ESP32-WROOM-32E & ESP32-WROOM-32UE Technical Specifications
Version 1.6 | Copyright © 2023 Espressif Systems
1. Module Overview
Description:
The ESP32-WROOM-32E and ESP32-WROOM-32UE are versatile Wi-Fi + Bluetooth + Bluetooth LE MCU modules designed for a wide range of applications. They are powerful and flexible, suitable for low-power sensor networks and demanding tasks such as voice encoding, audio streaming, and MP3 decoding. The ESP32-WROOM-32E features an onboard PCB antenna, while the ESP32-WROOM-32UE uses a connector for an external antenna. This document provides information applicable to both modules.
For the latest version of this document, please visit: https://espressif.com/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_cn.pdf
Applications:
- General low-power IoT data loggers
- General low-power IoT sensor hubs
- Camera video streaming
- OTT set-top boxes / set-top boxes
- Voice recognition
- Image recognition
- Mesh networking
- Home automation
- Industrial automation
- Smart agriculture
- Audio devices
- Health/medical/nursing
- Wi-Fi toys
- Wearable electronics
- Retail & catering
- Smart home control panels
- Smart POS applications
1.1 Features
CPU and On-Chip Memory
- Integrated ESP32-D0WD-V3 or ESP32-D0WDR2-V3 chip, featuring an Xtensa dual-core 32-bit LX6 microprocessor with a clock frequency up to 240 MHz.
- 448 KB ROM
- 520 KB SRAM
- 16 KB RTC SRAM
- ESP32-D0WDR2-V3 chip also includes 2 MB PSRAM.
Wi-Fi
- 802.11b/g/n standard
- Data rates up to 150 Mbps in 802.11n mode
- Supports A-MPDU and A-MSDU aggregation
Bluetooth
- 0.4 µs guard interval
- Operating channel frequency range: 2412 ~ 2484 MHz
- Bluetooth v4.2 BR/EDR and Bluetooth LE standards
- Class-1, Class-2, and Class-3 transmitters
- AFH
- CVSD and SBC
Peripherals
- SD card, UART, SPI, SDIO, I2C, LED PWM, motor PWM, I2S, IR, pulse counters, GPIO, capacitive touch sensors, ADC, DAC, TWAI® (compatible with ISO 11898-1, i.e., CAN specification 2.0)
Module Integrated Components
- 40 MHz crystal oscillator
- 4/8/16 MB SPI flash (optional)
Antenna Selection
- ESP32-WROOM-32E: Onboard PCB antenna
- ESP32-WROOM-32UE: External antenna via connector
Operating Conditions
- Operating voltage/power supply: 3.0 V ~ 3.6 V
- Operating ambient temperature:
- For 85 °C modules: -40 ~ 85 °C
- For 105 °C modules: -40 ~ 105 °C. Note: Only modules with 4/8 MB flash support the 105 °C version; modules with 16 MB flash do not support 105 °C.
Certifications
- Bluetooth BQB certification
- RF certifications: Refer to ESP32-WROOM-32E and ESP32-WROOM-32UE certificates
- Environmental certifications: REACH/RoHS
Reliability Testing
- HTOL/HTSL/uHAST/TCT/ESD
1.2 Description
The ESP32-WROOM-32E and ESP32-WROOM-32UE are general-purpose Wi-Fi + Bluetooth + Bluetooth LE MCU modules. They are powerful and versatile, suitable for low-power sensor networks and demanding tasks such as voice encoding, audio streaming, and MP3 decoding. The ESP32-WROOM-32E uses an onboard PCB antenna, while the ESP32-WROOM-32UE uses a connector for an external antenna. The information in this document applies to both modules.
The modules integrate traditional Bluetooth, low-power Bluetooth, and Wi-Fi. Wi-Fi provides extensive connectivity options, including direct internet connection via a router. Bluetooth enables connection to mobile phones or BLE Beacon broadcasting for signal detection. The ESP32 chip's deep sleep current is less than 5 µA, making it ideal for battery-powered wearable devices. The modules support data rates up to 150 Mbps and transmit power up to 20 dBm, enabling long-range wireless communication. These modules offer industry-leading specifications in terms of integration, transmission range, power consumption, and network connectivity.
The ESP32's operating system is freeRTOS with LwIP, and it includes hardware acceleration for TLS 1.2. The chip also supports secure OTA firmware upgrades, allowing for convenient updates after product deployment.
