QB20SeriesLoRaModule
-Cost-effective-Small-size-SPI-Interface
QB20 Series LoRa Module
QB20 Serial LoRa SIP Module integrates SX1262 RF transceiver and RF front-end circuit inside. Only an external 32MHz TCXO or passive crystal is required when using it. This module supports LoRa and FSK modulation. The maximum transmit power of the module is up to +22dBm, and the receiving sensitivity can reach -148 dBm. Its unique modulation method makes its anti-interference ability strong. The module package is LGA24, and the size is 8.0mm x 8.0mm x 2.0mm.
Features
- Working Band
– 470~510MHz(L-LRMQB20-77NN4)
– 860~930MHz(L-LRMQB20-97NN4) - Ultra small size
– 8.0mm*8.0mm*2.0mm - Multiple modulation methods
– LoRa, GFSK, FSK - Ultra low power consumption
– Supply Voltage 1.8V to 3.7V. (When the transmit power is +22dBm, the voltage cannot be lower than 3.1V)
– Emission current ≤135mA (max +22dBm)
– Receiving current ≤ 6mA (DC-DC mode, internal current)
– 600uA standby current
– 600nA sleep current - High link budget
– Sensitivity -148±1dBm (SF=12,BW_L=10.4KHz)
– Transmit power Max. +22 dBm - Ultra small size
– 8.0mm*8.0mm*2.0mm - Ultra long transmission range
– 6Km(@SF=12,BW=125KHz, urban environment, LoRa modulation, Max.22dBm transmit) - High privacy
– Using a unique LoRa modulation method, the signal is difficult to capture and analyze. - Communication Interface
– SPI interface,easy to connect
Applications
- Smart home
- Security Monitoring
- Low-power sensors
- Remote control
- Logistics and warehousing
- Industrial control
- Long-Range transmission
Foreword
Lierda Technology Group Co., Ltd. provides the content of this document to support the product design of its customers. Customers must design their products in accordance with the specifications and parameters provided in the document. The company does not assume any responsibility for personal injury or property damage caused by improper operation of the customer. Before making a statement, Lierda has the right to update the document.
Copyright statement
The copyright of this document belongs to Lierda Co., Ltd. Anyone who reproduces or reprints this document without the permission of our company shall bear legal responsibility.
Copyright © Lierda Science & Technology Group Co.,Ltd
Document Revision History
Version | Revision Date | Revision Description |
Beta | 11/12/2021 | Initial version |
Beta | 1/18/2022 | Reference Design,External 32MHz TCXO Schematic diagrammodification |
Specifications
Table 1-1 Limit Characteristics
Value | |||
Features | Minimum | Maximum | Remarks |
Input Voltage(V) | -0.5 | 3.9 | |
Maximum RF input power (dBm) | – | 10 | |
Operating temperature (℃) | -40 | 85 |
Table 1-2 Working Characteristics1
Features | Value | |||
Min | Typ | Max | Remarks | |
Operating Voltage(V) | 2. | 3. | 4. | |
Operating temperature(t) | -40 | 85 | ||
Operating Band (MHz) | L-LRMQB20-77NN4 | |||
433 | – | 510 | Working frequency can be customized2 | |
L-LRMQB20-97NN4 | ||||
860 | – | 930 | Working frequency can be customized2 | |
TX Current(mA) | L-LRMQB20-77NN4 | |||
70 | 80 | 90 | DC-DC Mode, 17dBm TX3 | |
90 | 107 | 125 | DC-DC Mode, 22dBm TX° | |
L-LRMQB20-97NN4 | ||||
40 | 50 | 60 | DC-DC Mode, 14dBm TX° | |
100 | 120 | 135 | DC-DC Mode, 22dBm TXs | |
RX Current(mA) | L-LRMQB20-77NN4, L-LRMQB20-97NN4 | |||
– | 5.0 | 6 | DC-DC Mode, Internal Current | |
Sleep Current(uA) | – | 0.6 | 2 | Register value will be saved |
Output Power(dBm) | L-LRMQB20-77NN4, L-LRMQB20-97NN4 | |||
– | 22 | – | 22dBm TX: Programmable s | |
RX sensitivity(dBm) | – | -124 | – | BW_L=125KHz,SF=7 |
- The test conditions are: temperature: 25℃, center frequency: 490MHz, working voltage: 3.3V.
- Please configure according to the operating frequency band permitted by local regulations. Please be sure to comply with local regulations for use. If it is used in a frequency band that is not permitted by regulations, our company will not bear any
responsibility. - The output power must be set according to the optimization recommendation. If the setting does not match the recommended value, the power and power consumption may not be optimal, and the module may even be damaged. The configuration is shown in Table 2-2.
- The output power must be set according to the optimization recommendation. If the setting does not match the recommended value, the power and power consumption may not be optimal, and the module may even be damaged. The configuration is shown in Table 2-3.
