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Lierda QB20 Series LoRa Module

QB20 Series LoRa Module

QB20 Serial LoRa SIP Module integrates SX1262 RF transceiver and RF front-end circuit inside. Only an external 32MHz TCXO or passive crystal is required when using it. This module supports LoRa and FSK modulation. The maximum transmit power of the module is up to +22dBm, and the receiving sensitivity can reach -148 dBm. Its unique modulation method makes its anti-interference ability strong. The module package is LGA24, and the size is 8.0mm x 8.0mm x 2.0mm.Lierda QB20 Series LoRa Module - fig

Features

  • Working Band
    – 470~510MHz(L-LRMQB20-77NN4)
    – 860~930MHz(L-LRMQB20-97NN4)
  • Ultra small size
    – 8.0mm*8.0mm*2.0mm
  • Multiple modulation methods
    – LoRa, GFSK, FSK
  • Ultra low power consumption
    – Supply Voltage 1.8V to 3.7V. (When the transmit power is +22dBm, the voltage cannot be lower than 3.1V)
    – Emission current ≤135mA (max +22dBm)
    – Receiving current ≤ 6mA (DC-DC mode, internal current)
    – 600uA standby current
    – 600nA sleep current
  • High link budget
    – Sensitivity -148±1dBm (SF=12,BW_L=10.4KHz)
    – Transmit power Max. +22 dBm
  • Ultra small size
    – 8.0mm*8.0mm*2.0mm
  • Ultra long transmission range
    – 6Km(@SF=12,BW=125KHz, urban environment, LoRa modulation, Max.22dBm transmit)
  • High privacy
    – Using a unique LoRa modulation method, the signal is difficult to capture and analyze.
  • Communication Interface
    – SPI interface,easy to connect

Applications

  • Smart home
  • Security Monitoring
  • Low-power sensors
  • Remote control
  • Logistics and warehousing
  • Industrial control
  • Long-Range transmission

Foreword
Lierda Technology Group Co., Ltd. provides the content of this document to support the product design of its customers. Customers must design their products in accordance with the specifications and parameters provided in the document. The company does not assume any responsibility for personal injury or property damage caused by improper operation of the customer. Before making a statement, Lierda has the right to update the document.
Copyright statement
The copyright of this document belongs to Lierda Co., Ltd. Anyone who reproduces or reprints this document without the permission of our company shall bear legal responsibility.
Copyright © Lierda Science & Technology Group Co.,Ltd

Document Revision History

VersionRevision DateRevision Description
Beta11/12/2021Initial version
Beta1/18/2022Reference Design,External 32MHz TCXO Schematic
diagrammodification

Specifications

Table 1-1 Limit Characteristics

Value
FeaturesMinimumMaximumRemarks
Input Voltage(V)-0.53.9
Maximum RF input power (dBm)10
Operating temperature (℃)-4085

Table 1-2 Working Characteristics1

FeaturesValue
MinTypMaxRemarks
Operating Voltage(V)2.3.4.
Operating temperature(t)-4085
Operating Band (MHz)L-LRMQB20-77NN4
433510Working frequency can be customized2
L-LRMQB20-97NN4
860930Working frequency can be customized2
TX Current(mA)L-LRMQB20-77NN4
708090DC-DC Mode, 17dBm TX3
90107125DC-DC Mode, 22dBm TX°
L-LRMQB20-97NN4
405060DC-DC Mode, 14dBm TX°
100120135DC-DC Mode, 22dBm TXs
RX Current(mA)L-LRMQB20-77NN4, L-LRMQB20-97NN4
5.06DC-DC Mode, Internal Current
Sleep Current(uA)0.62Register value will be saved
Output Power(dBm)L-LRMQB20-77NN4, L-LRMQB20-97NN4
2222dBm TX: Programmable s
RX sensitivity(dBm)-124BW_L=125KHz,SF=7
  1. The test conditions are: temperature: 25℃, center frequency: 490MHz, working voltage: 3.3V.
  2. Please configure according to the operating frequency band permitted by local regulations. Please be sure to comply with local regulations for use. If it is used in a frequency band that is not permitted by regulations, our company will not bear any
    responsibility.
  3. The output power must be set according to the optimization recommendation. If the setting does not match the recommended value, the power and power consumption may not be optimal, and the module may even be damaged. The configuration is shown in Table 2-2.
  4. The output power must be set according to the optimization recommendation. If the setting does not match the recommended value, the power and power consumption may not be optimal, and the module may even be damaged. The configuration is shown in Table 2-3.
DatarateLoRa(bps)62.5KProgrammable
FSK(bps)300K5Programmable
ModulationLoRa/GFSK/FSKProgrammable
PackagingLGA241.0mm Spacing
InterfaceSPI
Dimensions (mm)8.0*8.0*2.0mm (See Figure 2-1 for details)