Module Variant Comparison
The following tables compare the series models for ESP32-WROOM-32E and ESP32-WROOM-32UE:
Table 1: ESP32-WROOM-32E Series Model Comparison
| Order Code | Flash | PSRAM | Ambient Temperature (°C) | Module Dimensions (mm) |
|---|---|---|---|---|
| ESP32-WROOM-32E-N4 | 4 MB (Quad SPI) | - | -40~85 | 18.0 x 25.5 x 3.1 |
| ESP32-WROOM-32E-N8 | 8 MB (Quad SPI) | - | -40~85 | |
| ESP32-WROOM-32E-N16 | 16 MB (Quad SPI) | - | -40~85 | |
| ESP32-WROOM-32E-H4 | 4 MB (Quad SPI) | - | -40~105 | 18.0 x 25.5 x 3.1 |
| ESP32-WROOM-32E-H8 | 8 MB (Quad SPI) | - | -40~105 | |
| ESP32-WROOM-32E-N4R2 | 4 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 | 18.0 x 25.5 x 3.1 |
| ESP32-WROOM-32E-N8R2 | 8 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 | |
| ESP32-WROOM-32E-N16R2 | 16 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 |
1 Notes for this table are consistent with Table 2.
Table 2: ESP32-WROOM-32UE Series Model Comparison
| Order Code | Flash | PSRAM | Ambient Temperature (°C) | Module Dimensions (mm) |
|---|---|---|---|---|
| ESP32-WROOM-32UE-N4 | 4 MB (Quad SPI) | - | -40~85 | 18.0 x 19.2 x 3.2 |
| ESP32-WROOM-32UE-N8 | 8 MB (Quad SPI) | - | -40~85 | |
| ESP32-WROOM-32UE-N16 | 16 MB (Quad SPI) | - | -40~85 | |
| ESP32-WROOM-32UE-H4 | 4 MB (Quad SPI) | - | -40~105 | 18.0 x 19.2 x 3.2 |
| ESP32-WROOM-32UE-H8 | 8 MB (Quad SPI) | - | -40~105 | |
| ESP32-WROOM-32UE-N4R2 | 4 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 | 18.0 x 19.2 x 3.2 |
| ESP32-WROOM-32UE-N8R2 | 8 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 | |
| ESP32-WROOM-32UE-N16R2 | 16 MB (Quad SPI) | 2 MB (Quad SPI)4 | -40~85 |
2 Ambient temperature refers to the recommended ambient temperature outside the Espressif module.
3 For more information on module dimensions, refer to Section 7.1 Module Dimensions.
4 This module uses PSRAM integrated within the chip.
The ESP32-WROOM-32E and ESP32-WROOM-32UE use the ESP32-D0WD-V3 or ESP32-D0WDR2-V3* chip from the ESP32 series. The ESP32-D0WD-V3 and ESP32-D0WDR2-V3 chips are scalable and adaptive. The two CPU cores can be controlled independently. The CPU clock frequency can be adjusted from 80 MHz to 240 MHz. Users can power down the CPU and use the low-power coprocessor to monitor external events or analog values exceeding thresholds. The ESP32 also integrates rich peripherals, including capacitive touch sensors, SD card interface, Ethernet interface, high-speed SPI, UART, I2S, and I2C.
2. Block Diagram
The block diagram illustrates the internal components and connections of the modules.
Figure 1: ESP32-WROOM-32E Block Diagram shows a 40 MHz Crystal, ESP32-D0WD-V3/ESP32-D0WDR2-V3 chip with PSRAM (optional) and QSPI Flash, RF Matching, GPIOs, and Antenna connected to the ESP32-WROOM-32E module.
Figure 2: ESP32-WROOM-32UE Block Diagram shows a similar configuration with a 40 MHz Crystal, ESP32-D0WD-V3/ESP32-D0WDR2-V3 chip with PSRAM (optional) and QSPI Flash, RF Matching, GPIOs, and Antenna connected to the ESP32-WROOM-32UE module.
3. Pin Definition
3.1 Pin Layout
The pin layout diagram shows the approximate location of the module's pins. For a scaled drawing of the actual layout, refer to Section 7.1 Module Dimensions. The ESP32-WROOM-32UE has no keepout zone, and its pin layout is the same as the ESP32-WROOM-32E.
Figure 3: Pin Layout (Top View) depicts the pin arrangement. The module has 38 pins in total.
3.2 Pin Definition
The module has 38 pins. Detailed descriptions are provided in Table 3. Peripheral pin assignments can be found in the "ESP32 Series Chip Technical Reference Manual".
