Y 125 5.8
Intel® CoreTM i9-13900
2 1.50 5.2
4.2
36 8 16 24 32 5600
Y
Intel® UHD Graphics 770
Y
65 5.6
Intel® CoreTM i7-13700K
3.4 2.50
5.3
4.2
30 8 8 16 24 5600
Y
Intel® UHD Graphics 770
Y 125 5.8
Intel® CoreTM i7-13700
2.1 1.50
5.1
4.10 30 8 8 16 24 5600
Y
Intel® UHD Graphics 770
Y
65 5.2
Intel® CoreTM i5-13600K
3.5 2.60
5.1
3.9
24 6 8 14 20 5600
Y
Intel® UHD Graphics 770
Y
65 5.1
Intel® CoreTM i5-13600
2.7 2.00
5.0
3.7
24 6 8 14 20 4800
Y
Intel® UHD Graphics 770
Y
65 5.0
Intel® CoreTM i5-13500
2.5 1.80
4.8
3.5
24 6 8 14 20 4800
Y
Intel® UHD Graphics 770
Y
65 4.8
Intel® CoreTM i5-13400
2.5 1.80
4.6
Intel 12th Generation Processors
3.3
20 6 4 10 16 4800
N
Intel® UHD Graphics 730
N/A
65 4.6
Intel® CoreTM i9-12900
5
1.8
5.0
3.8
30 8 8 16 24 4800
Y
Intel® UHD Graphics 770
Y
65 5.1
Intel® CoreTM i7-12700
2.1
1.6
4.8
3.6
25 8 4 12 20 4800
Y
Intel® UHD Graphics 770
Y
65 4.9
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QuickSpecs
HP Z2 G9 Mini Workstation Desktop PC
System Technical Specifications
Intel® CoreTM i5-12500
3
N/A 4.6
Intel® CoreTM i3-12100
3.3 N/A
4.3
N/A
18 6 0 6
12 4800
Y
Intel® UHD Graphics 770
Y
65 4.6
N/A 12 4 0 4
8
4800
N
Intel® UHD Graphics 730
N/A
60 4.3
1 Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel's numbering, branding and/or naming is not a measurement of higher performance.
2 Intel Turbo Boost performance varies depending on hardware, software and overall system configuration. See http://www.intel.com/technology/turboboost for more information.
3 Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro supported processor, vPro enabled chipset, vPro enabled wired LAN and/or Wi-Fi 6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to run. Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro
4 Memory will run at 4400 speed (MT/s) if there is one DIMM per channel. 2 DIMMS per channel will run 4000 speed (MT/s). DIMMs must be the same, either 8GB or 16GB DIMMs. 32GB DIMMs run at 3200 MT/s.
5 Error Correction Memory
System Configurations
HP Z2 G9 Mini Configuration #1
Energy Consumption (Watts)
Processor Info Memory Info Graphics Info Disks/Optical/Floppy Power Supply
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
Core i5-12500,6C 3.0G 65W
2 x 8G DDR5 4800 NECC
NA
512GB SSD Z Turbo
180W
115 VAC
LAN Enabled
LAN Disabled
8.18
9.36
142.5
125.56
1.2
1.13
0.8
0.66
0.28
Heat Dissipation (Btu/hr)
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
115 VAC
LAN Enabled
LAN Disabled
27.89
31.92
485.93
428.16
4.09
3.85
2.73
2.25
0.95
230 VAC
LAN Enabled
LAN Disabled
8.23
9.89
127.09
125.1
1.25
1.2
0.84
0.8
0.3
230 VAC
LAN Enabled
LAN Enabled
28.06
33.73
433.38
426.59
4.26
4.09
2.86
2.73
1.02
100 VAC
LAN Enabled
LAN Disabled
7.92
9.54
144.96
124.52
1.13
1.25
0.66
0.84
0.28
100 VAC
LAN Disabled
LAN Enabled
27.01
32.53
494.31
424.61
3.85
4.26
2.25
2.86
0.95
Processor Info
Core i7-12700,12C 2.1G 65W
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System Technical Specifications
HP Z2 G9 Mini Configuration #2
Energy Consumption (Watts)
Memory Info Graphics Info Disks/Optical/Floppy Power Supply
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
2 x 8G DDR5 4800 NECC
NVIDIA T400 4GB
512GB SSD Z Turbo 280W
115 VAC
LAN Enabled
LAN Disabled
14.86
16.28
194.33
142.56
1.18
1.1
0.77
0.65
0.28
Heat Dissipation (Btu/hr)
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
115 VAC
LAN Enabled
LAN Disabled
50.67
55.51
662.67
486.13
4.02
3.75
2.63
2.22
0.95
230 VAC
LAN Enabled
LAN Disabled
14.69
16.07
216.33
141.32
1.16
1.18
0.8
0.77
0.29
230 VAC
LAN Enabled
LAN Enabled
50.09
54.8
737.69
481.9
3.96
4.02
2.73
2.63
0.99
100 VAC
LAN Enabled
LAN Disabled
15.23
16.73
206.95
142.82
1.1
1.16
0.65
0.8
0.28
100 VAC
LAN Disabled
LAN Enabled
51.93
57.05
705.7
487.02
3.75
3.96
2.22
2.73
0.95
HP Z2 G9 Mini Configuration #3
Energy Consumption (Watts)
Heat Dissipation (Btu/hr)
Processor Info Memory Info Graphics Info Disks/Optical/Floppy Power Supply
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
Core i9-12900,16C 2.4G 65W
2 x 16G DDR5 4800 NECC
NVIDIA T1000 8GB
512GB SSD Z Turbo 280W
115 VAC
LAN Enabled
LAN Disabled
18.7
20.03
250.3
176.71
1.25
1.12
0.8
0.69
0.28
230 VAC
LAN Enabled
LAN Disabled
18.77
19.99
252.72
178.28
1.21
1.25
0.8
0.8
0.29
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
115 VAC
LAN Enabled
LAN Disabled
63.77
68.3
853.52
602.58
4.26
3.82
2.73
2.35
0.95
230 VAC
LAN Enabled
LAN Enabled
64.01
68.17
861.78
607.93
4.13
4.26
2.73
2.73
0.99
100 VAC
LAN Enabled
LAN Disabled
18.93
20.18
241.04
175.62
