FN-LINK 6162CIC Bluetooth LE5.0 Module
Product Specification
- Model: 6162CIC
- Bluetooth: LE5.0 Module
- Datasheet Version: v1.0
- Manufacturer: FN-LINK TECHNOLOGY LIMITED
- Office Address: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen
- Factory Address: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA
- Contact TEL: +86-755-2955-8186
- Website: www.fn-link.com
6162CIC Module Datasheet
Ordering Information | Part NO. | Description |
FG6162CICX-02 | 6162CIC RTL8762CMF QFN40_5x5 On board PCB antennas,BT5.0+UART,Band RF output, PCB Version V2.0 |
Revision History
Version | Date | Contents of Revision Change | Draft | Checked | Approved |
V1.0 | 2024/04/24 | First version | Lxp | Zzq | Qjp |
General Description
Introduction
Mesh self-organizing network type communication equipment, can efficiently and quickly form a non-central wireless broadband network; Supporting multi-hop relay can effectively expand the coverage radius of wireless network.
FN-link releases a low-cost, low-power Bluetooth 5.0 module with Mesh functionality. It is a highly integrated ARM Cortex-M4F 32-bit CPU, 160kByte RAM and 512kByte flash MCU, and Bluetooth 5.0 LE transceiver Mesh network solution.
The wireless module meets the Bluetooth 5.0 LE standard and provides UART interfaces for Bluetooth. Modules of moderate size, suitable for intelligent LED and other applications, can efficiently solve the complex environment such as high-rise, underground, tunnel, large complex emergency communication problems.
Description
Model Name | 6162CIC |
Product Description | Support Bluetooth 5.0 functionalities |
Dimension | L x W x T: 18.6X13X2.5 (typical) mm |
BT Interface | UART |
Operating temperature | -40°C to 85°C |
Storage temperature | -40°C to 125°C |
40MHz |
Features
General
- Supports Bluetooth 5 core specification
- Supports 2M LE ,LE Long Range,LE Data Length Extensions(257 byte)
- Supports OTA (Over-the-Air)programming mechanism for firmware upgrade
- UART x 2,one for data transceiver,the other for firmware upgrade
- Embedded 4Mbits Flash
- Supports 5 GPIOs
- Embedded Switching Regulator(SWR) for low current consumption
- Package:18.6X13X2.5mm
Block Diagram
General Specification
Bluetooth Specification
Feature | Description | ||
General Specification | |||
Bluetooth Standard | Bluetooth V5.0 LE | ||
Host Interface | UART | ||
Antenna Reference | On board PCB antennas | ||
Frequency Band | 2400 MHz ~ 2483.5 MHz | ||
Number of Channels | 40(3 Advertising + 37 Data) | ||
Modulation | GFSK | ||
RF Specification | |||
Min(dBm) | Typical(dBm) | Max(dBm) | |
Output Power | / | / | 9 |
Sensitivity @ BLE=30.8% | / | / | -90 |
Maximum Input Level | LE 1Mbps: -20dBm |
Pin Definition
Pin Outline
Pin Definition details
NO. | Name | Type | Description | Voltage |
1 | GND | P | Ground connections | |
2 | P2_6 | I/O | GPIO pin, refer to Pin Function Table | |
3 | P2_5 | I/O | GPIO pin, refer to Pin Function Table | |
4 | P2_4 | I/O | GPIO pin, refer to Pin Function Table | |
5 | P2_3 | I/O | GPIO pin, refer to Pin Function Table | |
6 | P2_2 | I/O | GPIO pin, refer to Pin Function Table | |
7 | NC1 | - | No connect | |
8 | Uart_Tx | O | Software Upgrade UART interface _Data Output | |
9 | Uart_Rx | I | Software Upgrade UART interface _Data Input | |
10 | VBAT/VDDIO/HVD | P | I/O Voltage supply input 3.3V | |
11 | P0_1 | I/O | GPIO pin, refer to Pin Function Table | |
12 | P0_2 | I/O | GPIO pin, refer to Pin Function Table | |
13 | Uart_Log_debug | I/O | Log_Uart Interface_ Data Output; Connect to GND for upgrade software (P0_3) | |
14 | P0_5 | I/O | GPIO pin, refer to Pin Function Table | |
15 | P0_6 | I/O | GPIO pin, refer to Pin Function Table |
16 | GND | - | Ground connections | |||||||||||||||||||||||
17 | RF OUT | NC1 | RF OUT PIN(Alternative) | |||||||||||||||||||||||
18 | GND | - | Ground connections | |||||||||||||||||||||||
19 | Reset | I | Reset(Low active) | |||||||||||||||||||||||
20 | GND | P | Ground connections | |||||||||||||||||||||||
Electrical SpecificationsPower Supply DC Characteristics
Power Consumption
|
Size reference
Module Picture
L x W : 18.6 x 13 (±0.2) mm | ![]() |
H: 2.5 (±0.2) mm | ![]() |
Weight | 0.8g(±0.1)g |
List of certified information
Certification project | Certificate number |
SRRC | CMIIT ID:2019DP11567 |
FCC | 2AATL-6162CIC |
CE | BLA-S-202107-A23 |
IC | TBD |
NCC | TBD |
KCC | TBD |
TELEC | TBD |
Brazil | TBD |
Argentina | TBD |
Japan | TBD |
Marking Description
Layout Recommendation
The Key Material List
