SAMSUNG-LOGO

SAMSUNG DDR4 PC4 25600 Server Memory

SAMSUNG-DDR4-PC4-25600-Server-Memory-PRODUCT

Mga FAQ

  • P: Unsaon nako pagtino ang tukma nga configuration sa DDR4 SDRAM alang sa akong sistema?
    • A: Tan-awa ang giya sa produkto ug mga lamesa nga gihatag aron mohaum sa imong mga kinahanglanon sa sistema sa mga magamit nga kapilian base sa densidad, mga bangko, ug tipo sa pakete.
  • P: Unsa ang voltage kinahanglanon para sa DDR4 SDRAM Memory?
    • A: Ang DDR4 SDRAM Memory naglihok sa usa ka voltage sa 1.2V alang sa episyente nga pasundayag.

IMPORMASYON SA PRODUKTO

ANG SAMSUNG ELECTRONICS NAG-RESERBA SA KATUNGOD SA PAG-USAB SA MGA PRODUKTO, IMPORMASYON UG MGA ESPESPIKASYON NGA WALAY PAHIBALO

Ang mga produkto ug mga detalye nga gihisgutan dinhi alang lamang sa mga katuyoan sa pakisayran. Ang tanan nga impormasyon nga gihisgutan dinhi gihatag sa usa ka "AS IS" nga basehan, nga walay mga warranty sa bisan unsa nga matang. Kini nga dokumento ug ang tanang impormasyon nga gihisgutan dinhi nagpabilin nga bugtong ug eksklusibong kabtangan sa Samsung Electronics. Walay lisensya sa bisan unsang patente, copyright, mask work, trademark, o bisan unsang uban pang katungod sa intelektwal nga kabtangan ang gihatag sa usa ka partido ngadto sa laing partido ubos niini nga dokumento, pinaagi sa implikasyon, estoppel, o uban pa. Ang mga produkto sa Samsung wala gituyo alang sa paggamit sa suporta sa kinabuhi, kritikal nga pag-atiman, medikal, kahimanan sa kaluwasan, o susama nga mga aplikasyon diin ang pagkapakyas sa produkto mahimong moresulta sa pagkawala sa kinabuhi o personal o pisikal nga kadaot, o bisan unsang aplikasyon sa militar o depensa, o bisan unsang pagpalit sa gobyerno diin ang mga espesyal nga termino o probisyon mahimong magamit. Alang sa mga update o dugang nga impormasyon bahin sa mga produkto sa Samsung, kontaka ang imong labing duol nga opisina sa Samsung. Ang tanan nga mga ngalan sa brand, mga marka sa pamatigayon, ug mga rehistradong marka sa pamatigayon iya sa ilang tagsa-tagsa ka tag-iya.

DDR4 SDRAM MEMORY ORDERING IMPORMASYON

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (1)

  1. Memorya sa SAMSUNG: K
  2. DRAM: 4
  3. Type sa DRAM
    • A: DDR4 SDRAM (1.2V VDD)
  4. Densidad
    • 4G: 4Gb
    • 8G: 8Gb
    • AG: 16Gb
    • BG: 32Gb
  5. Bit nga Organisasyon
    • 04:x 4
    • 08:x 8
    • 16: x16
  6. # sa Internal nga mga Bangko
    • 5: 16 Bangko
  7. Interface (VDD, VDDQ)
    • W: POD (1.2V, 1.2V)
  8. Rebisyon
    • M: 1st Gen.
    • A: 2nd Gen.
    • B: 3rd Gen.
    • C: 4th Gen.
    • D: 5th Gen.
    • E: 6th Gen.
    • F: 7th Gen.
    • G: 8th Gen.
  9. Matang sa Pakete
    • B: FBGA (Halogen-free & Lead-free, Flip Chip)
    • M: FBGA (Halogen-free & Lead-free, DDP)
    • 2: FBGA (Halogen-free & Lead-free, 2H TSV)
    • 3: FBGA (Halogen-free & Lead-free, 2H 3DS)
    • 4: FBGA (Halogen-free & Lead-free, 4H TSV)
    • 5: FBGA (Halogen-free & Lead-free, 4H 3DS)
  10. Temp ug Gahum
    • C: Commercial Temp.( 0°C ~ 85°C) & Normal nga Gahom
    • I: Industrial Temp.(-40°C ~ 95°C) & Normal nga Gahum
  11. Bilis
    • PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
    • RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
    • TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
    • RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
    • TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
    • WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
    • VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21)
    • KAMI : DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22)
    • YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21)
    • AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22)