1.12
1.21
0.69
0.8
0.28
100 VAC
LAN Disabled
LAN Enabled
64.55
68.81
821.95
598.86
3.82
4.13
2.35
2.73
0.95
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System Technical Specifications
HP Z2 G9 Mini Workstation Desktop PC
HP Z2 G9 Mini Configuration #6
Energy Consumption (Watts)
Heat Dissipation (Btu/hr)
Processor Info Memory Info Graphics Info Disks/Optical/Floppy Power Supply
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
Core i7-12700,12C 2.1G 65W
2 x 8G DDR5 4800 NECC
NVIDIA T1000 8GB
512GB SSD Z Turbo 280W
115 VAC
LAN Enabled
LAN Disabled
18.53
19.89
218.75
174.86
1.17
1.09
0.8
0.66
0.28
230 VAC
LAN Enabled
LAN Disabled
18.19
19.76
237.71
173.24
1.19
1.17
0.78
0.8
0.29
Windows long Idle (S0) Windows short Idle (S0) Windows Busy Typ (S0) Windows Busy Max (S0) Sleep (S3) Off (S5) Zero Power Mode (ErP)
115 VAC
LAN Enabled
LAN Disabled
63.19
67.82
745.94
596.27
3.99
3.72
2.73
2.25
0.95
230 VAC
LAN Enabled
LAN Enabled
62.03
67.38
810.59
590.75
4.06
3.99
2.66
2.73
0.99
100 VAC
LAN Enabled
LAN Disabled
18.35
19.93
225.21
171.59
1.09
1.19
0.66
0.78
0.27
100 VAC
LAN Disabled
LAN Enabled
62.57
67.96
767.97
585.12
3.72
4.06
2.25
2.66
0.92
Declared Noise Emissions
System Configuration (Entry level)
Processor Info Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Idle
Hard drive Operating (random reads)
Hard drive Operating (active mode)
System Configuration (Entry level)
Processor Info Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Intel® CoreTM i9-12900 / 65W
Hynix 32GB 4800 DDR5 SODIMM
NVIDIA T600
SAMSUNG MZVL22T0HBLB-00BH7 (2048 GB) x2
180W
Sound Power (LWAd, bels)
Deskside Sound Pressure (LpAm, decibels)
2.6
15.5
3.3
24.5
3.4
24.8
Intel® CoreTM i9-12900 / 65W Hynix 32GB 4800 DDR5 SODIMM NVIDIA T400 SAMSUNG MZVL22T0HBLB-00BH7 (2048 GB) x2 180W
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System Technical Specifications
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Idle
Hard drive Operating (random reads)
Hard drive Operating (active mode)
System Configuration (Entry level, UMA)
Processor Info Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Idle
Hard drive Operating (random reads)
Hard drive Operating (active mode)
System Configuration (Mid-level)
Processor Info Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Idle
Hard drive Operating (random reads)
Hard drive Operating (active mode)
System Configuration (Mid-level)
Processor Info Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Sound Power (LWAd, bels)
2.6
3.4
Deskside Sound Pressure (LpAm, decibels) 16.9
24.3
3.4
24.5
Intel® CoreTM i9-12900 / 65W
Hynix 32GB 4800 DDR5 SODIMM
Intel® UHD
SAMSUNG MZVL22T0HBLB-00BH7 (2048 GB) x2
180W
Sound Power (LWAd, bels)
Deskside Sound Pressure (LpAm, decibels)
2.6
14.1
3.3
23.5
3.4
23.9
Intel® CoreTM i9-12900 / 65W
Hynix 32GB 4800 DDR5 SODIMM
NVIDIA RTX A2000
SAMSUNG MZVL22T0HBLB-00BH7 (2048 GB) x2
180W
Sound Power (LWAd, bels)
Deskside Sound Pressure (LpAm, decibels)
2.9
19.9
3.3
25.1
3.4
25.2
Intel® CoreTM i9-12900 / 65W Hynix 32GB 4800 DDR5 SODIMM NVIDIA T1000 SAMSUNG MZVL22T0HBLB-00BH7 (2048 GB) x2 180W
Environmental Requirements
Temperature
Humidity Maximum Altitude
Operating: 5° to 35° C (40° to 95° F) Non-operating: -40° to 60° C (-40° to 140° F) Maximum rate of change: 10°C/hr
Operating: 10% to 85% RH, non-condensing, 35° C maximum wet bulb Non-operating: 10% to 90% RH, non-condensing, 35° C maximum wet bulb
Operating (with Rotational Hard Drives): 3,048 m (10,000 feet) Operating (with only Solid-State Drives): 5,000 m (16,404 feet) Non-operating: 12,192 m (40,000 feet)
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Dynamic
Cooling
HP Z2 G9 Mini Workstation Desktop PC
Maximum operating temperature is reduced as altitude increases. See Cooling for details. Shock Operating: ½-sine: 40g, 2-3ms (~62 cm/sec) Non-operating: ½-sine: 160 cm/s, 2-3ms (~105g) square: 422 cm/s, 20g
Vibration Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025g²/Hz Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz Above 1524 m (5,000 feet) altitude, the maximum operating temperature is reduced by 1° C (1.8° F) for every 305 m (1,000 feet) increase in elevation, up to 3048 m (10,000 feet)
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HP Z2 G9 Mini Workstation Desktop PC
Physical Security and Serviceability
Access Panel
Tool-less
Optical Drive
No
Hard Drives
No
Expansion Cards Processor Socket
M.2 module requires a screwdriver to service and replace. An option card requires a screwdriver to service and replace.
