User Manual for ROHM models including: FEBL62Q2713RB-01, RB-D62Q2713TB52, RB-D62Q2713TB52 Reference Board Mouser, RB-D62Q2713TB52, Reference Board Mouser, Board Mouser, Mouser
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DocumentDocumentDear customer
ROHM Co., Ltd. ("ROHM"), on the 1st day of April, 2024, has absorbed into merger with 100%-owned subsidiary of LAPIS Technology Co., Ltd.
Therefore, all references to "LAPIS Technology Co., Ltd.", "LAPIS Technology" and/or "LAPIS" in this document shall be replaced with "ROHM Co., Ltd." Furthermore, there are no changes to the documents relating to our products other than the company name, the company trademark, logo, etc.
Thank you for your understanding.
ROHM Co., Ltd. April 1, 2024
FEBL62Q2713RB-01
RB-D62Q2713TB52 User's Manual
Issue Date: July 10, 2023
RB-D62Q2713TB52 User's Manual
Notes 1) The information contained herein is subject to change without notice.
2) When using LAPIS Technology Products, refer to the latest product information (data sheets, user's manuals, application notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within the ranges specified. LAPIS Technology disclaims any and all liability for any malfunctions, failure or accident arising out of or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury, fire or the other damage from break down or malfunction of LAPIS Technology Products, please take safety at your own risk measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. You are responsible for evaluating the safety of the final products or systems manufactured by you.
3) Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your product or system. And the peripheral conditions must be taken into account when designing circuits for mass production. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related information.
4) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology or any third party with respect to LAPIS Technology Products or the information contained in this document (including but not limited to, the Product data, drawings, charts, programs, algorithms, and application examplesetc.). Therefore LAPIS Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out of the use of such technical information.
5) The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems, gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and must obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems, etc. LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising by using the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.
6) The Products specified in this document are not designed to be radiation tolerant.
7) LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However, LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.
8) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.
9) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act..
10) Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS Technology's Products.
11) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.
(Note) "LAPIS Technology" as used in this document means LAPIS Technology Co., Ltd.
Copyright 2023 LAPIS Technology Co., Ltd.
2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan https://www.lapis-tech.com/en/
FEBL62Q2713RB
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RB-D62Q2713TB52 User's Manual
Preface
This manual describes about the ML62Q2713 Reference Board : RB-D62Q2713TB52. Refer to following documents when necessary.
ML62Q2700 Group User's Manual Provides the detailed information about the microcontroller ML62Q2700 Group.
EASE1000 V2 User's Manual Provides the information on how to use the On-chip emulator EASE1000 V2.
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RB-D62Q2713TB52 User's Manual
Table of Contents
1. Overview.............................................................................................................................................................1 1.1. Features ......................................................................................................................................................1 1.2. Outline Diagram ........................................................................................................................................2
2. Function..............................................................................................................................................................3 2.1. Power Circuit ..............................................................................................................................................3 2.2. Connection for EASE1000 V2 (CNE) ........................................................................................................4 2.3. LED (P20, P21, P22) ..................................................................................................................................5 2.4. XT0/PIO0XT1/PIO1 .................................................................................................................................5 2.5. P23, P24, P25, P26 .....................................................................................................................................6 2.6. Serial Memory Inferface ............................................................................................................................6 2.7. Others .........................................................................................................................................................6
3. User Interface ....................................................................................................................................................7 3.1. CN1, CN2 ....................................................................................................................................................7 3.2. CNE .............................................................................................................................................................9
4. Precaution for usage ....................................................................................................................................... 10 5. PCB specification, BOM list and Schematic ..................................................................................................11
5.1. PCB specification .....................................................................................................................................11 5.2. BOM list ................................................................................................................................................... 12 5.3. Schematic................................................................................................................................................. 12 6. Revision History.............................................................................................................................................. 14
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RB-D62Q2713TB52 User's Manual
1. Overview
1.1. Features
The RB-D62Q2713TB52 can be used for learning `how to use' the ML62Q2713, on which the user needs to provide additional external components if necessary. By using the RB-D62Q2713TB52 together with the LAPIS Technology's on-chip emulator EASE1000 V2 and the provided software development environment, the user can develop software, debug and program the Flash. Also, by connecting an external power supply to RB-D62Q2713TB52, it can be used independently without connecting a EASE1000 V2. Before using RB-D62Q2713TB52, be sure to understand and keep in mind the following information.