Tx Power Configuration

It is necessary to configure the transmit power strictly in accordance with the table, otherwise the product may suffer from poor power consumption, performance degradation or even damage.
The power configuration registers are shown in Table 2-1. When using, you can change the SetTxParams parameter value to change the actual output power. The setting range of SetTxParams is -3~22. When configured to 22, the actual output power can reach maximum+22dBm. Note that the values of the four registers PaDutyCycle, HpMax, DeviceSel, PaLut cannot be changed, otherwise performance degradation or even module damage may occur.
Table 2-1 PA operation mode setting 

Actual output power (dBm)PaDutyCycleHpMaxDeviceSelPaLutValue in SetTxParams
220x040x070x000x0122
170x040x070x000x0117

Reference codes are as follows:Lierda QB20 Series LoRa Module - Reference codes5 The maximum rate is proportional to the radio frequency; for example, the 868/915MHz frequency band is 300kbps, and the 433MHz frequency band is 150kbps;
6 Change the actual output power by changing SetTxParams, the maximum is 22; note that the four register values of PaDutyCycle, HpMax, DeviceSel, PaLut cannot be changed, otherwise performance degradation or module damage will occur;

Module Dimensions

3.1 DimensionsLierda QB20 Series LoRa Module - Dimensions3.2 Pin Definition
Table 3-1 Pin definition

PINNameDescription
P1GNDPower-GND
P2GNDPower-GND
P3GNDPower-GND
P4XTACrystal oscillator connection, external reference clock input
P5XTBCrystal oscillator connection
P6DIO3Interrupt source mapping pin, or TCXO control
P7VDDPower-VDD
P8VDDPower-VDD
P9GNDPower-GND
P10GNDPower-GND
P11DIO1Interrupt source mapping pin
P12BUSYBusy indicator
P13NRESTReset pin, low active
P14MISOSPI data output
P15MOSISPI data input
P16SCKSPI clock input
P17NSSSPI enable
P18CTRLRF switch control pin; TX:0; RX:1; Sleep:0
(At the same time, you need to enable DIO2 control, SetDIO2AsRfSwitchCtrl)
P19ANTRF output port
P20GNDPower-GND
P21GNDPower-GND
P22GNDPower-GND
P23GNDPower-GND
P24GNDPower-GND

Usage

4.1 Reference Design
4.1.1 External 32MHz passive crystalLierda QB20 Series LoRa Module - passive crystal

TagNamePart numberParameter DescriptionFactorypackagi ngRemar k
C1Tantalum capacitorT491B107K010AT100uF/10V/10%KEMETType B
C2Ceramic capacitorGRM188R71C104KA01D0.1uF/16V/10%/X7RMURATA0603
X1Passive crystalXRCGB32M000F1H12R012pF/32MHz/10PPM/-40°~85°MURATA2016
C4Ceramic capacitorGRM1555C1H8R2CA01#8.2pF/50V/0.25pF/C0GMURATA0402
C5Ceramic capacitorGRM1555C1H6R8BA01D6.8pF/50V/0.1pF/C0GMURATA0402
R1Standard resistance/0R/0402

Table 4-1 Reference BOM
4.1.2 External 32MHz TCXOLierda QB20 Series LoRa Module - External 32MHz TCXO