Tool-less, except for the processor heatsink and fan
Blue User Touch Points Yes, on internal chassis mechanisms
Color-coordinated Cables Yes and Connectors
Memory
Tool-less
System Board
Screw-In
Dual Color Power and SSD The Power LED is on the front of the system, and the SSD LED is located on the rear of the system
LED
(inside)
Restore CD/DVD Set
Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain
applications that originally shipped with the system for optional installation. Applications can also be obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP Support.
Dual Function Front Power Switch
Yes, causes a fail-safe power off when held for 4 seconds (default) or 15 seconds (can be configured by F10 BIOS setup\Advanced\System Options\Power button override)
Padlock Support
No
Cable Lock Support
Yes, Kensington Cable Lock (optional): Locks top cover from being opened and secures chassis to furniture to prevent theft 3 mm x 7 mm slot at rear of system
Universal Chassis Clamp No Lock Support
Solenoid Lock and Hood Only Hood Sensor(optional) Sensor
Rear Port Control Cover No
Serial, USB, Audio,
Yes, enables or disables serial, USB, audio, and network ports (parallel port is not supported on the HP
Network, Enable/Disable Z2Mini G9 Workstation Desktop PC)
Port Control
Power-On Password
Yes, prevents an unauthorized person from booting up the workstation
3.3V Aux Power LED on No System PCA
NIC LEDs (integrated) Yes (Green & Amber)
CPUs and Heatsinks
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less
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System Technical Specifications
Power Supply Diagnostic No LED
Front Power Button Front Power LED
Yes Yes, white (normal), red (fault)
Front Hard Drive Activity No LED
Front ODD Activity LED No
Internal Speaker
Yes
Cooling Solution
Air cooled forced convection
Power Supply Fans
No
Memory Heatsink Fan No
HP PC Hardware Diagnostics UEFI
Access Panel Key Lock
HP PC Hardware Diagnostics (UEFI) enables hardware level testing outside the operating system on many components. The diagnostics can be invoked by pressing F2 at POST and is available as a download from HP Support.
The Kensington lock slot on the chassis serves this purpose
ACPI-Ready Hardware
Integrated Chassis Handles Power Supply Flash ROM
Advanced Configuration and Power Management Interface (ACPI). · Allows the system to wake from a low power mode. · Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. No
No Yes
Diagnostic Power Switch Yes LED on board
Clear CMOS Button
Yes
CMOS Battery Connector Yes
DIMM Connectors
Yes
BIOS
BIOS 64-bit Services PCI 3.0 Support ATAPI BBS WMI Support
BIOS Boot Spec 1.01+ BIOS Power On
BIOS supports 64-bit Operating systems. Full BIOS support for PCI Express through industry standard interfaces. ATAPI Removable Media Device BIOS Specification Version 1.0. BIOS Boot Specification v1.01.(Not support) WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM) and WBEM specifications. Provides more control over how and from what devices the workstation will boot. (Not Support) Users can define a specific date and time for the system to power on.
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System Technical Specifications
ROM Based Computer Setup Utility (F10)
Review and customize system configuration settings controlled by the BIOS.
System/Emergency ROM
Flash Recovery with Video
Recovers system BIOS in corrupted Flash ROM.
Replicated Setup
Saves BIOS settings to USB flash device in human readable file (HpSetup.txt).
BiosConfigurationUtility.exe utility can then replicate these settings on machines being deployed without entering Computer Configuration Utility (F10 Setup).
SMBIOS
System Management BIOS 3.4, for system management information.
Boot Control
Disables the ability to boot from removable media on supported devices.
Memory Change Alert Alerts management console if memory is removed or changed.
Thermal Alert
Monitors the temperature state within the chassis. Three modes: · NORMAL normal temperature ranges.
· ALERTED excessive temperatures are detected. Raises a flag so action can be taken to avoid shutdown or provide for a smoother system shutdown. · SHUTDOWN excessive temperatures are encountered. Automatically shuts down the computer without warning before hardware component damage occurs.
Remote ROM Flash
Provides secure, fail-safe ROM image management from a central network console.
ACPI (Advanced
Allows the system to enter and resume from low power modes (sleep states).
Configuration and Power Enables an operating system to control system power consumption based on the dynamic workload.
Management Interface) Makes it possible to place individual cards and peripherals in a low-power or powered-off state without
affecting other elements of the system. Supports ACPI 6.0 for full compatibility with 64-bit operating systems.
Ownership Tag
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/Remote
Shutdown
System administrators can power on, restart, and power off a client computer from a remote location.
Instantly Available PC
(Suspend to RAM ACPI
sleep state S3)
Allows for very low power consumption with quick resume time.
Remote System Installation via F12 (PXE 2.1) (Remote Boot from Allows a new or existing system to boot over the network and download software, including the
Server)
operating system.
ROM revision levels
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is available through an industry standard interface (SMBIOS and WMI) so that management SW
applications can use and report this information.
System board revision Allows management SW to read revision level of the system board.
level
Revision level is digitally encoded into the HW and cannot be modified.
Start-up Diagnostics (Power-on Self-Test)
Assesses system health at boot time with selectable levels of testing.
Auto Setup when new hardware installed
System automatically detects addition of new hardware.
Keyboard-less Operation The system can be booted without a keyboard.
Localized ROM Setup
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 15 languages with local keyboard mappings.
Asset Tag
The user or MIS to set a unique tag string in non-volatile memory.
Per-slot Control
Allows I/O slot parameters (option ROM enable/disable, bus latency) to be configured individually.
Adaptive Cooling
Control parameters are set according to detected hardware configuration for optimal acoustics.
Pre-boot Diagnostics (Pre-video) critical errors are reported via beeps and blinks on the power LED.
