EBYTE E22-900M22S SX1262 915MHz SPI SMD LoRa Module

Overview

Introduction

The E22-900M22S is based on the SX1262, a new generation of LoRaTM RF chip manufactured by Semtech, USA. It is an ultra-small and self-developed 915MHz SMD LoRaTM wireless module.

Because it adopted the original SX1262 as main core, so the anti-interference performance and communication distance have been further improved compared to the previous generation LoRaTM transceiver.Due to its new LoRaTM modulation technology, the anti-interference performance and communication distance are far superior to the current FSK and GFSK modulation products. This module is mainly for smart home, wireless meter reading, scientific and medical research, and long distance wireless communication equipment. The RF performance and components selection are all in accordance with industrial-grade standards and this products obtained FCC, CE and RoHS certification already and so users do not need to worry about the performance. Adopted industrial grade high precision 32MHz crystal, the product can cover an ultra-wide frequency range of 902~928MHz and is backward compatible with SX1278 and SX1276.

Since the module is a RF transceiver module only, users need to use the MCU driver or use a dedicated SPI debug tool.

Features
  • Communication distance tested is up to 7km
  • Maximum transmission power of 160mW, software multi-level adjustable
  • Support the global license-free ISM 915MHz band
  • Support air date rate of 0.018-62.5kbps in the LoRaTM mode Support 300kpbs in the FSK mode;
  • Compatible with the transceiver of SX1278/SX1276;
  • With large capacity, FIFO supports 256Byte data cache.;
  • New SF5 spreading factor to support dense networks;
  • Support 2.5V~3.7V power supply, more than 3.3V power supply can guarantee the best performance;
  • Industrial grade standard design, support -40 ~ 85 °C for working over a long time
  • IPEX and stamp hole are optional, which is convenient for secondary development and integration.
Application
  • Home security alarm and remote keyless entry
  • Smart home and industrial sensors
  • Wireless alarm security system
  • Building automation solutions
  • Wireless industrial-grade remote control
  • Health care products
  • Advanced Meter Reading  Architecture(AMI)
  • Automotive industry applications.

Specification and parameter

Limit parameter
Main parameter Performance Remark
Min. Max.
Power supply(V) 0 3.7 Voltage over 3.7V will cause permanent damage to module
Blocking power(dBm) 10 Chances of burn is slim when modules are used in short distance
Operating temperature(℃) -40 85
Operating parameter

Main parameter

Performance

Remark

Min. Typ. Max.
Operating voltage(V) 1.8 3.3 3.7 It’s recommended to use 3.3V.
Communication level(V) 3.3 For 5V TTL, it may be at risk of burning down
Operating temperature(℃) -40 85 Industrial design
Operating frequency(GHz) 850 915 930 Support ISM band

Power consumption

TX current(mA) 119 Instant power consumption
RX current(mA) 6.8
Sleep current(μA) 2 Software is shut down
Max Tx power(dBm) 21.4 21.5 22.3
Receiving sensitivity(dBm) -144 -146 -147 Air data rate is 0.3kbps

Air data rate(bps)

0.6k 300k Controlled via user’s programming
0.018k 62.5k Controlled via user’s programming
Main parameter Description Remark
Distance for reference 7000m Test condition:clear and open area, antenna gain: 5dBi,antenna height: 2.5m,air data rate: 0.3kbps
FIFO 256Byte Maximum length of single transmission
Crystal frequency 32MHz  
Modulation LoRa(recommended)  
Package SMD  
Connector 1.27mm Stamp hole
Communication interface SPI 0-10Mbps
Size 20* 14*2.8 mm  
Antenna IPEX/IPEX 50 ohm impedance