TagNamePart numberParameter DescriptionFactorypackagi ngRemar k
C1Tantalum capacitorT491B107K010AT100uF/10V/10%KEMETType B
C2Ceramic capacitorGRM188R71C104KA01D0.1uF/16V/10%/X7RMURATA0603
X1TCXOX1G0054410305##10pF/32MHz/0.5PPM/2.66-3.46

5V/-40°~85°

EPSON2016
C3Ceramic capacitorGRM155R71C104KA88*#0.1uF/16V/10%/X7RMURAT0402
C4Ceramic capacitorGRM1555C1H100JA01D10pF/50V/5%/C0GMURAT0402
R2Standard resistance/220R/0402
R1Standard resistance/0R/0402

Table 4-2 Reference BOM
4.1.2 Layout Attentions

  • Try to connect the DIO port to the MCU IO port with external interrupt.
  • The traces between the RF output of the module and the antenna pad should be as short as possible.
    A 50Ω impedance line should be used, and the ground should be covered. More holes should be punched around the trace.
  • If allowed, add a π circuit from the RF output of the module to the antenna pad.
  • Clearance is required around the antenna, leaving at least a 5mm clearance area.
  • Pay attention to grounding, it is best to ensure a large area of ground.
  • Keep the module away from high-voltage circuits and high-frequency switching circuits.
  • Refer to the application document “RF PCB LAYOUT Design Rules (Applicable to Sub-1GHZ and Bluetooth Module)” for layout and wiring;。

4.2 Software operation
This module is an SPI slave device, and it can communicate with it using the SPI interface of the MCU, and operate its registers and receiving and sending buffers through API commands to complete the wireless data receiving and sending function. For the SPI operation function, the user needs to modify it according to the way his MCU operates the SPI. Please refer to the latest SX1262 data manual for the read and write operation timing of the module register;
Before software development, users can refer to the demo LoRa communication routines provided by our company and the LoRa point-to-point communication in the sample code instruction manual. When porting the code, users mainly need to adjust the SPI according to their own MCU, and then refer to the communication routines.
The point-to-point communication process using a pair of LoRa modules is shown in Figure 4-3. In this communication process example, the transmitter can send data to the receiver through LoRa, and the receiver will return the data packet through LoRa after receiving the data packet. The transmitting end. Communicate cyclically.Lierda QB20 Series LoRa Module - flow chart

Prohibited Frequency

Prohibited Frequencies are the frequencies where the module performs extremely poor, and it is strictly forbidden to use it. The non-recommended frequencies are the frequencies where the module performs poor, and the customer can use it as appropriate.
It is recommended that the frequency used in the application is at least 1MHz away from the forbidden frequencies.
Prohibited Frequencies: 446MHz, 448MHz, 464MHz, 480MHz, 496MHz.
Non-recommended frequencies: 440MHz, 452MHz, 456MHz, 494MHz.

FAQ

6.1 Modules can't communicate even in short distance

Confirm whether the configuration on the sending and receiving sides are inconsistent. If the two sides are configured differently, communication is not possible. Abnormal voltage, too low voltage will cause abnormal sending.  Check the battery. The voltage of a low-power battery will be pulled down during transmission, causing abnormal transmission. The antenna welding is abnormal, the RF signal does not reach the antenna or the π circuit is welded incorrectly.

6.2 Abnormal power consumption

abnormal power consumption. In low-power reception, the timing configuration, etc. is incorrect, resulting in the power consumption not reaching the expected effect. If it is normal to test the module or the MCU alone, the power consumption is abnormal in the joint debugging, which is generally due to the configuration of the MCU pin connected to the radio frequency module. The power consumption of the module will fluctuate in extreme environments such as high temperature, high humidity, and low temperature.

6.3 Short communication distance

The impedance matching of the antenna is not done well, resulting in very small transmitted power. Metal and other objects around the antenna cause signal loss. There are other interference signals in the test environment that cause the communication distance of the module to be short. Insufficient power supply causes abnormal transmit power of the module. The test environment is harsh and the signal loss is great.  There are a large number of walls in the transmission path where the signal cannot be diffracted, resulting in a large signal loss. The module is too close to the ground. The signal is absorbed and reflected, resulting in poor communication.