Industry Standard
Revision Supported by the BIOS
UEFI Specification
Revision
2.7
ACPI
Advanced Configuration and Power Management Interface, Version 6.0
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QuickSpecs
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System Technical Specifications
ATA (IDE) CD Boot EDD
EHCI PCI
PCI Express
PMM SATA
SPD TPM
UHCI USB
SMBIOS
AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
"El Torito" Bootable CD-ROM Format Specification Version 1.0
Enhanced Disk Drive Specification Version 1.1 BIOS Enhanced Disk Drive Specification Version 3.0 (Both Not support)
Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI Local Bus Specification, Revision 2.3 PCI Power Management Specification, Revision 1.1 PCI Firmware Specification, Revision 3.0, Draft .7
PCI Express Base Specification, Revision 2.0 PCI Express Base Specification, Revision 3.0 PCI Express Base Specification, Revision 4.0
POST Memory Manager Specification, Version 1.01(Not Support)
Serial ATA Specification, Revision 1.0a Serial ATA 3 Gb/s: Serial ATA Specification, Revision 2.5 Serial ATA 6 Gb/s: Serial ATA Specification, Revision 3.0
JEDEC JESD300-5
Trusted Computing Group TPM Specification Version 2.0 (Infineon SLB 9670). Common Criteria EAL4+ certified. FIPS 140-2 Certification TCG TPM Certified products list: http://www.trustedcomputinggroup.org/certification/tpm-certified-products/
Universal Host Controller Interface Design Guide, Revision 1.1
Universal Serial Bus Revision 1.1 Specification Universal Serial Bus Revision 2.0 Specification Universal Serial Bus Revision 3.1 Specification Universal Serial Bus Revision 3.2 Specification
System Management BIOS Reference Specification, Version 3.4
External BIOS simulator found at: http://csrsml.itcs.hp.com/
Service, Support, and Warranty
On-site Warranty and Service1: Three-years, limited warranty and service offering delivers on-site, next business-day2 service for parts and labor and includes free telephone support3 8am 5pm. Global coverage2 ensures that any product purchased in one country and transferred to another, non-restricted country will remain fully covered under the original warranty and service offering. 24/7 operation will not void the HP warranty. Storage devices are not covered under warranty for 24/7 operation.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply. NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country. NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party hardware and software. Toll-free calling and 24x7 support service may not be available in some countries. HP Care Pack Services extend service contracts beyond the standard warranties. Service starts from date of hardware purchase. To choose the right level of service for your HP product, use the HP Care Pack Services Lookup Tool at: http://www.hp.com/go/lookuptool. Service levels and response times for HP Care Packs may vary depending on your geographic location.
Certification and Compliance
Environmental Sustainability questions concerning:
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System Technical Specifications
· Ecolabels (EPEAT, TCO, etc.) · ENERGY STAR, California Energy Commission (CEC) · Compliance with Environmental legislation (EU ErP, China CECP, EU RoHS and other countries) · Supply Chain Social Environmental Responsibility (SER) (conflict minerals; human rights, etc.) · Product specific environmental features (material content, packaging content, recycled content, etc.) · China Energy Label (CEL)
· Please contact sustainability@hp.com
For country specific Regulatory Compliance approval documents or Regulatory and Safety questions concerning: · Declarations of Conformity (for self-service, go to https://www.hp.com/uken/certifications/technical/regulations-certificates.html?jumpid=ex_r135_uk/en/any/corp/hpukmu_chev/certificates) · GS Certificates · Product Safety Certificates (UL, CB, BIS, etc.) · EMC Certificates, Declarations of Conformity, or Certificates of Conformity (CE, FCC, ICES, etc.) · CCC Certificates · Ergonomics
· Please contact techregshelp@hp.com
Social and Environmental Responsibility
Eco-Label Certifications & declarations
This product is low halogen except for power cords, cables, and peripherals. Service parts obtained after purchase may not be Low Halogen.
Sustainable Impact Specifications
System Configuration
This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:
· IT ECO declaration · US ENERGY STAR® · US Federal Energy Management Program (FEMP) · EPEAT® Gold with Climate+ registered. See www.epeat.net for registration status and
tier levels by country · TCO Certified · China Energy Conservation Program (CECP) · China State Environmental Protection Administration (SEPA) · Taiwan Green Mark · Korea Eco-label · Japan PC Green label*
· Product Carbon Footprint (hp.com) · Ocean-bound plastic in Speaker1 · 55% post-consumer recycled plastic2 · Low halogen3 · Outside Box and corrugated cushions are 100% sustainably sourced and recyclable4 · Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable5 · Bulk packaging available
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Workstation model is based on a "Typically Configured Workstation".
Energy Consumption (in accordance with US ENERGY STAR® test method)
Normal Operation (Short idle)
115VAC, 60Hz 18.77 W
230VAC, 50Hz 20.05 W
100VAC, 50Hz 17.74 W
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System Technical Specifications
Normal Operation (Long idle) Sleep Off
13.44 W
13.59 W
13.67 W
1.08 W
1.23 W
1.13 W
0.85 W
0.95 W
0.89 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation* Normal Operation (Short idle) Normal Operation (Long idle) Sleep Off
115VAC, 60Hz 64.2 BTU/hr 46 BTU/hr 3.7 BTU/hr 2.9 BTU/hr
230VAC, 50Hz 68.6 BTU/hr 46.5 BTU/hr 4.2 BTU/hr 3.2 BTU/hr
100VAC, 50Hz 60.7 BTU/hr 46.8 BTU/hr 3.9 BTU/hr
3 BTU/hr
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the
Spare parts are available throughout the warranty period and or for up to "5" years after the end of production.
Additional Information
· This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive 2011/65/EC.
· This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC.
· This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).
· This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the Gold level, see www.epeat.net
· Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
· This product is 95.8% recycle-able when properly disposed of at end of life.