Table 3: Pin Definition
| Name | No. | Type | Function |
|---|---|---|---|
| GND | 1 | P | Ground |
| 3V3 | 2 | P | Power Supply |
| EN | 3 | I | High Level: Chip Enable; Low Level: Chip Disable. Note: The EN pin must not be left floating. |
| SENSOR_VP | 4 | I | GPIO36, ADC1_CH0, RTC_GPIO0 |
| SENSOR_VN | 5 | I | GPIO39, ADC1_CH3, RTC_GPIO3 |
| IO34 | 6 | I/O | GPIO34, ADC1_CH6, RTC_GPIO4 |
| IO35 | 7 | I/O | GPIO35, ADC1_CH7, RTC_GPIO5 |
| IO32 | 8 | I/O | GPIO32, XTAL_32K_P (32.768 kHz crystal input), ADC1_CH4, TOUCH9, RTC_GPIO9 |
| IO33 | 9 | I/O | GPIO33, XTAL_32K_N (32.768 kHz crystal output), ADC1_CH5, TOUCH8, RTC_GPIO8 |
| IO25 | 10 | I/O | GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 |
| IO26 | 11 | I/O | GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 |
| IO27 | 12 | I/O | GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV |
| IO14 | 13 | I/O | GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 |
| IO12 | 14 | I/O | GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 |
| GND | 15 | P | Ground |
| IO13 | 16 | I/O | GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER |
| NC | 17 | - | Not Connected (See note 2) |
| NC | 18 | - | Not Connected (See note 2) |
| NC | 19 | - | Not Connected (See note 2) |
| NC | 20 | - | Not Connected (See note 2) |
| NC | 21 | - | Not Connected (See note 2) |
| NC | 22 | - | Not Connected (See note 2) |
| IO15 | 23 | I/O | GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 |
| IO2 | 24 | I/O | GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 |
| IO0 | 25 | I/O | GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK |
| IO4 | 26 | I/O | GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER |
| IO16 | 27 | I/O | GPIO16, HS1_DATA4, U2RXD, EMAC_CLK_OUT |
| IO17 | 28 | I/O | GPIO17, HS1_DATA5, U2TXD, EMAC_CLK_OUT_180 |
| IO5 | 29 | I/O | GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK |
| IO18 | 30 | I/O | GPIO18, VSPICLK, HS1_DATA7 |
| IO19 | 31 | I/O | GPIO19, VSPIQ, U0CTS, EMAC_TXD0 |
| NC | 32 | - | Not Connected |
| IO21 | 33 | I/O | GPIO21, VSPIHD, EMAC_TX_EN |
| RXD0 | 34 | I/O | GPIO3, U0RXD, CLK_OUT2 |
| TXD0 | 35 | I/O | GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 |
| IO22 | 36 | I/O | GPIO22, VSPIWP, U0RTS, EMAC_TXD1 |
| IO23 | 37 | I/O | GPIO23, VSPID, HS1_STROBE |
| GND | 38 | P | Ground |
Notes for Table 3:
- 1 P: Power; I: Input; O: Output.
- 2 GPIO6 to GPIO11 on the ESP32-D0WD-V3/ESP32-D0WDR2-V3 chip are used to connect to the integrated SPI flash and are not brought out to the module pins.
- 3 For modules with QSPI PSRAM (i.e., using the ESP32-D0WDR2-V3 chip), IO16 is used to connect to the embedded PSRAM and cannot be used for other functions.
3.3 Strapping Pins
Description: The following content is extracted from the "Strapping Pins" section of the "ESP32 Series Chip Technical Reference Manual". The correspondence between the chip's Strapping pins and module pins can be found in Section 5 Module Schematics.
The ESP32 has 5 Strapping pins:
- MTDI
- GPIO0
- GPIO2
- MTDO
- GPIO5
The software can read the strapping values of these 5 pins from the "GPIO_STRAPPING" register. During the chip's system reset (power-on reset, RTC watchdog reset, brown-out reset), the Strapping pins' levels are sampled and stored in latches, set to "0" or "1", and remain so until the chip is powered off or disabled. Each Strapping pin has an internal pull-up/pull-down resistor. If a Strapping pin is not externally connected or its external connection is in a high-impedance state, the internal weak pull-up/pull-down resistor determines the default input level. To change the Strapping value, users can apply external pull-down/pull-up resistors or use the host MCU's GPIO to control the Strapping pin level during ESP32 power-on reset. After reset is released, Strapping pins function the same as regular pins.
