CBx Series Modules-Tuya Developer Platform-Tuya Developer
Owner's Manual for tuya models including: BZBK002, 2BCSG-BZBK002, 2BCSGBZBK002, CB2S Embedded Low Power Wi-Fi Module, CB2S, Embedded Low Power Wi-Fi Module, Low Power Wi-Fi Module, Wi-Fi Module, Module
Shenzhen Linktop IOT Co., Ltd BZBK002 2BCSG-BZBK002 2BCSGBZBK002 bzbk002
File Info : application/pdf, 29 Pages, 1.05MB
DocumentDocumentCB2S Module Datasheet Version: 20240902 Online Version Contents Contents 1. Product overview ................................................................ 2 1.1. Features ......................................................................................... 2 1.2. Applications ................................................................................... 2 2. Module interfaces ............................................................... 4 2.1. Dimensions and package ............................................................... 4 2.2. Pin definition .................................................................................. 5 3. Electrical parameters .......................................................... 9 3.1. Absolute electrical parameters ...................................................... 9 3.2. Normal working conditions ............................................................ 9 3.3. RF power consumption ................................................................ 10 3.4. Working current ........................................................................... 10 4. RF parameters .................................................................. 13 4.1. Basic RF features ......................................................................... 13 4.2. Wi-Fi transmission performance ................................................... 13 4.3. Wi-Fi receiving performance ........................................................ 13 4.4. Bluetooth transmission performance ........................................... 14 4.5. Bluetooth receiving performance ................................................. 14 5. Antenna information ......................................................... 16 5.1. Antenna type ............................................................................... 16 5.2. Antenna interference reduction ................................................... 16 6. Packaging information and production instructions ............. 17 6.1. Mechanical dimensions ................................................................ 17 6.2. Production instructions ................................................................ 19 6.3. Recommended oven temperature curve and temperature .......... 21 6.4. Storage conditions ....................................................................... 22 7. MOQ and packaging information ........................................ 24 I 1Product overview CB2S is an embedded low-power Wi-Fi module that Tuya has developed. It consists of a highly integrated RF chip BK7231N and a few peripherals. CB2S not only supports the Wi-Fi AP and STA modes, but also supports the Bluetooth LE. 1 / 27 1. Product overview 1Product overview CB2S is built in with a 32-bit MCU whose running speed can be up to 120 MHz, a 2-MB flash memory, and a 256-KB RAM, so as to support the Tuya IoT cloud connection. The MCU instructions specially extended for signal processing can effectively implement audio encoding and decoding. Besides, it has rich peripherals, such as PWM and UART. There are 5 channels of 32-bit PWM output, making the chip very suitable for high-quality LED control. 1.1. Features · Built in with the low-power 32-bit CPU, which can also function as an application processor · The clock rate: 120 MHz · Working voltage: 3.0 to 3.6V · Peripherals: 5 PWMs and 1 UART · Wi-Fi connectivity · 802.11 b/g/n · Channels 1 to 11@2.4 GHz · Support WEP, WPA/WPA2, WPA/WPA2 PSK (AES), WPA3 security modes · Up to +13 dBm output power in 802.11b mode · Support STA/AP/STA+AP working mode · Support SmartConfig and AP network configuration manners for Android and iOS devices · Onboard PCB antenna with a gain of 0.13 dBi · Working temperature: -40°C to 85°C · Bluetooth connectivity · Support the Bluetooth LE V5.2 · Support the transmit power of 6 dBm in the Bluetooth mode · Complete Bluetooth coexistence interface · Onboard PCB antenna with a gain of 0.13 dBi 1.2. Applications 2 / 27 · Intelligent building · Smart household and home appliances · Smart socket and light · Industrial wireless control · Baby monitor · Network camera · Intelligent bus 2.3Module interfaces 3 / 27 2. Module interfaces 2.3Module interfaces 2.1. Dimensions and package The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×2.8±0.15 mm (H). The dimensions of CB2S are as follows: 4 / 27 3.2Electrical parameters 2.2. Pin definition Pin number 1 Symbol 3V3 2 P6 3 GND 4 P7 I/O type P I/O P I/O Function Power supply 3V3 Support