Packaging Materials RoHS Compliance
External:
PAPER/Corrugated
269 g
PAPER/Molded Pulp
108 g
PAPER/Paper
3 g
Internal:
PLASTIC/Polyethylene low density LDPE
13 g
The plastic packaging material contains at least 0.0% recycled content. The corrugated paper packaging materials contains at least 59.1% recycled content.
HP Inc. complies fully with materials regulations. We were among the first companies to extend the restrictions in the European Union (EU) Restriction of Hazardous Substances (RoHS) Directive
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System Technical Specifications
to our products worldwide through the HP GSE. HP has contributed to the development of related legislation in Europe, as well as China, India, and Vietnam.
We believe the RoHS directive and similar laws play an important role in promoting industrywide elimination of substances of concern. We have supported the inclusion of additional substances--including PVC, BFRs, and certain phthalates--in future RoHS legislation that pertains to electrical and electronics products.
We met our voluntary objective to achieve worldwide compliance with the new EU RoHS requirements for virtually all relevant products by July 2013, and we will continue to extend the scope of the commitment to include further restricted substances as regulations continue to evolve.
To obtain a copy of the HP RoHS Compliance Statement, see HP RoHS position statement.
Material Usage Packaging Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
· Asbestos · Certain Azo Colorants · Certain Brominated Flame Retardants may not be used as flame retardants in plastics · Cadmium · Chlorinated Hydrocarbons · Chlorinated Paraffins · Formaldehyde · Halogenated Diphenyl Methanes · Lead carbonates and sulfates · Lead and Lead compounds · Mercuric Oxide Batteries · Nickel finishes must not be used on the external surface designed to be frequently
handled or carried by the user. · Ozone Depleting Substances · Polybrominated Biphenyls (PBBs) · Polybrominated Biphenyl Ethers (PBBEs) · Polybrominated Biphenyl Oxides (PBBOs) · Polychlorinated Biphenyl (PCB) · Polychlorinated Terphenyls (PCT) · Polyvinyl Chloride (PVC) except for wires and cables, has been voluntarily removed
from most applications. · Radioactive Substances · Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
HP follows these guidelines to decrease the environmental impact of product packaging: · Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials. · Eliminate the use of ozone-depleting substances (ODS) in packaging materials. · Design packaging materials for ease of disassembly. · Maximize the use of post-consumer recycled content materials in packaging materials. · Use readily recyclable packaging materials such as paper and corrugated materials. · Reduce size and weight of packages to improve transportation fuel efficiency. · Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
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End-of-life Management and Recycling
HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the HP web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.
HP Inc. Corporate Environmental Information
For more information about HP's commitment to the environment:
Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates: http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842 and http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
footnotes
1Percentage of ocean-bound plastic contained in each component varies by product 2Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard. 3External power supplies, WWAN modules, power cords, cables and peripherals excluded. 4100% outer box packaging and corrugated cushions made from sustainably sourced certified and recycled fibers. 5Fiber cushions made from 100% recycled wood fiber and organic materials.
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HP Z2 G9 Mini Workstation Desktop PC
Manageability
Intel® Active
Intel® Active Management Technology (AMT) 161
Management Technology
(AMT)
An advanced set of remote management features and functionality providing IT administrators the
latest and most effective tools to remotely discover, heal, and protect networked client systems
regardless of the system's health or power state. AMT 16 includes the following advanced
management functions:
· Power Management (on, off, reset, graceful shutdown, sleep and hibernate)
· Hardware Inventory (includes BIOS and firmware revisions)
· Serial Over LAN (SOL)
· USB Redirect (Media Redirection)
· ME Wake-on-LAN (WOL)
· Ipv6 Support
· Host Base set-up and configuration
· Management Engine (ME) firmware roll back
Intel® vPro® Technology
The HP Z2 G9 Mini Workstation supports Intel® vPro® technology when configured as outlined below: · Intel® 12th Generation processors product family featuring Intel® vPro® Technology · Intel® W680 chipset · Intel® I219LM GbE LAN
Remote Manageability Software Solutions
The HP Z2 G9 Workstation is supported on the following remote manageability software consoles: · LANDesk Management Suite (HP recommended solution) · Microsoft System Center Configuration Manager For questions or support for manageability needs, please visit http://www.hp.com/go/clientmanagement
HP Image Assistant
Visit: http://ftp.hp.com/pub/caps-softpaq/cmit/HPIA.html
System Software Manager
For questions or support for SSM, please visit: http://www.hp.com/go/ssm
1Requires activation and a system with a corporate network connection, an Intel® AMT enabled chipset, and network hardware and software. For notebooks, Intel AMT may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating, or powered off. Results dependent upon hardware, setup, and configuration. For more information, visit: https://www.intel.com/content/www/us/en/architecture-and-technology/intel-active-managementtechnology.html