Production Guidance

7.1 Stencil Design
The thickness of the stencil should be selected according to the package type of the device in the board, and the following requirements should be paid attention to:
The module pad position can be locally thickened to 0.15~0.20mm to avoid empty soldering;
7.2 Reflow Profile
Note: This work instruction is only suitable for lead-free work and is for referenceLierda QB20 Series LoRa Module - Reflow profile

Ordering And Packaging

8.1 Part Number table
The Part number of QB20 series module is shown in the following table:

le style="height: 5px" width="1075"> Platform Ordering Number Frequency Max Power Packing Quantity Remark SX1262 L-LRMQB20-77NN4 433~510MHz 22dBm Reel packaging 1500 To be released SX1262 L-LRMQB20-97NN4 860~930MHz 22dBm Reel packaging 1500 To be released

8.2 Product Packaging
This product uses tape and reel packaging. The packaging diagram and description are as follows.
Product placement diagram:Lierda QB20 Series LoRa Module - Overall schematic

Contact Information

Lierda Technology Group Co., Ltd. always believes in providing customers with the most timely and comprehensive service as its purpose. If you need any help, you can contact the relevant personnel of our company at any time, or contact as follows:
Documentation website: http://wsn.lierda.com
Support email: lora_support@lierda.com
Technology Forum: http://bbs.lierda.com
Sample purchase: https://lierda.taobao.com
Federal Communication Commission (FCC) Radiation Exposure Statement
When using the product, maintain a distance of 20cm from the body to ensure compliance with RF exposure requirements.
This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired
operation.
NOTE: The manufacturer is not responsible for any radio or TV interference caused by unauthorized modifications or changes to this equipment. Such modifications or changes could void the user’s authority to operate the equipment.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • style="text-align: justify">Increase the separation between the equipment and receiver.
  • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.>

    FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this equipment.
    ORIGINAL EQUIPMENT MANUFACTURER (OEM) NOTES
    The OEM must certify the final end product to comply with unintentional radiators (FCC Sections 15.107 and 15.109) before declaring compliance of the final product to Part 15 of the FCC rules and regulations. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change.
    The OEM must comply with the FCC labeling requirements. If the module’s label is not visible when installed, then an additional permanent label must be applied on the outside of the finished product which states: “Contains transmitter module FCC
    ID: 2AOFDQB20. Additionally, the following statement should be included on the label and in
    the final product’s user manual: “This device complies with Part 15 of the FCC Rules.
    Operation is subject to the following
    two conditions: (1) This device may not cause harmful interferences, and (2) this device must accept any interference received, including interference that may cause undesired operation.”
    The module is allowed to be installed in mobile and portable applications A module or modules can only be used without additional authorizations if they have been tested and granted under the same intended end‐use operational conditions, including simultaneous transmission operations. When they have not been tested and granted in this manner, additional testing and/or FCC application filing may be required. The most straightforward approach to address additional testing conditions is to have the grantee responsible for the certification of at least one of the modules submit a permissive change application. When having a module grantee file a permissive change is not practical or feasible, the following guidance provides some additional options for host manufacturers. Integrations using modules where additional testing and/or FCCapplication filing(s) may be required are: (A) a module used in devices requiring additional RF exposure compliance information (e.g., MPE evaluation or SAR testing); (B) limited and/or split modules not meeting all of the module requirements; and (C) simultaneous transmissions for independent collocated transmitters not previously granted together.
    This Module is full modular approval, it is limited to OEM installation ONLY. Integration into devices that are directly or indirectly connected to AC lines must add with Class II Permissive Change. (OEM) Integrator has to assure compliance of the entire end product include the integrated Module. Additional measurements (15B) and/or equipment authorizations(e.g. Verification) may need to be addressed depending on co-location or simultaneous transmission issues if applicable.(OEM) Integrator is reminded to assure that these installation instructions will not be made available to the end user.Lierda - logo

    Documents / Resources

    Lierda QB20 Series LoRa Module [pdf] User Guide
    QB20, 2AOFDQB20, QB20 Series LoRa Module, QB20 Series, LoRa Module, Module

    References

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