hardware PWM and correspond to P6 of the IC Power supply reference ground Support hardware PWM and correspond to P7 of the IC 5 / 27 Pin number 5 6 7 8 Symbol RX1 P8 TX1 ADC 3.3Electrical parameters I/O type I/O I/O I/O I/O Function UART_RX1 , which is used for receiving user data and corresponds to P10 of the IC. Do not pull it up. By default, the MCU serial port should be in low-level or high-impedance state. Support hardware PWM and correspond to P8 of the IC UART_TX1 , which is used for transmitting user data and corresponds to P11 of the IC. Do not pull it up. By default, the MCU serial port should be in low-level or high-impedance state. ADC, which corresponds to P23 of the IC 6 / 27 Pin number 9 10 11 Symbol P24 CEN P26 Test point RX2 Test point TX2 3.3Electrical parameters I/O type I/O I/O I/O I/O I/O Function Support hardware PWM and correspond to P24 of the IC Reset pin Support hardware PWM and correspond to P26 of the IC UART_RX2 , which corresponds to P1 of the IC. This pin is not allowed to use. UART_TX2 , which is used for outputting logs and corresponds to P0 of the IC 7 / 27 Pin number Symbol Test point CSN 3.3Electrical parameters I/O type I/O Function Mode selection pin. If it is connected to the ground before being powered on, enter the firmware test mode. If it is not connected or connected to VCC before being powered on, enter the firmware application mode. It corresponds to P21 of the IC. Note: · P indicates a power supply pin and I/O indicates an input/output pin. · For the MCU solution, see CBx Module . 8 / 27 3. Electrical parameters 3.3Electrical parameters 3.1. Absolute electrical parameters Parameter Description Ts VBAT Static electricity discharge voltage (human body model) Static electricity discharge voltage (machine model) Storage temperature Power supply voltage TAMB-25°C TAMB-25°C Minimum value -55 -0.3 -4 -200 Maximum value 125 3.9 4 200 Unit °C V KV V 3.2. Normal working conditions Parameter Description Working Ta temperature Power Minimum value -40 VBAT supply 3 voltage Typical value - 3.3 Maximum value 85 3.6 Unit °C V 9 / 27 4.3RF parameters Parameter Description I/O low Minimum value VOL level VSS output I/O high VOH level VBAT-0. 3 output I/O drive Imax - current Power supply 100 slope Typical value Maximum value - VSS+0.3 - VBAT 6 20 - - Unit V V mA mV/ms 3.3. RF power consumption Working status Mode Transmit 11b Transmit 11g Transmit 11n Receive 11b Receive 11g Receive 11n Rate 11Mbps 54Mbps MCS7 11Mbps 54Mbps MCS7 Transmit power/ receive Average value +16dBm 81 +15dBm 82 +14dBm 85 Constantly 73 receive Constantly 75 receive Constantly 75 receive Peak value (Typical value)) 240 238 234 82 82 82 Unit mA mA mA mA mA mA 3.4. Working current 10 / 27 Working mode Working status, Ta = 25°C The module is Quick network connection state (Bluetooth) in the fast network connection state and the Wi-Fi indicator flashes fast The module is in the hotspot Quick network network connection connection state (AP) state and the Wi-Fi indicator flashes slowly The module is in the fast Quick network network connection connection state (EZ) state and the Wi-Fi indicator flashes fast The module is Network connected state connected to the network and the Wi-Fi indicator is always on Average value 63 80 78 25 4.5RF parameters Maximum value (Typical value) Unit 245 mA 270 mA 246 mA 342 mA 11 / 27 The module is Network disconnected disconnected and the Wi-Fi 63 state indicator is always off The CEN pin Module of the module 330 disabled is connected to the ground. 4.5RF parameters 242 mA - A 12 / 27 4. RF parameters 4.5RF parameters 4.1. Basic RF features Parameter Working frequency Wi-Fi standard Data transmission rate Antenna type Description 2.412 to 2.464 GHz IEEE 802.11 b/g/n (channels 1 to 14) 11b: 1, 2, 5.5, 11 (Mbps) 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20 MCS 0 to 7 11n: HT40 MCS 0 to 7 PCB antenna 4.2. Wi-Fi transmission performance Parameter Average RF output power, 802.11b CCK Mode 11M Average RF output power, 802.11g OFDM Mode 54M Average RF output power, 802.11n OFDM Mode MCS7 Frequency error Minimum value - - -20 Typical value 12 12 13 - Maximum value - - 20 Unit dBm dBm dBm ppm 4.3. Wi-Fi receiving performance 13 / 27 5.4Antenna information Parameter PER<8%, RX sensitivity, 802.11b DSSS Mode 11M PER<10%, RX sensitivity, 802.11g OFDM Mode 54M PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 PER<10%, RX sensitivity, Bluetooth LE 1M Minimum value - - - - Typical value Maximum value -88 - -74 - -73 - -96 - Unit dBm dBm dBm dBm 4.4. Bluetooth transmission performance Parameter Working frequency Air rate Transmit power Frequency error Minimum value 2402 -20 Typical value 1 2 Maximum value 2480 20 -150 - 150 Unit MHz Mbps dBm KHz 4.5. Bluetooth receiving performance 14 / 27 5.6Antenna information Parameter RX sensitivity Maximum RF signal input Intermodulation Co-channel suppression ratio Minimum value - -10 Typical value -96 - Maximum value - - - - -23 - 10 - Unit dBm dBm dBm dB 15 / 27 5. Antenna information 5.6Antenna information 5.1. Antenna type CB2S uses the PCB antenna. 