Datarate | LoRa(bps) | – | – | 62.5K | Programmable |
FSK(bps) | – | – | 300K5 | Programmable |
Modulation | LoRa/GFSK/FSK | Programmable |
Packaging | LGA24 | 1.0mm Spacing |
Interface | SPI | – |
Dimensions (mm) | 8.0*8.0*2.0mm (See Figure 2-1 for details) | – |
Tx Power Configuration
It is necessary to configure the transmit power strictly in accordance with the table, otherwise the product may suffer from poor power consumption, performance degradation or even damage.
The power configuration registers are shown in Table 2-1. When using, you can change the SetTxParams parameter value to change the actual output power. The setting range of SetTxParams is -3~22. When configured to 22, the actual output power can reach maximum+22dBm. Note that the values of the four registers PaDutyCycle, HpMax, DeviceSel, PaLut cannot be changed, otherwise performance degradation or even module damage may occur.
Table 2-1 PA operation mode setting
Actual output power (dBm) | PaDutyCycle | HpMax | DeviceSel | PaLut | Value in SetTxParams |
22 | 0x04 | 0x07 | 0x00 | 0x01 | 22 |
17 | 0x04 | 0x07 | 0x00 | 0x01 | 17 |
Reference codes are as follows:5 The maximum rate is proportional to the radio frequency; for example, the 868/915MHz frequency band is 300kbps, and the 433MHz frequency band is 150kbps;
6 Change the actual output power by changing SetTxParams, the maximum is 22; note that the four register values of PaDutyCycle, HpMax, DeviceSel, PaLut cannot be changed, otherwise performance degradation or module damage will occur;
Module Dimensions
3.1 Dimensions3.2 Pin Definition
Table 3-1 Pin definition
PIN | Name | Description |
P1 | GND | Power-GND |
P2 | GND | Power-GND |
P3 | GND | Power-GND |
P4 | XTA | Crystal oscillator connection, external reference clock input |
P5 | XTB | Crystal oscillator connection |
P6 | DIO3 | Interrupt source mapping pin, or TCXO control |
P7 | VDD | Power-VDD |
P8 | VDD | Power-VDD |
P9 | GND | Power-GND |
P10 | GND | Power-GND |
P11 | DIO1 | Interrupt source mapping pin |
P12 | BUSY | Busy indicator |
P13 | NREST | Reset pin, low active |
P14 | MISO | SPI data output |
P15 | MOSI | SPI data input |
P16 | SCK | SPI clock input |
P17 | NSS | SPI enable |
P18 | CTRL | RF switch control pin; TX:0; RX:1; Sleep:0 (At the same time, you need to enable DIO2 control, SetDIO2AsRfSwitchCtrl) |
P19 | ANT | RF output port |
P20 | GND | Power-GND |
P21 | GND | Power-GND |
P22 | GND | Power-GND |
P23 | GND | Power-GND |
P24 | GND | Power-GND |
Usage
4.1 Reference Design
4.1.1 External 32MHz passive crystal
Tag | Name | Part number | Parameter Description | Factory | packagi ng | Remar k |
C1 | Tantalum capacitor | T491B107K010AT | 100uF/10V/10% | KEMET | Type B | |
C2 | Ceramic capacitor | GRM188R71C104KA01D | 0.1uF/16V/10%/X7R | MURATA | 0603 | |
X1 | Passive crystal | XRCGB32M000F1H12R0 | 12pF/32MHz/10PPM/-40°~85° | MURATA | 2016 | |
C4 | Ceramic capacitor | GRM1555C1H8R2CA01# | 8.2pF/50V/0.25pF/C0G | MURATA | 0402 | |
C5 | Ceramic capacitor | GRM1555C1H6R8BA01D | 6.8pF/50V/0.1pF/C0G | MURATA | 0402 | |
R1 | Standard resistance | / | 0R | / | 0402 |
Table 4-1 Reference BOM
4.1.2 External 32MHz TCXO
Tag | Name | Part number | Parameter Description | Factory | packagi ng | Remar k |
C1 | Tantalum capacitor | T491B107K010AT | 100uF/10V/10% | KEMET | Type B | |
C2 | Ceramic capacitor | GRM188R71C104KA01D | 0.1uF/16V/10%/X7R | MURATA | 0603 | |
X1 | TCXO | X1G0054410305## | 10pF/32MHz/0.5PPM/2.66-3.46 5V/-40°~85° | EPSON | 2016 | |
C3 | Ceramic capacitor | GRM155R71C104KA88*# | 0.1uF/16V/10%/X7R | MURAT | 0402 | |
C4 | Ceramic capacitor | GRM1555C1H100JA01D | 10pF/50V/5%/C0G | MURAT | 0402 | |
R2 | Standard resistance | / | 220R | / | 0402 | |
R1 | Standard resistance | / | 0R | / | 0402 |
Table 4-2 Reference BOM
4.1.2 Layout Attentions
- Try to connect the DIO port to the MCU IO port with external interrupt.