1.1.1. Features
The board is provided with ML62Q2713 52pin TQFP. Mounted with the linked connector to EASE1000 V2. Through-holes for connecting the pins of LSI to external pheripheral boards. Power supply is selectable; supplied from the on-chip emulator EASE1000 V2 or CN1_3pin/CN2_2pin . Mounted with Crystal (32.768KHz) Mounted with LED (P20,P21,P22). Foot pattern with components for Successive Approximation Type A/D Converter is available (P23,P24,P25,P26).
1.1.2. Hardware specifications Table 1 shows the hardware specifications of RB-D62Q2713TB52.
Mounted LSI
Other Mounted components
Pads (or/and) Through holes for mounting components Power check pin Operating voltage Board size
Table 1 Hardware specifications
U1 : ML62Q2713 52pin TQFP PWR: Jumper for selecting the power supply input (3pin pin-header and short pin) J1: Jumper for selecting TEST1_N pin (3pin pin-header and short pin) J2: Jumper for selecting P01/TEST0 pin (3pin pin-header and short pin) P20-P22: LEDs R1-R3: Resistors for LEDs by P20 to P22 J3-J5: Jumper-chip for connecting LEDs X1, C3, C4: Crystal Oscillator (32.768kHz) and capacitors CNE: Connector for EASE1000 V2(14pin connector) C1, C5, C15: Capacitors for VDD and VDDL R4: Pull-up resistor for RESET_N CN1-CN2: Connectors for user application system (50pin, 2.54mm pitch, 1.0mm ) C2, C16: Capacitors for VDD C10-C14, J8: Capacitors and jumper-chip for Successive Approximation Type A/D Converter J6-J7: CN1 connection jumper-chip J9-J10: Jumper-Chip for connecting Serial Memory Inferface VDD, VSS, UVDD: 0.8mm +1.8V to +5.5V 55.88 mm x 93.98 mm
For more information about the connection of the mounted components, see the schematic.
FEBL62Q2713RB
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1.2. Outline Diagram
Fig. 1 shows the RB-D62Q2713TB52. CN1
LED P20 P21 P22
RB-D62Q2713TB52 User's Manual
Jumper PWR J2 J1
CNE
CN2 Fig. 1 Outline Diagram
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RB-D62Q2713TB52 User's Manual
2. Function
2.1. Power Circuit
The input toVDD can be selected from 3.3VOUT of EASE1000 V2 or CN1_3pin/CN2_2pin by PWR jumper.
ML62Q2713 VDD
VDD 1uF
VSS
CNE
C
USR PWR
UVDD
CNE 1
VTref
13 3.3VOUT
2,4,6,8,10,12 VSS
VSS
CN1
3
VDD
4
VSS
CN2
2
VDD
1
VSS
Fig. 2 Power Circuit
[Note] The power supply ON/OFF procedure in case of setting PWR jumper to the USR-side when using EASE1000 V2.
- The procedure of power supply ON 1. The USB cable of EASE1000 V2 is connected. 2. The power supply of user's target system is turned on.
- The procedure of power supply OFF 1. The power supply of user's target system is turned off 2. The USB cable of EASE1000 V2 is removed
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RB-D62Q2713TB52 User's Manual
2.2. Connection for EASE1000 V2 (CNE)
EASE1000 V2 can be used if J1 and J2 jumper are set to "CNE". VDD
ML62Q2713 TEST1_N
P01/TEST0
J1 CNE
C
VDD
CNE
5
RST_OUT/SCK
7
SDATA
J2 CNE
C USR
CN1
8
P01/TEST0
Fig. 3 EASE1000 V2 Interface
[Note] P01/TEST0 pin: P01/TEST0 pin of ML62Q2713 is initially set as a pull-up input mode When using EASE1000 V2, do not set it as an output mode by using an application program, otherwise EASE1000 V2 cannot communicate with the ML62Q2713.
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RB-D62Q2713TB52 User's Manual
2.3. LED (P20, P21, P22)
The P20-P22 pins are ports that can directly drive LED. The Ports are connected to the LEDs through jumper-chip. Remove the jumper-chip when not using the LEDs.