5.2. Antenna interference reduction To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts. To prevent adverse impact on the antenna radiation performance, avoid copper or traces within the antenna area on the PCB. 16 / 27 6.3Packaging information and production instructions 6. Packaging information and production instructions 6.1. Mechanical dimensions The dimensions of CB2S are 14.99±0.35 mm (W)×17.91±0.35 mm (L) ×0.8±0.1 mm (H) 17 / 27 7.2MOQ and packaging information 18 / 27 7.2MOQ and packaging information 6.2. Production instructions 1. For the Tuya in-line module, wave soldering is most preferred and manual soldering is less preferred. After being unpacked, the module must be soldered within 24 hours. Otherwise, it must be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and record the exposure time (the total exposure time cannot exceed 168 hours). 2. Wave soldering devices and materials: · Wave soldering equipment · Wave soldering fixture · Constant-temperature soldering iron · Tin bar, tin wire, and flux · Thermal profiler 3. Baking devices: 19 / 27 7.3MOQ and packaging information · Cabinet oven · Anti-electrostatic and heat-resistant trays · Anti-electrostatic and heat-resistant gloves 4. The module needs to be baked in the following cases: · The packaging bag is damaged before unpacking. · There is no humidity indicator card (HIC) in the packaging bag. · After unpacking, circles of 10% and above on the HIC become pink. · The total exposure time has lasted for over 168 hours since unpacking. · More than 12 months have passed since the sealing of the bag. 5. Baking settings: · Temperature: 40°C and 5% RH for reel package and 125°C and 5% RH for tray package (please use the heat-resistant tray rather than a plastic container). · Time: 168 hours for reel package and 12 hours for tray package. · Alarm temperature: 50°C for reel package and 135°C for tray package. · Production-ready temperature after natural cooling: < 36°C. · Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again. · If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisturesensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering. 6. In the whole production process, take electrostatic discharge (ESD) protective measures. 7. To guarantee the quality of products, you must pay attention to the following items: The amount of soldering flux, the height of the wave peak, whether the tin slag and copper content in the wave soldering tank exceed standards, whether the window and thickness of the wave soldering fixture are appropriate, and whether the wave soldering oven temperature curve is appropriate. 20 / 27 7.3MOQ and packaging information 6.3. Recommended oven temperature curve and temperature Set oven temperatures according to the following temperature curve of wave soldering. The peak temperature is 260°C±5°C. Recommended soldering temperature: Suggestions on oven temperature curve of wave soldering Preheat temperature Preheat time Peak contact time Temperature of tin cylinder Ramp-up slope Ramp-down slope 80 to 130°C 75 to 100s 3 to 5s 260±5°C 2°C/s 6°C/s Suggestions on manual soldering temperature Soldering temperature Soldering time NA NA NA NA 21 / 27 360±20°C 3s/point NA NA NA NA 6.4. Storage conditions 7.4MOQ and packaging information Storage conditions for a delivered module: · The moisture-proof bag is placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%. · The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed. · There is a humidity indicator card (HIC) in the packaging bag. 22 / 27 7.5MOQ and packaging information 23 / 27 7.5MOQ and packaging information 7. MOQ and packaging information Product number CB2S MOQ (pcs) 4400 Shipping packaging method Tape reel The number of modules per reel 1100 The number of reels per carton 4 24 / 27 Integration instructions for host product manufacturers according to KDB 996369 D03 OEMManual v01 Conditions on using Shenzhen Linktop IOT Co., Ltd regulatory approvals: A. Customer must ensure that its product (The " WIFI/Bluetooth MODULE") is electrically identical to Shenzhen Linktop IOT Co., Ltd reference designs. Customer acknowledges that any modifications to Shenzhen Linktop IOT Co., Ltd reference designs may invalidate regulatory approvals in relation to the CUSTOMER Product, or may necessitate notifications to the relevant regulatory authorities. B. Customer is responsible for ensuring that antennas used with the product are of the same type, with same or lower gains as approved and providing antenna reports to Shenzhen Linktop IOT Co., Ltd. C. Customer is responsible for regression testing to accommodate changes to Shenzhen Linktop IOT Co., Ltd reference designs, new antennas, and portable