- The traces between the RF output of the module and the antenna pad should be as short as possible.
A 50Ω impedance line should be used, and the ground should be covered. More holes should be punched around the trace. - If allowed, add a π circuit from the RF output of the module to the antenna pad.
- Clearance is required around the antenna, leaving at least a 5mm clearance area.
- Pay attention to grounding, it is best to ensure a large area of ground.
- Keep the module away from high-voltage circuits and high-frequency switching circuits.
- Refer to the application document “RF PCB LAYOUT Design Rules (Applicable to Sub-1GHZ and Bluetooth Module)” for layout and wiring;。
4.2 Software operation
This module is an SPI slave device, and it can communicate with it using the SPI interface of the MCU, and operate its registers and receiving and sending buffers through API commands to complete the wireless data receiving and sending function. For the SPI operation function, the user needs to modify it according to the way his MCU operates the SPI. Please refer to the latest SX1262 data manual for the read and write operation timing of the module register;
Before software development, users can refer to the demo LoRa communication routines provided by our company and the LoRa point-to-point communication in the sample code instruction manual. When porting the code, users mainly need to adjust the SPI according to their own MCU, and then refer to the communication routines.
The point-to-point communication process using a pair of LoRa modules is shown in Figure 4-3. In this communication process example, the transmitter can send data to the receiver through LoRa, and the receiver will return the data packet through LoRa after receiving the data packet. The transmitting end. Communicate cyclically.
Prohibited Frequency
Prohibited Frequencies are the frequencies where the module performs extremely poor, and it is strictly forbidden to use it. The non-recommended frequencies are the frequencies where the module performs poor, and the customer can use it as appropriate.
It is recommended that the frequency used in the application is at least 1MHz away from the forbidden frequencies.
Prohibited Frequencies: 446MHz, 448MHz, 464MHz, 480MHz, 496MHz.
Non-recommended frequencies: 440MHz, 452MHz, 456MHz, 494MHz.
FAQ
6.1 Modules can't communicate even in short distance Confirm whether the configuration on the sending and receiving sides are inconsistent. If the two sides are configured differently, communication is not possible. Abnormal voltage, too low voltage will cause abnormal sending. Check the battery. The voltage of a low-power battery will be pulled down during transmission, causing abnormal transmission. The antenna welding is abnormal, the RF signal does not reach the antenna or the π circuit is welded incorrectly. 6.2 Abnormal power consumption abnormal power consumption. In low-power reception, the timing configuration, etc. is incorrect, resulting in the power consumption not reaching the expected effect. If it is normal to test the module or the MCU alone, the power consumption is abnormal in the joint debugging, which is generally due to the configuration of the MCU pin connected to the radio frequency module. The power consumption of the module will fluctuate in extreme environments such as high temperature, high humidity, and low temperature. 6.3 Short communication distance The impedance matching of the antenna is not done well, resulting in very small transmitted power. Metal and other objects around the antenna cause signal loss. There are other interference signals in the test environment that cause the communication distance of the module to be short. Insufficient power supply causes abnormal transmit power of the module. The test environment is harsh and the signal loss is great. There are a large number of walls in the transmission path where the signal cannot be diffracted, resulting in a large signal loss. The module is too close to the ground. The signal is absorbed and reflected, resulting in poor communication.
Production Guidance
7.1 Stencil Design
The thickness of the stencil should be selected according to the package type of the device in the board, and the following requirements should be paid attention to:
The module pad position can be locally thickened to 0.15~0.20mm to avoid empty soldering;
7.2 Reflow Profile
Note: This work instruction is only suitable for lead-free work and is for reference
Ordering And Packaging
8.1 Part Number table
The Part number of QB20 series module is shown in the following table:
8.2 Product Packaging
This product uses tape and reel packaging. The packaging diagram and description are as follows.
Product placement diagram:
Contact Information
Lierda Technology Group Co., Ltd. always believes in providing customers with the most timely and comprehensive service as its purpose. If you need any help, you can contact the relevant personnel of our company at any time, or contact as follows:
Documentation website: http://wsn.lierda.com
Support email: lora_support@lierda.com
Technology Forum: http://bbs.lierda.com
Sample purchase: https://lierda.taobao.com
Federal Communication Commission (FCC) Radiation Exposure Statement
When using the product, maintain a distance of 20cm from the body to ensure compliance with RF exposure requirements.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired
operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna.
- style="text-align: justify">Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.>
FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES
The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.
The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC
ID: 2AOFDQB20. Additionally, the following statement should be included on the label and in
the final product’s user manual: “This device complies with Part 15 of the FCC Rules.
Operation is subject to the following
two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.”
The module is allowed to be installed in mobile and portable applications A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end‐use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCCapplication filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together.
This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations(e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable.(OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user.Documents / Resources
Lierda QB20 Series LoRa Module [pdf] User Guide
QB20, 2AOFDQB20, QB20 Series LoRa Module, QB20 Series, LoRa Module, ModuleReferences