Remove when not using the LEDs.
Fig. 4 Jumper-chip removal of LEDs
2.4. XT0/PIO0XT1/PIO1
RB-D62Q2713TB52 can be mounted with cylinder type or SMD type crystal oscillator.
Capacitors
Cylinder type Crystal Oscillator
Capacitors
SMD type Cristal Oscillator
Fig. 5 Example of processing of Crystal Oscillator
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RB-D62Q2713TB52 User's Manual
2.5. P23, P24, P25, P26
When the P23 pin is used as VREF function of the successive approximation type A/D converter, C10, C11 can implement a bypass capacitor. In addition, VDD can be connected by mounting the J8 jumper-chip. When P24, P25, P26 pin is used as AIN4, AIN5, AIN6 function of the successive approximation type A/D converter, the C12, C13 and C14 can implement a by-pass capacitor. Fig. 6 shows the connection diagram.
ML62Q2713 P23 P24 P25 P26
VDD J8
C10 C11 C12 C13 C14
CN2 14 15 16 17
Fig. 6 P23, P24, P25, P26 Circuit
2.6. Serial Memory Inferface
Serial Memory Inferface can also be connected to CN1 by mounting jumper-chips on J9 and J10. Fig. 7 shows an example of such processing.
Fig. 7 Mounting jumper-chip on J9 and J10
2.7. Others
Do not mount a jumper-chip on J11.
jumper-chips
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RB-D62Q2713TB52 User's Manual
3. User Interface
3.1. CN1, CN2
Table 2 and Table 3 show the pin list of the RB-D62Q2713TB52 user interface connection CN1 and CN2.
CN1 Pin No.
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49
Table 2 CN1 Pin List
Connection destination
Device
Pin No.
Name
J6
1
XT0
PWR
USR
VDD
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
9
P02
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
18
P05
ML62Q2713
20
P07
ML62Q2713
22
P11
ML62Q2713
24
P13
ML62Q2713
26/29*1
P51/P16*1
-/ML62Q2713*3 -
-/28*3 -
-/P15*3 N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
CN1 Pin No.
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50
Connection destination
Device
Pin No.
Name
J7
1
XT1
-
-
VSS
ML62Q2713
6
RESET_N
J2
USR
P01/TEST0
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
10
P03
ML62Q2713
11
P47
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
17
P04
ML62Q2713
19
P06
ML62Q2713
21
P10
ML62Q2713
23
P12
ML62Q2713
25
P50
-/ML62Q2713*2
-/27*2
-/P14*2
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
N.C. : Not Connected *1CN1.39 is also connected to Pin No.29/P16 when J11 is mounted. Refer to "2.7.Others". *2CN1.40 is connected to Pin No.27/P14 when J9 is mounted. Refer to "2.6.Serial Memory Inferface" *3CN1.41 is connected to Pin No.28/P15 when J10 is mounted. Refer to "2.6.Serial Memory Inferface"
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RB-D62Q2713TB52 User's Manual
CN2 Pin No.
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47 49
Table 3 CN2 Pin List
Connection destination
Device
Pin No.
Name
-
-
VSS
-
-
N.C.
-
-
N.C.
ML62Q2713
27
P14
ML62Q2713
29
P16
ML62Q2713
31
P20
ML62Q2713
33
P22
ML62Q2713
35
P24
ML62Q2713
37
P26
ML62Q2713
39
P56
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
40
P41
ML62Q2713
42
P31
ML62Q2713
44
P33
ML62Q2713
46
P61
ML62Q2713
48
P63
ML62Q2713
50
P65
-
-
N.C.
-
-
N.C.
-
-
N.C.
CN2 Pin No.
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50
Connection destination
Device
Pin No.
Name
PWR
USR
VDD
-
-
N.C.
-
-
N.C.
ML62Q2713
28
P15
ML62Q2713
30
P17
ML62Q2713
32
P21
ML62Q2713
34
P23
ML62Q2713
36
P25
ML62Q2713
38
P27
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
-
-
N.C.
ML62Q2713
41
P30
ML62Q2713
43
P32
ML62Q2713
45
P60
ML62Q2713
47
P62
ML62Q2713
49
P64
ML62Q2713
51
P66
-
-
N.C.
-
-
N.C.