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HP Z2 G9 Mini Workstation Desktop PC
PCIe SSDs for HP Workstations
HP Z Turbo Drv PCIE-4X4 Capacity
512GB TLC PCIe SSD
Protocol Form Factor
512GB PCIe M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
300TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6400MB/s*
Sequential Write
3400MB/s*
Random Read
600K IOPS*
Random Write
600K IOPS*
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE-4X4 Capacity
1TB TLC PCIe SSD
Protocol Form Factor
1TB PCIe M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
400TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
800K IOPS*
Random Write
800K IOPS*
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE-4X4 Capacity
2TB TLC PCIe SSD
Protocol Form Factor
Controller
NAND Type
Endurance
Reliability (MTBF)
Interface
Operating Temperature
2TB PCIe M.2 in native Slot on motherboard NVMe 3D TLC 500TBW (TB Written) 1.5M Hours PCI Express 4.0 x4 electrical 32° to 178° F (0° to 81° C)
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Technical Specifications - Hard Drives
Performance
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
800K IOPS*
Random Write
800K IOPS*
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE-4X4 Capacity
4TB TLC PCIe SSD
Protocol Form Factor
4TB PCIe M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
600TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
700K IOPS*
Random Write
700K IOPS*
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE Gen4x4 4TB TLC PCIe SED OPAL2
Capacity Protocol Form Factor
4TB PCIe M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
600TBW (TB Written)
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
700K IOPS*
Random Write
700K IOPS*
Self-Encrypting Drive Support
OPAL2
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE Gen4x4 512GB TLC PCIe SED OPAL2
Capacity Protocol Form Factor
512GB PCIe M.2 in native Slot on motherboard
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Technical Specifications - Hard Drives
Controller
NVMe
NAND Type
3D TLC
Endurance
300TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6400MB/s*
Sequential Write
3400MB/s*
Random Read
600K IOPS*
Random Write
600K IOPS*
Self-Encrypting Drive OPAL2 Support
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE Gen4x4 1TB TLC PCIe SED OPAL2
Capacity Protocol Form Factor
1TB PCIe M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
400TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 178° F (0° to 81° C)
Performance
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
800K IOPS*
Random Write
800K IOPS*
Self-Encrypting Drive OPAL2 Support
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
HP Z Turbo Drv PCIE Gen4x4 2TB TLC PCIe SED OPAL2
Capacity Protocol Form Factor Controller NAND Type Endurance Interface Operating Temperature Performance
2TB
PCIe
M.2 in native Slot on motherboard
NVMe
3D TLC
500TBW (TB Written)
PCI Express 4.0 x4 electrical
32° to 178° F (0° to 81° C)
Sequential Read
6500MB/s*
Sequential Write
5000MB/s*
Random Read
800K IOPS*
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HP Z2 G9 Mini Workstation Desktop PC
Technical Specifications - Hard Drives
Random Write
800K IOPS*
Self-Encrypting Drive OPAL2 Support
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
256GB 2280 PCIe-4x4 Value M.2 SSD
Capacity Protocol
256GB PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
150TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 158° F (0° to 70° C)
Performance
Sequential Read
3100MB/s*
Sequential Write
1400MB/s*
Random Read
200K IOPS*
Random Write
400K IOPS*
Self-Encrypting Drive OPAL2 Support
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
512GB 2280 PCIe-4x4 Value M.2 SSD
Capacity Protocol
512GB PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
300TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 158° F (0° to 70° C)
Performance
Sequential Read
3400MB/s*
Sequential Write
2500MB/s*
Random Read
380K IOPS*
Random Write
430K IOPS*
Self-Encrypting Drive OPAL2 Support
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
1TB 2280 PCIe-4x4 Value Capacity
1TB
M.2 SSD
Protocol
PCIe
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Technical Specifications - Hard Drives
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
400TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 4.0 x4 electrical
Operating Temperature 32° to 158° F (0° to 70° C)
Performance
Sequential Read
3400MB/s*
Sequential Write
2500MB/s*
Random Read
500K IOPS*
Random Write
440K IOPS*
*Actual performance may vary. NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is reserved for system recovery software.
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Technical Specifications - Graphics
HP Z2 G9 Mini Workstation Desktop PC
NVIDIA® Quadro® T400 4GB Graphics
Form Factor
Single Slot, Low Profile (2.7" H x 6.1" L)
Graphics Controller
Turing Tu117-825 Max Power: 30 Watts Cooling Solution: Active fan heatsink
Bus Type
PCI Express 3.0 x16
Memory
4GB GDDR6 Memory Memory Bandwidth: 80 GB/s Memory Interface: 64 bit
Connectors
3x mDP (Mini DisplayPortTM) 1.4 Connectors
Max simultaneous displays
- 3x 3840 x 2160 @ 120Hz - 3x 5120 x 2880 @ 60Hz - supports Multi-Stream Transport (MST)
Shading Architecture DirectX 12 Shader Model 5.1
Supported Graphics APIs OpenGL 4.6 DirectX 12 Vulkan 1.2 API support includes: CUDA, OpenCL 1.2
Available Graphics Drivers
Windows 10 64-bit Windows 11 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
NVIDIA® Quadro® T1000 4GB Graphics
Form Factor
Single Slot, Low Profile (2.7" H x 6.1" L)
Graphics Controller
Turing Tu117-875 Max Power: 50 Watts Cooling Solution: Active fan heatsink
Bus Type
PCI Express 3.0 x16
Memory
4GB GDDR6 Memory Memory Bandwidth: 160 GB/s Memory Interface: 128 bit