RF exposure safety testing/approvals. D. Appropriate labels must be affixed to the CUSTOMER Product that comply with applicable regulations in all respects. E. A user's manual or instruction manual must be included with the customer product that contains the text as required by applicable law. Without limitation of the foregoing, an example (for illustration purposes only) of possible text to include is set forth below: 2.2 List of applicable FCC rules FCC Part 15 Subpart C 15.247 2.3 Specific operational use conditions Radio Technology: Bluetooth BLE Operation frequency: 2402-2480MHz Channel No.: 40 channels Data rate: 1Mbps Channel Separation: 2MHz Modulation: GFSK Antenna Type: PCB antenna, max gain 0.13dBi. Radio Technology: 2.4G WIFI Operation frequency: 2412MHz-2462MHz for IEEE 802.11 b, g. n/HT20 Channel No.: 802.11b/802.11g /802.11n (HT20): 11 Modulation type: IEEE 802.11b: DSSS (CCK, DQPSK, DBPSK) IEEE 802.11g: OFDM (64QAM, 16QAM, QPSK, BPSK) IEEE 802.11n: OFDM (64QAM, 16QAM, QPSK, BPSK) Antenna Type: PCB antenna, max gain 0.13dBi. The module can be used for mobile or portable applications with a maximum 0.13dBi antenna. The host manufacturer installing this module into their product must ensure that the final composit product complies with the FCC requirements by a technical assessment or evaluation to the FCC rules, including the transmitter operation. The host manufacturer has to be aware not to provide informationto the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. 2.4 Limited module procedures Not applicable. The module is a Single module and complies with the requirement of FCC Part 15.212. 2.5 Trace antenna designs The antenna used is the PCB antenna on the module. 2.6 RF exposure considerations The device can be used in portable exposure condition without restriction and if RF exposure statement or module layout is changed, then the host product manufacturer required to take responsibility of the module through a change in FCC ID or newapplication. The FCC ID of the module cannot be used on the final product. In these circumstances, the host manufacturer will be responsible for reevaluating the end product (including the transmitter) and obtaining a separate FCC authorization. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radi-ate radio frequency energy and, if not in-stalled and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: --Reorient or relocate the receiving antenna. --Increase the separation between the equipment and receiver. --Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. --Consult the dealer or an experienced radio/ TV technician for help. The antennas used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and must not be located or operating in conjunction with any other antenna or transmitter. 2.7 Antennas Antenna Specification are as follows: Antenna Type: PCB antenna Antenna Gain(Peak):0.13 dBi (Provided by customer) This device is intended only for host manufacturers under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna; As long as the conditions above are met, further transmitter test will not be required. However, the host manufacturer is still responsible for testing their endproduct for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheralrequirements, etc.). 2.8 Label and compliance information Host product manufacturers need to provide a physical or e-label stating "Contains FCC ID: 2BCSG-BZBK002" With their finished product. 2.9 Information on test modes and additional testing requirements Radio Technology: Bluetooth BLE Operation frequency: 2402-2480MHz Channel No.: 40 channels Data rate: 1Mbps Channel Separation: 2MHz Modulation: GFSK Antenna Type: PCB antenna, max gain 0.13dBi. Radio Technology: 2.4G WIFI Operation frequency: 2412MHz-2462MHz for IEEE 802.11 b, g. n/HT20 Channel No.: 802.11b/802.11g /802.11n (HT20): 11 Modulation type: IEEE 802.11b: DSSS (CCK, DQPSK, DBPSK) IEEE 802.11g: OFDM (64QAM, 16QAM, QPSK, BPSK) IEEE 802.11n: OFDM (64QAM, 16QAM, QPSK, BPSK) Antenna Type: PCB antenna, max gain 0.13dBi. Host manufacturer must perfom test of radiated & conducted emission and spurious emission, etcaccording to the actual test modes for a stand-alone modular transmitter in a host, as well as for multiple simultaneously transmitting modules or other transmitters in a host product. Only when all the test results of test modes comply with FCC requirements, then the end product canbe sold legally. 2.10 Additional testing, Part 15 Subpart B disclaimer The modular transmitter is only FCC authorized for FCC Part 15 Subpart C 15.247 that the host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. If the grantee markets their product as being Part 15 Subpart B compliant (when it also contains unintentional-radiator digital circuity), then the grantee shall provide a notice stating that the final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.