Size and pin definition


Pad quantity: 22 
Unit: mm

No. Name Direction Function
1 GND   Ground wire, connected to the power reference ground
2 GND   Ground wire, connected to the power reference ground
3 GND   Ground wire, connected to the power reference ground
4 GND   Ground wire, connected to the power reference ground
5 GND   Ground wire, connected to the power reference ground
6 RXEN Input RF switch receiving control pin, connected to external microcontroller IO, valid in high level
7 TXEN Input RF switch transmitting control pin, connected to external microcontroller IO or DIO2, valid in high level
8 DIO2 Input/Output Configurable universal IO port (see SX1262 manual for details)
9 VCC   Power supply, 1.8~3.7V(It is recommended to add external ceramic filter capacitor)
10 GND   Ground wire, connected to the power reference ground
11 GND   Ground wire, connected to the power reference ground
12 GND   Ground wire, connected to the power reference ground
13 DIO1 Input/Output Configurable universal IO port (see SX1262 manual for details)
14 BUSY Output For status indication (see SX1262 manual for details)
15 NRST Input Chip reset trigger input pin, valid in low level
16 MISO Output SPI data output pin
17 MOSI Input SPI data output pin
18 SCK Input SPI data output pin
19 NSS Input Module chip select pin for starting an SPI communication
20 GND   Ground wire, connected to the power reference ground
21 ANT   Antenna interface, stamp hole (50 ohm characteristic impedance)
22 GND   Ground wire, connected to the power reference ground

Basic Operation

Hardware Design

SN Brief Connection between Module and Single Chip Microcomputer
1 The IO0、IO1、IO2、IO3 in MCU means the IO port of MCU.
 

2

DIO1 、 DIO2 is the normal IO port, which can be configured to multiple function. The DIO2 can connect with TXEN,but not with the IO port of MCU. It’s used to control RF switch, see more details in SX1262 datasheet. Also It can be floated when not in use.
3 The DIO3 is powered by a 32MHz TCXO crystal.
4 Ensure the good grounding, large area of paving, small the power supply ripple, the filter capacitor should be increased and as close as possible to the VCC and GND pins of module.

Note:

  • It is recommended to use DC stabilized power supply to supply power to the module. The power supply ripple coefficient is as small as possible, and the module needs to be reliably grounded.
  • Please pay attention to the correct connection of the positive and negative poles of the power supply. If the reverse connection is connected, the module may be permanently damaged.
  • Please check the power supply to ensure that between the recommended supply voltage, if exceeding the maximum, the module will be permanently damaged.
  • Please check the stability of the power supply, the voltage can not be significantly frequent.
  • When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin, and the whole machine is beneficial for long-term stable operation.
  • The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts with large electromagnetic interference.
  • High-frequency digital traces, high-frequency analog traces, and power traces must be avoided under the module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on the Top Layer of the module contact part(All copper-covered and well grounded), and must be close to the digital part of the module and routed in the Bottom Layer.
  • Assuming the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer or other layers, which will affect the module’s spurs and receiving sensitivity to varying degrees.
  • Assume that there are traces with large electromagnetic interference around the module (high-frequency digital, high-frequency analog, power trace), which will greatly affect the performance of the module. It is recommended to stay away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done;
  • If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a risk of damage).
  • Try to stay away from some physical layers and also have a 2.4GHz TTL protocol, for example: USB3.0
  • The antenna mounting structure has a great influence on the performance of the module. It is necessary to ensure that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna extension cable to extend the antenna to the outside of the case.
  • The antenna must not be installed inside the metal case, which will greatly reduce the transmission distance.
  • It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.
Software Programming
  • Its driving mode is exactly the same as SX1268/SX1262. Users can operate according to SX1268/SX1262 chip datasheet.
  • DIO1 and DIO2 are general-purpose IO ports, which can be configured into multiple functions. DIO2 can be connected to TXEN and not connected to the MCU’s IO port. It can be used to control the RF switch transmission. If not used, you can hang it. For details, see the SX1262 manual.
  • DIO 3 is used to supply 32 MHz TCXO crystal oscillator.