ML62Q2713
52
P43
N.C. : Not Connected
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RB-D62Q2713TB52 User's Manual
3.2. CNE
Table 4 shows the pin list of the RB-D62Q2713TB52 user interface connection CNE.
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14
CNE Name VTref GND VPP GND
RST_OUT/SCK GND
SDATA GND VDDL GND N.C. GND
3.3VOUT N.C.
N.C. : Not Connected
Table 4 CNE
Device J1 J2 -
PWR -
Connection destination
Pin No. ML62Q2713 Pin Name
-
VDD
-
VSS
-
N.C.
-
VSS
CNE
TEST1_N
-
VSS
CNE
P01/TEST0
-
VSS
-
N.C.
-
VSS
-
N.C.
-
VSS
CNE
VDD
-
N.C.
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RB-D62Q2713TB52 User's Manual
4. Precaution for usage
(1) The RB-D62Q2713TB52 is an unfinished product and intended for research and development and for expert use in the research and development facility only. The RB-D62Q2713TB52 is not intended to be used for volume production or parts thereof.
(2) Since the content specified herein is subject to change for improvement without notice, confirm the latest content when using the board.
(3) See the other documents, the ML62Q2700 group user's manual and EASE1000 V2 user's manual when using the RB-D62Q2713TB52.
(4) Confirm the final electrical characteristics by using the mass production parts on your mass production boards. (5) LAPIS supports replacing the board for an initial failure soon after the shipment. However LAPIS doesn't support
reparing the board. (6) RB-D62Q2713TB52 have signal patterns on the underside, it might work abnormally if using on conductive
materials. Use it on insulating materials or having any preventable parts.
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RB-D62Q2713TB52 User's Manual
5. PCB specification, BOM list and Schematic
5.1. PCB specification
Fig. 8 shows the PCB dimensional outline diagram and layout of components. PCB part number: RB-D62Q2713TB52 Dimension: 55.88mm x 93.98mm
Fig. 8 PCB dimensional outline diagram and layout of components (Top view)
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RB-D62Q2713TB52 User's Manual
5.2. BOM list
Parts Number 1 QTU-11985 2 C1608X7R1E105K080AB
3 -
4 GRM1885C1H220JA01
5 HIF3H-50DA-2.54DSA(71) 6 HIF3FC-14PA-2.54DSA(71) 7 8 A2-3PA-2.54DSA 9 MCR03ERTJ000 10 11 SML-H12P8T 12 MCR03EZPJ271 13 MCR03EZPJ103 14 ML62Q2713-NNNTB 15 16 17 VT-200-F 12.5pF 18 HIF3GA-2.54SP
Table 5 BOM list
Symbol RB-D62Q2713TB52 C1,C5,C6,C7,C8, C9 C2,C10,C11,C12, C13,C14 C3,C4
CN1, CN2 CNE CNEM J1, J2, PWR J3, J4, J5 J6,J7,J8,J9,J10,J11 P20, P21, P22 R1, R2, R3 R4 U1 UVDD, VDD, VSS VSSPAD XT1 -
Contents PCB Ceramic Capacitor 1.0F/25V X7R Unmounted
Ceramic Capacitor 22pF/50V C0G Unmounted 14pin Header Connector Unmounted 3pin Header Connector Resistor 0 Unmounted LED Green Resistor 270 ±5% Resistor 10k ±5% 16-bit Microcontroller Unmounted Unmounted X'tal 32.768kHz 12.5pF Short pin
Qty.
Vendor
1 LAPIS Technology Co., Ltd.
6 TDK Corporation
6 -
2 Murata Manufacturing Co., Ltd.
2 Hirose Electric Co., Ltd. 1 Hirose Electric Co., Ltd. 1 3 Hirose Electric Co., Ltd. 3 Rohm Co., Ltd. 6 3 Rohm Co., Ltd. 3 Rohm Co., Ltd. 1 Rohm Co., Ltd. 1 LAPIS Technology Co., Ltd. 3 1 1 Seiko Instruments Inc. 3 Hirose Electric Co., Ltd.
[Note] - The diameter of through hole of CN1 and CN2 is 1.0 mm.
Using CN1 and CN2, the diameter of connector pin should use the connector below 0.6mm, such as 0.64mm. - The parts may be changed into another parts with equivalent part special quality.