Connectors
4x mDP (Mini DisplayPortTM) 1.4 Connectors
Max simultaneous displays
- 4x 3840 x 2160 @ 120Hz - 4x 5120 x 2880 @ 60Hz - 2x 7680 x 4320 @ 60Hz - supports Multi-Stream Transport (MST)
Shading Architecture DirectX 12 Shader Model 5.1
Supported Graphics APIs OpenGL 4.6 DirectX 12 Vulkan 1.2 API support includes: CUDA, OpenCL 1.2
Available Graphics Drivers
Windows 10 64-bit Windows 11 64-bit Linux® 64-bit (selected Enterprise distributions)
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Technical Specifications - Graphics
HP Z2 G9 Mini Workstation Desktop PC
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
NVIDIA® Quadro® T1000 8GB Graphics
Form Factor
Single Slot, Low Profile (2.7" H x 6.1" L)
Graphics Controller
Turing Tu117-875 Max Power: 50 Watts Cooling Solution: Active fan heatsink
Bus Type
PCI Express 3.0 x16
Memory
8GB GDDR6 Memory Memory Bandwidth: 160 GB/s Memory Interface: 128 bit
Connectors
4x mDP (Mini DisplayPortTM) 1.4 Connectors
Max simultaneous displays
- 4x 3840 x 2160 @ 120Hz - 4x 5120 x 2880 @ 60Hz - 2x 7680 x 4320 @ 60Hz - supports Multi-Stream Transport (MST)
Shading Architecture DirectX 12 Shader Model 5.1
Supported Graphics APIs OpenGL 4.6 DirectX 12 Vulkan 1.2 API support includes: CUDA, OpenCL 1.2
Available Graphics Drivers
Windows 10 64-bit Windows 11 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
NVIDIA® RTX 2000 Ada
Form Factor
Half Height Dual Slot (2.7" Height x 6.7" Length)
Max Power Consumption 70W
GPU Memory
16GB GDDR6 Memory Bandwidth: 224 GB/s Memory Width: 128-bit
Connectors
4x Mini DisplayPort 1.4a
Maximum Resolution
4x 4096 x 2160 @ 120 Hz 4x 5120 x 2880 @ 60 Hz 2x 7680 x 4320 @ 60 Hz
Bus Type
PCI Exress 4.0 x8
Avaliable Drivers
Windows 10 Windows 11
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Technical Specifications - Graphics
HP Z2 G9 Mini Workstation Desktop PC
NVIDIA® RTX-A2000 12GB Form Factor
Graphics
Graphics Controller
Low-Profile Double Slot (2.7" H x 6.1" L)
Ampere GA106-850 Power: 70 Watts Cooling: Active Fan Heatsink
Bus Type
PCI Express 4.0 x16
Memory
12GB GDDR6 memory Memory Bandwidth: 288 GB/s Memory Interface: 192 bit Support Error-correcting code (ECC)
Connectors
4x mDP (Mini DisplayPortTM) 1.4 Connectors
Max simultaneous displays
4x 4096 x 2160 @ 120 Hz, 4x 5120 x 2880 @ 60 Hz 2x 7680 x 4320 @ 60 Hz
Shading Architecture Shader Model 6.5
Supported Graphics APIs OpenGL 4.6 DirectX 12 Vulkan 1.2 API support includes: CUDA, OpenCL 1.2
Available Graphics Drivers
Windows 10 64-bit Windows 11 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
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HP Z2 G9 Mini Workstation Desktop PC
Technical Specifications - Networking and Communications
Integrated Intel® I219LM Connector
PCIe GbE Controller
(Intel® vPro® with Intel® AMT 16.01)
Cabling Controller Memory
RJ-45 Twisted pair up to 100m Intel® I219LM GbE platform LAN connect networking controller 3 KB Tx and 3KB Rx FIFO packet buffer memory
Data Rates Supported 10/100/1000 Mbps
Compliance
802.1as/1588, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az, 802.3i, 802.3u, 802.3z
Bus Architecture
PCI Express and SMBus
Data Transfer Mode
PCIe-based interface for active state operation (S0 state) and SMBus for host and management traffic (Sx low power state)
Power Requirement
Requires 3.3V (integrated regulators for core Vdc)
Boot ROM Support
Yes
Network Transfer Mode Full-duplex; Half-duplex
Network Transfer Rate
10BASE-T (half-duplex) 10 Mbps 10BASE-T (full-duplex) 20 Mbps 100BASE-TX (half-duplex) 100 Mbps 100BASE-TX (full-duplex) 200 Mbps 1000BASE-T (full-duplex) 2000 Mbps
Management Capabilities vPro®, WOL, auto MDI crossover, PXE, Muti-port teaming, RSS, ACPI, Advanced cable diagnostic, loopback modes, AMT 16.0 support, Circuit Breaker, VLAN, Multicast Listener Discovery (MLD)
1Requires activation and a system with a corporate network connection, an Intel® AMT enabled chipset, and network hardware and software. For notebooks, Intel AMT may be unavailable or limited over a host OS-based VPN, when connecting wirelessly, on battery power, sleeping, hibernating, or powered off. Results dependent upon hardware, setup, and configuration. For more information, visit: https://www.intel.com/content/www/us/en/architecture-and-technology/intel-active-managementtechnology.html
HP Flex 2.5GbE Single Port NIC
Connector Controller Data Rates Supported Compliance
Bus Architecture Data Transfer Mode
Power Requirement Boot ROM Support Network Transfer Mode Network Transfer Rate
RJ-45 Intel® I225-V 2.5GbE platform LAN connect networking controller 10/100/1000/2500 Mbps 802.3, 802.3x, 802.3u,802.3z,802.1ab, 802.3ab, 802.3az, 802.3bz, 802.1Qbu, 802.3br, 802.1Qbv, 802.1AS-ver, 802.1Q, 802.1Qav PCI Express PCIe-based interface for active state operation (S0 state) and SMBus for host and management traffic (Sx low power state) Requires 3.3V (integrated regulators for core Vdc) Yes Full-duplex; Half-duplex Integrated MAC/PHY supporting 10BASE-Te, 100BASE-TX,
1000BASE-T and 2500BASE-T 802.3 specifications
Data Path Width
1 lane PCIe Gen 2 v3.1 interface for active state operation
Operating Temperature 0 to 70 °C Commercial temperature
Operating System Driver Windows 10 64-bit
Support
Linux®
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Technical Specifications - Networking and Communications
Management Capabilities Error correcting memory (ECC) in packet buffers Time Sensitive Network (TSN): IEEE 802.1Qbu, 802.3br, 802.1Qbv, 802.1AS-REV, 802.1p, Q, and 802.1Qav Interrupt moderation, VLAN (802.1Q & 802.1P), TCP/IP checksum offload, segmentation offload PXE support
HP 1-Port 1GbE Flex IO NIC
Connector
RJ-45
Cabling
1GbE over Category 5e (or better) up to 100m
Controller
Realtek RTL8153
Data Rates Supported 10/100/1000 Mbps