Table 4: Strapping Pins details the boot modes based on Strapping pin configurations.
| Pin | Default | Internal LDO (VDD_SDIO) Voltage | System Boot Mode | SPI Boot Mode |
|---|---|---|---|---|
| MTDI | Pull-down | 3.3 V | 0 | 1 |
| MTDI | Pull-down | 1.8 V | 1 | 0 |
Table 4 (Continued): Strapping Pins
| Pin | Default | System Boot Mode | SPI Boot Mode |
|---|---|---|---|
| GPIO0 | Pull-up | 1 | 0 |
| GPIO2 | Pull-down | 0 | 1 |
Table 4 (Continued): Strapping Pins
| Pin | Default | Control UOTXD print during system boot | UOTXD print during normal boot |
|---|---|---|---|
| MTDO | Pull-up | 1 | 0 |
Table 4 (Continued): Strapping Pins
| Pin | Default | SDIO Slave Signal Timing (Falling edge sample) | SDIO Slave Signal Timing (Falling edge output) | SDIO Slave Signal Timing (Rising edge sample) | SDIO Slave Signal Timing (Rising edge output) |
|---|---|---|---|---|---|
| MTDO | Pull-up | 0 | 0 | 1 | 1 |
| GPIO5 | Pull-up | 0 | 1 | 0 | 1 |
* Firmware can configure register bits to change the "Internal LDO (VDD_SDIO) Voltage" and "SDIO Slave Signal Timing" settings after boot.
* Due to the module's integrated 3.3 V SPI flash, MTDI cannot be set to 1 during power-on.
Figure 4 shows the setup and hold times for the CHIP_PU pin before and after power-on. Table 5 describes the parameters.
Figure 4: Strapping Pin Setup and Hold Times
Table 5: Strapping Pin Setup and Hold Time Parameters
| Parameter | Description | Min | Unit |
|---|---|---|---|
| t0 | Setup time before CHIP_PU power-on | 0 | ms |
| t1 | Hold time after CHIP_PU power-on | 1 | ms |
4. Electrical Characteristics
4.1 Absolute Maximum Ratings
Exceeding the absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Table 6: Absolute Maximum Ratings
| Symbol | Parameter | Min | Max | Unit |
|---|---|---|---|---|
| VDD33 | Supply Voltage | -0.3 | 3.6 | V |
| TSTORE | Storage Temperature | -40 | 105 | °C |
* Refer to the "ESP32 Series Chip Technical Reference Manual" Appendix for IO MUX information.
4.2 Recommended Operating Conditions
Table 7: Recommended Operating Conditions
| Symbol | Parameter | Min | Typical | Max | Unit | |
|---|---|---|---|---|---|---|
| VDD33 | Power Pin Voltage | 3.0 | 3.3 | 3.6 | V | |
| IDD | External Power Supply Current | - | 0.5 | - | A | |
| TA | Operating Ambient Temperature | 85 °C version | -40 | - | 85 | °C |
| 105 °C version | -40 | - | 105 |
4.3 DC Electrical Characteristics (3.3 V, 25 °C)
Table 8: DC Electrical Characteristics (3.3 V, 25 °C)
| Symbol | Parameter | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| CIN | Pin Capacitance | - | 2 | - | pF |
| VIH | High Level Input Voltage | 0.75 × VDD1 | - | VDD + 0.3 | V |
| VIL | Low Level Input Voltage | -0.3 | - | 0.25 × VDD1 | V |
| IIH | High Level Input Current | - | - | 50 | nA |
| IIL | Low Level Input Current | - | - | 50 | nA |
| VOH | High Level Output Voltage | 0.8 × VDD1 | - | - | V |
| VOL | Low Level Output Voltage | - | - | 0.1 × VDD1 | V |
Table 8 (Continued): DC Electrical Characteristics
| Symbol | Parameter | Min | Typical | Max | Unit | |
|---|---|---|---|---|---|---|
| IOH | High Level Output Current (VDD1 = 3.3 V, VOH ≥ 2.64 V, Pin output strength set to Max) | VDD3P3_CPU power domain1,2 | - | 40 | - | mA |
| VDD3P3_RTC power domain1,2 | - | 40 | - | mA | ||
| VDD_SDIO power domain1,3 | - | 20 | - | mA | ||
| IOL | Low Level Output Current (VDD1 = 3.3 V, VOL = 0.495 V, Pin output strength set to Max) | - | 28 | - | mA | |
| RPU | Pull-up Resistor | - | 45 | - | kΩ | |
| RPD | Pull-down Resistor | - | 45 | - | kΩ | |
| VIL_NRST | Low Level Input Voltage for CHIP_PU when chip is powered off | - | - | 0.6 | V |
1 VDD is the I/O power supply. Refer to the "ESP32 Series Chip Technical Reference Manual" Appendix for IO MUX information.