Item | Part Name | Description | Manufacturer |
1 | Crystal | 3225 40MHz 9pF +/-10PPM | ECEC, TKD, Hosonic, JWT, TXC |
2 | Chipset | RTL8762CMF-CG QFN40 | Realtek |
3 | PCB | 6162CIC green,2L,13×18.6×1.0mm | XY-PCB, GDKX, Sunlord, SLPCB |
4 | Shielding | 6162CIC shielding | 信太(xingtai),精力通(jinglitong) |
Reference Design
Package
Reel
A roll of 1000pcs
Carrier Tape Detail
Packaging Detail the take-up package
Using self-adhesive tape
- Size of black tape: 32mm*32.6m the cover tape :25.5mm*32.6m
- Color of plastic disc: blue
Tray
Use pallet packaging for less than 300 pieces
Moisture sensitivity
The Modules is a Moisture Sensitive Device level 3, in according with standard IPC/JEDEC
J-STD-020, take care all the relatives requirements for using this kind of components. Moreover, the customer has to take care of the following conditions:
- Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH)
- Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC J-STD-033A paragraph 5
- The maximum time between the opening of the sealed bag and the reflow process must be 168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
- Baking is required if conditions b) or c) are not respected
- Baking is required if the humidity indicator inside the bag indicates 10% RH or more
IC Warning:
ISED Canada RSS-Gen Notice (in English and French):
“This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:
- This device may not cause interference.
- This device must accept any interference, including interference that may cause undesired operation of the device.”
ISED Canada ICES-003 Compliance Label (CAN BE PROVIDED ON LABEL OR in MANUAL):
This is only required if product is within ICES-003 scope and is not exempt: Insert either “A” or “B”, but not both, to identify the applicable Class of the device used for compliance verification.
“CAN ICES-3 (*)/NMB-3(*)”
RF Exposure Guidance Statement (in English and French, for equipment used a specified distance (more than 5mm away from persons)):
“In order to comply with ISED RF Exposure requirements, this device must be installed to provide at least 20 cm separation from the human body at all times.
(EN)This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
The 6162CIC module is labelled with its own IC Certification Number. If the IC Certification Number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final end product must be labelled in a visible area with the following: “Contains IC: 12425A-6162CIC”
FCC Warning
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
For all Class B Digital Devices, a statement like the following is needed:
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
FCC Part 15.19(a [interference compliance statement], unless the following statement is already provided on the device label: – “This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
Radiation Exposure Statement
- This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
- The device has been evaluated to meet general RF exposure requirement
OEM integration instructions:
This device is intended only for OEM integrators under the following conditions: The transmitter module may not be co-located with any other transmitter or antenna. The module shall be only used with the external antenna(s) that has been originally tested and certified with this module. As long as the conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.).
Validity of using the module certification:
In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization for this module in combination with the host equipment is no longer considered valid and the FCC ID of the module cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
End product labeling: The final end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2AATL-6162CIC”.
Information that must be placed in the end user manual: The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.
- Customer :
- Customer P/N:
- Signature:
- Date:
Manufacturer: FN-LINK TECHNOLOGY LIMITED
Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen
Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha,
CHINATEL: +86-755-2955-8186
Website: www.fn-link.com
Frequently Asked Questions (FAQ)
Q: What is the maximum output power of the Bluetooth module?
A: The maximum output power is 9dBm.
Documents / Resources
![]() | FN-LINK 6162CIC Bluetooth LE5.0 Module [pdf] Owner's Manual 6162CIC, FG6162CICX-02, RTL8762CMF, 6162CIC Bluetooth LE5.0 Module, 6162CIC, Bluetooth LE5.0 Module, Module |