Compliance
802.3 (LAN) 802.3u (100BASE-TX) 802.3ab (1000BASE-T) 802.3x (Ethernet Flow Control) 802.1Q (Virtual LAN) 802.3az (Energy Efficient Ethernet)
Bus Architecture
USB
Power Requirement
Requires 3.3V (integrated regulators for core Vdc)
Boot ROM Support
Yes
Network Transfer Mode Full-duplex; Half-duplex
Network Transfer Rate
10BASE-T (half-duplex) 10 Mbps 10BASE-T (full-duplex) 20 Mbps 100BASE-TX (half-duplex) 100 Mbps 100BASE-TX (full-duplex) 200 Mbps 1000BASE-T (full-duplex) 2000 Mbps
Operating Temperature 32° to 131° F (0° to 55° C)
Dimensions (HxW)
1.5 in x 1.5 in. x 0.75 in (3.81 cm x 3.81 cm x 1.9 cm)
Operating System Driver Windows 10 64-bit
Support
Linux®
HP Flex 1GbE Fiber LC Single Port
Connector Cabling Controller Data Rates Supported
Compliance Bus Architecture Power Requirement Boot ROM Support Network Transfer Mode
Network Transfer Rate Operating Temperature
Fiber 1GbE over Category OM1 (or better) up to 100m Microchip LAN7801 100/1000 Mbps IEEE 802.1p priority encoding/tagging (QoS, CoS) IEEE 802.1q VLAN tagging IEEE 802.3x flow control USB Requires 3.3V (integrated regulators for core Vdc) Yes Full-duplex; Half-duplex 100BASE-X (half-duplex) 100 Mbps 1000BASE-X (half-duplex) 1000 Mbps 1000BASE-X (full-duplex) 2000 Mbps 32° to 158° F (0°C to 70°C)
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HP Z2 G9 Mini Workstation Desktop PC
Technical Specifications - Networking and Communications
Dimensions (HxW)
1.5 in x 1.7 in. x 0.75 in (3.84 cm x 4.3 cm x 1.9 cm)
Operating System Driver Windows 10 64-bit
Support
Linux®
Intel® Wi-Fi 6E* AX211 802.11ax, BT 5.3, M.2
WLAN Standards
802.11abgn+acR2+axR2(Pre-Standard) MIMO 2x2 High performance, low power dual band Pre-Standard-802.11ax R2 2x2, both with 160MHz channel support Wi-Fi 6E
Antenna
2x2 Dual-Band
Bluetooth Standards 5.2
Operating Temperature 32° to 176° F (0° to 80° C)
Interface
M.2 CNVio2
Dimensions
M.2 2230
Kit Contents
Not Available
*Wi-Fi 6E requires a Wi-Fi 6E router, sold separately, to function in the 6GHz band. Availability of public wireless access points limited. Wi-Fi 6E is backwards compatible with prior 802.11 specs. And available in countries where Wi-Fi 6E is supported.
Intel® Wi-Fi 7 BE200
WLAN Standards
Antenna Bluetooth Standards Operating Temperature Interface Dimensions Kit Contents
802.11abgn+acR2+axR2(Pre-Standard) MIMO 2x2 High performance, low power dual band Pre-Standard-802.11ax R2 2x2, both with 160MHz channel support Wi-Fi 6E 2x2 Dual-Band (External) 5.4 32° to 176° F (0° to 80° C) M.2: PCIe, USB M.2 2230 ANTENNA, External, Dipole, WLAN, WIFI 6E
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Summary of Changes
Date of change: April 13, 2022 May 2, 2022 June 1, 2022 July 8, 2022 July 11, 2022 August 1, 2022 September 1, 2022 November 1, 2022 December 1, 2022 February 24, 2023 March 1, 2023 March 30, 2023 April 1, 2023 April 25, 2023 May 1, 2023 May 11, 2023 June 1, 2023 July 1, 2023 August 1, 2023 October 1, 2023 November 1, 2023 December 1, 2023
Version History: From v1 to v2 From v2 to v3 From v3 to v4 From v4 to v5 From v5 to v6 From v6 to v7 From v7 to v8 From v8 to v9 From v9 to v10 From v10 to v11 From v11 to v12 From v12 to v13 From v13 to v14 From v14 to v15 From v15 to v16 From v16 to v17 From v17 to v18 From v18 to v19 From v19 to v20 From v20 to v21 From v21 to v22 From v22 to v23
December 11, 2023 February 1, 2024 March 1, 2024
From v23 to v24 From v24 to v25 From v25 to v26
March 12, 2024 April 10, 2024 May 1, 2024 June 1, 2024
From v26 to v27 From v27 to v28 From v28 to v29 From v29 to v30
HP Z2 G9 Mini Workstation Desktop PC
Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed Changed
Changed Changed Changed
Changed Changed Changed Changed
Description of change: Social and Environmental Responsibility section Racking and Physical Security section Operating Systems section System Board section Overview, Processors, Graphics, System Board sections Format pages 1-3, Overview section and Supported Components Racking and Physical Security, Other Hardware sections Graphics Adapters and Networking and Communications sections Other Hardware section Operating Systems section Manageability and Graphics Adapters sections Processors section Memory, Networking and Communications section Social and Environmental Responsibility section Other Hardware and System Board sections Front-Side View section Social and Environmental Responsibility section Networking and Communications, Other Hardware, HP BIOS sections ENVIRONMENTAL DATA section Input Devices, HP BIOS sections Input Devices section Graphics, Other Hardware, Social and Environmental Responsibility sections Memory section Social and Environmental Responsibility section Graphics, System Configurations, Declared Noise Emissions and Networking and Communications sections Processors section Other Hardware section Graphics section Storage section
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HP Z2 G9 Mini Workstation Desktop PC
© 2024 HP Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Intel, Intel Core, Pentium, Thunderbolt, vPro and Xeon are trademarks of Intel Corporation in the U.S. and other countries. Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. ENERGY STAR® is a registered trademark owned by the U.S. Environmental Protection Agency. Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries. NVIDIA®, Quadro and the NVIDIA logo are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Red Hat® is a registered trademark of Red Hat, Inc. in the United States and other countries. Bluetooth is a trademark of its proprietor used by HP Inc. under license. DisplayPortTM and the DisplayPortTM logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the United States and other countries.
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