2 VDD3P3_CPU and VDD3P3_RTC power domain pin pull-up/down currents decrease with increasing pin count, from approximately 40 mA down to 29 mA.
3 VDD_SDIO power domain pins do not include pins connected to flash and/or PSRAM.
4.4 Power Consumption Characteristics
The module employs advanced power management techniques, allowing it to switch between different power modes. For descriptions of these modes, refer to the RTC and Low Power Management chapters in the "ESP32 Series Chip Technical Reference Manual".
Table 9: RF Power Consumption
| Work Mode | Description | Average (mA) | Peak (mA) |
|---|---|---|---|
| TX (Active RF Operation) | 802.11b, 20 MHz, 1 Mbps, @19.5 dBm | 239 | 379 |
| 802.11g, 20 MHz, 54 Mbps, @15 dBm | 190 | 276 | |
| 802.11n, 20 MHz, MCS7, @13 dBm | 183 | 258 | |
| 802.11n, 40 MHz, MCS7, @13 dBm | 165 | 211 | |
| RX (Active RF Operation) | 802.11b/g/n, 20 MHz | 112 | 112 |
| 802.11n, 40 MHz | 118 | 118 |
1 Power consumption data is based on a 3.3 V supply and 25 °C ambient temperature, measured at the RF interface. All transmit data is measured with a 50% duty cycle.
2 When measuring RX power consumption, peripherals are off and the CPU is in idle state.
4.5 Wi-Fi RF Characteristics
4.5.1 Wi-Fi RF Standards
Table 10: Wi-Fi RF Standards
| Name | Description |
|---|---|
| Operating Channel Center Frequency Range1 | 2412~2484 MHz |
| Wi-Fi Protocol | IEEE 802.11b/g/n |
| Data Rate | 11b: 1, 2, 5.5, 11 Mbps |
| 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps | |
| 11n: MCS0-7, 72.2 Mbps (Max) | |
| Data Rate (40 MHz) | 11n: MCS0-7, 150 Mbps (Max) |
| Antenna Type2 | PCB Antenna, External Antenna |
1 The operating channel center frequency range should comply with national or regional regulations. Software can configure the operating channel center frequency range.
2 For modules with external antennas, the output impedance is 50 Ω. Modules without external antennas do not need to consider output impedance.
4.5.2 Transmitter Performance Specifications
You can configure the target transmitter power according to product or certification requirements. Default power is detailed in Table 11.
Table 11: Transmitter Power Specifications
| Rate | Typical Value (dBm) |
|---|---|
| 11b, 1 Mbps | 19.5 |
| 11b, 11 Mbps | 19.5 |
| 11g, 6 Mbps | 18 |
| 11g, 54 Mbps | 14 |
| 11n, HT20, MCS0 | 18 |
| 11n, HT20, MCS7 | 13 |
| 11n, HT40, MCS0 | 18 |
| 11n, HT40, MCS7 | 13 |
4.5.3 Receiver Performance Specifications
Table 12: Receiver Sensitivity
| Rate | Typical Value (dBm) |
|---|---|
| 1 Mbps | -97 |
| 2 Mbps | -94 |
| 5.5 Mbps | -92 |
| 11 Mbps | -88 |
| 6 Mbps | -93 |
| 9 Mbps | -91 |
| 12 Mbps | -89 |
| 18 Mbps | -87 |
| 24 Mbps | -84 |
| 36 Mbps | -80 |
| 48 Mbps | -77 |
| 54 Mbps | -75 |
| 11n, HT20, MCS0 | -92 |