5.3. Schematic
The next page shows the schematic of RB-D62Q2713TB52.
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13
FEBL62Q2713RB
A
B
C
D
E
F
P14
P15
P16
P17
P20
1
C12,C13,C14:Unmounted
VDD
P21
P22
P24
P25
P26
P27
P56
J8
P23
C11
C10
VSS VSS VSS C14 C13 C12
2
VSS
VSS
C10,C11,J8:Unmounted
U1
P14 27
P15 28
P16 29
P17 30
P20 31
P21 32
P22 33
P23 34
P24 35
P25 36
P26 37
P27 38
P56 39
P41
40 P41
P51 26
P51
P30
41 P30
P50 25
P50
3
P31
42 P31
P13 24
P13
P32
43 P32
P12 23
P12
P33
44 P33
P11 22
P11
P60
45 P60
ML62Q2713
P10 21
P10
P61
46 P61
P07 20
P07
P62
47 P62
TQFP52
P06 19
P06
P63
48 P63
4
P64
49 P64
P05 18
P05
P04 17
P04
P65
50 P65
VL3 16
C9
1.0u
P66
51 P66
VL2 15
C8
1.0u
P43
52 P43
VL1 14
C7
1.0u
VSS
1 XT0/PI00 2 XT1/PI01 3 VDD 4 VSS 5 VDDL 6 RESET_N 7 TEST1_N 8 P01/TEST0 9 P02 10 P03 11 P47 12 C1 13 C2
5
C3 22p
VSS
XT1 32.768k
VDD
C2
C1
C5
1.0u
1.0u
C4
22p
VSS C2:Unmounted
VSS
J6
J7
VDD
R4
10k
6
VSSPAD
C6
PAD
1.0u
VSS
XT0/PI00 XT1/PI01 RESET_N TEST1_N P01/TEST0
P02 P03 P47
J6,J7:Unmounted
7
8
A
B
C
D
E
F
G
H
I
J
K
UVDD
UVDD
1
CN1
CN2
XT0/PI00 XT1/PI01
1 2
VSS
1 2
3
3
VSS
4 5
4 5
RESET_N
P02 P03
6
7 8 9 10 11 12 13 14 15 16 17 18 19 20
P14 P15 P16 P17 P20 P21 P22 P23 P24 P25 P26 P27 P56
21
6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
2
P47
22 23
22 23
24
24
25
25
26
26
27
27
28
28
29
29
P04 P05 P06 P07 P10 P11 P12 P13 P50 P51 P14_C1 P15_C1 P16_C1
30
31
32
33 34 35 36 37 38 39 40 41 42 43 44 45
P41 P30 P31 P32 P33 P60 P61 P62 P63 P64 P65 P66
30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45
3
46
46
47
47
48
48
49
49
50
P43
50
VDD
J9,J10,J11:Unmounted
VDD
P14_C1
J9
0
4
C
TEST1_N
J1
P15_C1
J10
0
CNE
P01/TEST0
USR C
J2
P16_C1
J11
0
CNE
VDD
UVDD
UVDD
USR
CHKPIN
C PWR
CNE
VDD
VDD
CNE
CHKPIN 3.3VOUT
VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14
VTref GND VPP GND RST_OUT/SCK GND SDATA GND VDDL GND N.C. GND 3.3VOUT N.C.
5
CHKPIN
VSS
VDD CNEM
1 2 3 4 5
VTref GND RST_OUT/SCK SDATA 3.3VOUT
6
VSS
VDD
P20
J3
0
P20
SML-H12P8T
R1
270
P21
J4
0
P21
SML-H12P8T
R2
270
P22
J5
0
P22
SML-H12P8T
R3
270
G
H
I
7
LAPIS Technology Co., Ltd.
TITLE
RB-D62Q2713TB52
APPLICATION
ML62Q2713-NNNTB Reference Board
DWG No.
QTS-11844
SHEET
of
1
1
J
K
8 Rev.
1.0
RB-D62Q2713TB52 User's Manual
6. Revision History
Document No. FEBL62Q2713RB-01
RB-D62Q2713TB52 User's Manual
Issue Date
July 10, 2023
Page
Previous Edition
New Edition
First edition.
Description
FEBL62Q2713RB
14
Microsoft Word for Office 365