FAQ

Communication range is too short
  • The communication distance will be affected when obstacle exists.
  • Data lose rate will be affected by temperature, humidity and co-channel interference.
  • The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground. Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
  • The signal will be affected when the antenna is near metal object or put in a metal case.
  • Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
  • When the power supply at room temperature is lower than the recommended low voltage, the lower the voltage is, the lower the transmitting power is.
  • Due to antenna quality or poor matching between antenna and module.
Module is easy to damage
  • Please check the power supply and ensure it is within the recommended range. Voltage higher than the peak will lead to a permanent damage to the module.
  • Please check the stability of power supply and ensure the voltage not to fluctuate too much.
  • Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic susceptibility.
  • Please ensure the humidity is within limited range for some parts are sensitive to humidity.
  • Please avoid using modules under too high or too low temperature.
High bit error rate

There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus line should not be too long.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply. If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.

Welding operation guidance

Reflow Soldering Temperature
Profile Feature Curve feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Solder paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin) Minimum preheating temperature 100℃ 150℃
Preheat temperature max (Tsmax) Maximum preheating temperature 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average rising rate 3℃/second max 3℃/second max
Liquidous Temperature (TL) Liquid phase temperature 183℃ 217℃
Time(tL)Maintained Above(TL) Time above liquidus 60-90 sec 30-90 sec
Peak temperature(Tp) Peak temperature 220-235℃ 230-250℃
Aveage ramp-down rate(Tp to Tsmax) Average descent rate 6℃/second max 6℃/second max
Time 25℃ to peak temperature Time of 25 ° C to peak temperature 6 minutes max 8 minutes max
Reflow Soldering Curve

Related Model

Model

Chip Frequency Hz Transmit power dBm Test distance

km

Packaging Size mm Communication Interface
E22-900T22S SX1262 868M 915M 22 7 SMD 16*26

UART

E22-230T22S

SX1262 230M 22 7 SMD 16*26 UART
E22-400T22S SX1268 433M 470M 22 7 SMD 16*26

UART

E22-400M30S

SX1268 433M 470M 30 12 SMD 24*38.5 SPI
E22-900M30S SX1262 868M 915M 30 12 SMD 24*38.5

SPI

E22-900M22S

SX1262 915M 22 6.5 SMD 14*20 SPI
E22-400M22S SX1268 433M 470M 22 6.5 SMD 14*20

SPI

Antenna Type

Antenna recommendation

The antenna plays an important role in the communication process. The inferior antenna often has a great impact on the communication system. Therefore, we recommend some antennas that support our wireless modules and have excellent performance and reasonable price.

Antenna     Manufacturer: CHENGDU ZIISOR TECHNOLOGY CO., LTD.
Antenna     Model TX915-XP-100
Antenna type: Sucker antenna
Antenna gain: 3dBi

Batch packaging

This module has been tested and found to comply with part 15.247 requirements for Modular Approval.

This module is intended for OEM integrator. The OEM integrator is responsible for the compliance to all the rules that apply to
the product into which this certified RF module is integrated.Additional testing and certification may be necessary when multiple modules are used.

FCC Caution:
Any Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)
This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Host product manufacturers that they need to provide a physical or e-label stating, “Contains FCC ID:2ALPH-E22900M22S” with their finished product.
Only those antennas with same type and lesser gain filed under this FCC ID can be used with this device. The host product manufacturer is responsible for compliance to any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.
The final host integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to install or remove the transmitter module except such device has implemented two-ways authentication between module and the host system.
The final host manual shall include the following regulatory statement:This equipment has been tested and found to comply with the limits for a This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
FCC RF Radiation Exposure Statement:

  1. This Transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
  2. This equipment complies with RF radiation exposure limits set forth for an uncontrolled environment.
  3. This equipment should be installed and operated with minimum distance 20cm between the radiator& your body.

Revision history

Version Date Description Issued by
1.0 2018-09-25 Original version huaa
1.1 2019-02-17 Content added Ray
1.2 2019-04-03 Content updated Ray
1.3 2019-11-14   Ren

About us

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Thank you for using Ebyte products! Please contact us with any questions or suggestions: [email protected]
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Documents / Resources

EBYTE E22-900M22S SX1262 915MHz SPI SMD LoRa Module [pdf] User Manual
E22900M22S, 2ALPH-E22900M22S, 2ALPHE22900M22S, E22-900M22S, SX1262, 915MHz SPI SMD LoRa Module, E22-900M22S SX1262 915MHz SPI SMD LoRa Module

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