| 11n, HT20, MCS1 | -88 |
| 11n, HT20, MCS2 | -86 |
| 11n, HT20, MCS3 | -83 |
| 11n, HT20, MCS4 | -80 |
| 11n, HT20, MCS5 | -76 |
| 11n, HT20, MCS6 | -74 |
| 11n, HT20, MCS7 | -72 |
| 11n, HT40, MCS0 | -89 |
| 11n, HT40, MCS1 | -85 |
| 11n, HT40, MCS2 | -83 |
| 11n, HT40, MCS3 | -80 |
| 11n, HT40, MCS4 | -76 |
| 11n, HT40, MCS5 | -72 |
| 11n, HT40, MCS6 | -71 |
| 11n, HT40, MCS7 | -69 |
Table 13: Maximum Input Level
| Rate | Typical Value (dBm) |
|---|---|
| 11b, 1 Mbps | 5 |
| 11b, 11 Mbps | 5 |
| 11g, 6 Mbps | 0 |
| 11g, 54 Mbps | -8 |
| 11n, HT20, MCS0 | 0 |
| 11n, HT20, MCS7 | -8 |
| 11n, HT40, MCS0 | 0 |
| 11n, HT40, MCS7 | -8 |
Table 14: Adjacent Channel Selectivity
| Rate | Typical Value (dB) |
|---|---|
| 11b, 11 Mbps | 35 |
| 11g, 6 Mbps | 27 |
| 11g, 54 Mbps | 13 |
| 11n, HT20, MCS0 | 27 |
| 11n, HT20, MCS7 | 12 |
| 11n, HT40, MCS0 | 16 |
| 11n, HT40, MCS7 | 7 |
4.6 Bluetooth RF Characteristics
4.6.1 Receiver - Basic Rate (BR) Specifications
Table 15: Receiver Characteristics - Basic Rate (BR)
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Sensitivity @0.1% BER | - | -90 | -89 | -88 | dBm |
| Maximum Input Signal @0.1% BER | - | 0 | - | - | dBm |
| Co-channel Rejection C/I | - | +7 | - | - | dB |
| Adjacent Channel Selectivity C/I | F = F0 + 1 MHz | - | -6 | - | dB |
| F = F0 - 1 MHz | - | -6 | - | dB | |
| F = F0 + 2 MHz | - | -25 | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 - 2 MHz | - | -33 | - | dB |
| F = F0 + 3 MHz | - | -25 | - | dB | |
| F = F0 - 3 MHz | - | -45 | - | dB | |
| Out-of-Band Blocking | 30 MHz ~ 2000 MHz | - | -10 | - | dBm |
| 2000 MHz ~ 2400 MHz | - | -27 | - | dBm | |
| 2500 MHz ~ 3000 MHz | - | -27 | - | dBm | |
| 3000 MHz ~ 12.5 GHz | - | -10 | - | dBm | |
| Intermodulation | - | -36 | - | - | dBm |
4.6.2 Transmitter - Basic Rate (BR) Specifications
Table 16: Transmitter Characteristics - Basic Rate (BR)
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| RF Transmit Power | - | 0 | - | - | dBm |
| Gain Control Step Size | - | - | 3 | - | dB |
| RF Power Control Range | - | -12 | - | +9 | dBm |
| 20 dB Bandwidth | F = F0 ± 2 MHz | - | 0.9 | - | MHz |
| Adjacent Channel Transmit Power | F = F0 ± 3 MHz | - | -55 | - | dBm |
| F = F0 + > 3 MHz | - | -59 | - | dBm | |
| Δfavg | - | - | 155 | - | kHz |
| f2max | - | - | 127 | - | kHz |
| f2avg / Δfavg | - | - | 0.92 | - | - |
| ICFT | - | - | 7 | - | kHz |
| Drift Rate | - | - | 0.7 | - | kHz/50 µs |
| Deviation (DH1) | - | - | 6 | - | kHz |
| Deviation (DH5) | - | - | 6 | - | kHz |
* There are 8 power levels from 0 to 7, with transmit power ranging from -12 dBm to 9 dBm. Each power level increase corresponds to a 3 dB increase in transmit power. Power level 4 is used by default, corresponding to 0 dBm transmit power.
4.6.3 Receiver - Enhanced Data Rate (EDR) Specifications
Table 17: Receiver Characteristics - Enhanced Data Rate (EDR)
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Sensitivity @0.01% BER | π/4 DQPSK | -90 | -89 | -88 | dBm |
| 8DPSK | -84 | -83 | -82 | dBm | |
| Maximum Input Signal @0.01% BER | π/4 DQPSK | 0 | - | - | dBm |
| 8DPSK | -5 | - | - | dBm | |
| Co-channel Rejection C/I | π/4 DQPSK | 11 | - | - | dB |
| 8DPSK | 18 | - | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 + 1 MHz | - | 2 | - | dB |
| F = F0 - 1 MHz | - | 2 | - | dB | |
| F = F0 + 2 MHz | - | -25 | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 - 2 MHz | - | -35 | - | dB |
| F = F0 + 3 MHz | - | -25 | - | dB | |
| F = F0 - 3 MHz | - | -45 | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 + 1 MHz | - | 2 | - | dB |
| F = F0 - 1 MHz | - | 2 | - | dB | |
| F = F0 + 2 MHz | - | -25 | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 - 2 MHz | - | -25 | - | dB |
| F = F0 + 3 MHz | - | -25 | - | dB | |
| F = F0 - 3 MHz | - | -38 | - | dB |
4.6.4 Transmitter - Enhanced Data Rate (EDR) Specifications
Table 18: Transmitter Characteristics - Enhanced Data Rate (EDR)
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| RF Transmit Power (See note 1 in Table 16) | - | 0 | - | +9 | dBm |
| Gain Control Step Size | - | - | 3 | - | dB |
| RF Power Control Range | - | -12 | - | +9 | dBm |
| π/4 DQPSK max w0 | - | - | 0.72 | - | kHz |
| π/4 DQPSK max wi | - | - | -6 | - | kHz |
| π/4 DQPSK max |wi + w0| | - | - | -7.42 | - | kHz |
| 8DPSK max w0 | - | - | 0.7 | - | kHz |
| 8DPSK max wi | - | - | -9.6 | - | kHz |
| 8DPSK max |wi + w0| | - | - | -10 | - | kHz |
| π/4 DQPSK Modulation Accuracy | RMS DEVM | - | 4.28 | - | % |
| 99% DEVM | - | 100 | - | % | |
| Peak DEVM | - | 13.3 | - | % | |
| 8 DPSK Modulation Accuracy | RMS DEVM | - | 5.8 | - | % |
| 99% DEVM | - | 100 | - | % | |
| Peak DEVM | - | 14 | - | % |
4.7 Low Power Bluetooth RF Characteristics
4.7.1 Receiver
Table 19: Low Power Bluetooth Receiver Characteristics
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Sensitivity @30.8% PER | - | -94 | -93 | -92 | dBm |
| Maximum Input Signal @30.8% PER | - | 0 | - | - | dBm |
| Co-channel Rejection C/I | - | +10 | - | - | dB |
| Alternate Channel Selectivity C/I | F = F0 + 1 MHz | - | -5 | - | dB |
| F = F0 - 1 MHz | - | -5 | - | dB | |
| F = F0 + 2 MHz | - | -25 | - | dB | |
| Alternate Channel Selectivity C/I | F = F0 - 2 MHz | - | -35 | - | dB |
| F = F0 + 3 MHz | - | -25 | - | dB | |
| F = F0 - 3 MHz | - | -45 | - | dB | |
| Out-of-Band Blocking | 30 MHz ~ 2000 MHz | - | -10 | - | dBm |
| 2000 MHz ~ 2400 MHz | - | -27 | - | dBm | |
| 2500 MHz ~ 3000 MHz | - | -27 | - | dBm | |
| 3000 MHz ~ 12.5 GHz | - | -10 | - | dBm | |
| Intermodulation | - | -36 | - | - | dBm |
4.7.2 Transmitter
Table 20: Low Power Bluetooth Transmitter Characteristics
| Parameter | Condition | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| RF Transmit Power (See note 1 in Table 16) | - | 0 | - | +9 | dBm |
| Gain Control Step Size | - | - | 3 | - | dB |
| RF Power Control Range | - | -12 | - | +9 | dBm |
| Adjacent Channel Transmit Power | F = F0 ± 2 MHz | - | -55 | - | dBm |
| F = F0 ± 3 MHz | - | -57 | - | dBm | |
| F = F0 + > 3 MHz | - | -59 | - | dBm | |
| Δfavg | - | - | 210 | - | kHz |
| Δf2max | - | - | 265 | - | kHz |
| f2avg / Δfavg | - | - | 0.92 | - | - |
| ICFT | - | - | 10 | - | kHz |
| Drift Rate | - | - | 0.7 | - | kHz/50 µs |
| Deviation | - | - | 2 | - | kHz |
5. Module Schematics
The module schematics show the circuit diagrams of the internal components of the module.
Figure 5: ESP32-WROOM-32E Schematic Diagram
Figure 6: ESP32-WROOM-32UE Schematic Diagram
6. External Design Schematics
This section provides application circuit diagrams for connecting the module with external components such as power supply, antenna, reset button, JTAG interface, and UART interface.
Figure 7: External Circuit Diagram
EPAD Pin 39: This pin can be left unconnected to the PCB, but connecting it to the PCB's GND can improve heat dissipation. If you choose to connect EPAD to the PCB, ensure proper solder paste application.
EN Pin: To ensure stable power supply to the ESP32 chip during power-on, an RC delay circuit should be added at the EN pin. An RC combination of R = 10 kΩ and C = 1 µF is generally recommended. The specific values may need adjustment based on the module's power-on timing and the chip's reset timing. Refer to the Power Management chapter of the "ESP32 Series Chip Technical Reference Manual" for the ESP32 chip's power-on reset timing diagram.
7. Module Dimensions and PCB Footprints
7.1 Module Dimensions
Figure 8: ESP32-WROOM-32E Module Dimensions shows the physical dimensions of the ESP32-WROOM-32E module.
Figure 9: ESP32-WROOM-32UE Module Dimensions shows the physical dimensions of the ESP32-WROOM-32UE module.
7.2 Recommended PCB Footprint
This section provides recommended PCB footprints for the modules.
Figure 10: ESP32-WROOM-32E Recommended PCB Footprint shows the recommended footprint for the ESP32-WROOM-32E module, including dimensions for copper pads and vias.
Figure 11: ESP32-WROOM-32UE Recommended PCB Footprint shows the recommended footprint for the ESP32-WROOM-32UE module, including dimensions for copper pads and vias.
Source files for the PCB footprints are available for measurement of dimensions not explicitly labeled in Figures 10 and 11. Autodesk Viewer can be used to view these source files. 3D models (.STEP format) for ESP32-WROOM-32E and ESP32-WROOM-32UE are also available.
7.3 Antenna Connector Dimensions
The ESP32-WROOM-32UE uses the first-generation external antenna connector, which is compatible with:
- Hirose U.FL series connectors
- I-PEX MHF I connectors
- Amphenol AMC connectors
Figure 12: External Antenna Connector Dimensions provides the dimensions for the external antenna connector.
8. Module Handling
8.1 Storage Conditions
Products sealed in moisture barrier bags (MBB) should be stored in a non-condensing environment at < 40 °C / 90% RH. The module's Moisture Sensitivity Level (MSL) is Level 3. After the vacuum bag is opened, the product must be used within 168 hours under conditions of 25 ± 5 °C and 60% RH. Otherwise, it must be baked before being put back into use.
8.2 Electrostatic Discharge (ESD)
- Human Body Model (HBM): ±2000 V
- Charged Device Model (CDM): ±500 V
8.3 Reflow Soldering Temperature Curve
It is recommended that the module undergo reflow soldering only once.
Figure 13: Reflow Soldering Temperature Curve illustrates the recommended temperature profile for reflow soldering, including preheating, soaking, reflow, and cooling zones. It specifies temperature ranges, time durations, and ramp rates.
8.4 Ultrasonic Vibration
Avoid exposing Espressif modules to ultrasonic vibration equipment such as ultrasonic welding machines or ultrasonic cleaning machines. The vibration from ultrasonic equipment may resonate with the module's internal crystal oscillator, potentially causing it to malfunction or degrade performance.
Revision History
Table: Revision History
| Date | Version | Description of Release |
|---|---|---|
| 2023-01-18 | v1.6 | Major Update:
|
| 2022-07-20 | v1.5 | Added module models integrating ESP32-D0WDR2-V3. Added Table 1: ESP32-WROOM-32E Series Model Comparison and Table 2: ESP32-WROOM-32UE Series Model Comparison. Added Figure 4 and Table in Section 3.3: Strapping Pins. Updated Section 8: Module Handling. Added RF certification link in Section 1.1. Corrected pin name typo in Figure 7. |
| 2022-02-22 | v1.4 | Added 105 °C modules. Updated Table 6: Absolute Maximum Ratings. Updated Table 7: Recommended Operating Conditions. Replaced "Espressif Product Ordering Information" with Espressif Product Selector. Updated description of TWAI in Section 1.1: Features. Added a note below Figure 9: ESP32-WROOM-32UE Module Dimensions. Updated image format. |
| 2021-11-08 | v1.3 | Updated document format. Updated Figure 10: ESP32-WROOM-32E Recommended PCB Footprint, Figure 11: ESP32-WROOM-32UE Recommended PCB Footprint, Figure 8: ESP32-WROOM-32E Module Dimensions, and Figure 9: ESP32-WROOM-32UE Module Dimensions. Updated description below Figure 13: Reflow Soldering Temperature Curve. Changed TWAITM to TWAI®. |
| 2021-02-09 | v1.2 | Updated Table 9. Added explanation for EPAD in Section 7.2 Recommended PCB Footprint. Updated explanation for RC circuit in Section 6 External Design Schematics. |
| 2020-11-02 | v1.1 | Official Release |
| 2020-05-29 | v1.0 | Pre-release |
| 2020-05-18 | v0.5 | Preliminary |