Giya sa Produkto sa Component

[Table 1] DDR4 SDRAM Component Product Guide para sa PC/SVR

Densidad Mga bangko Numero sa Bahin Pakete ug Gahum,

Temp. & Katulin

Org. VDD

Voltage

PKG Magamit. Nota
 

 

8Gb B-patay

16 Banks (4 Bank Groups) K4A8G045WB1) BCPB/RC/TD 2g x4  

1.2V

 

78 bola FBGA

 

'19 2Q EOL

 
K4A8G085WB BCPB/RC/TD 1g x8
8 Banks (2 Bank Groups) K4A8G165WB BCPB/RC/TD 512M x16 1.2V 96 bola FBGA
 

 

8Gb C-kamatayon

16 Banks (4 Bank Groups) K4A8G045WC1) BCTD/VF/KAMI 2g x4  

1.2V

 

78 bola FBGA

 

 

MP

 
K4A8G085WC BCTD/*VF/*KAMI 1g x8
8 Banks (2 Bank Groups) K4A8G165WC BCTD/*VF/*KAMI 512M x16 1.2V 96 bola FBGA
 

8Gb D-kamatayon

16 Banks (4 Bank Groups) K4A8G045WD1) BC/TD/VF/KAMI 2g x4  

1.2V

 

78 bola FBGA

'18 4Q CS  
K4A8G085WD BC/TD/*VF/*KAMI 1g x8
 

 

16Gb A-patay

16 Banks (4 Bank Groups) K4AAG085WA BCTD/*VF/*KAMI 2g x8 1.2V 78 bola FBGA  

'19 1Q CS

 
8 Banks (2 Bank Groups) K4AAG165WA BCTD/*VF/*KAMI 1g x16 1.2V 96 bola FBGA
 

 

32Gb A-patay

16 Banks (4 Bank Groups) K4AAG085WA BCTD/*VF/*KAMI 2g x8 1.2V 78 bola FBGA  

'19 1Q CS

 
8 Mga bangko

(2 Mga Grupo sa Bangko)

K4AAG165WA BCTD/*VF/*KAMI 1g x16 1.2V 96 bola FBGA

NOTA: 1) Palihog kontaka ang Samsung para sa sampang pagkaanaa.

[Table 2] DDR4 SDRAM Component Product Guide para sa Consumer

Densidad Mga bangko Numero sa Bahin Pakete ug Gahum,

Temp. & Katulin

Org. VDD

Voltage

PKG Magamit. Nota
 

 

4Gb D-kamatayon

16 Banks (4 Bank Groups) K4A4G085WD BCPB/RC BIPB/RC 512M x8 1.2V 78 bola FBGA  

'18 4Q EOL

 
8 Banks (2 Bank Groups) K4A4G165WD BCPB/RC BIPB/RC 256M x16 1.2V 96 bola FBGA  
 

 

4Gb E-kamatayon

16 Banks (4 Bank Groups) K4A4G085WE BCRC/TD/KAMI BIRC/TD/KAMI 512M x8 1.2V 78 bola FBGA  

 

MP

 
8 Banks (2 Bank Groups) K4A4G165WE BCRC/TD/KAMI BIRC/TD/KAMI 256M x16 1.2V 96 bola FBGA  
 

 

4Gb F-kamatayon

16 Banks (4 Bank Groups) K4A4G085WF BCTD/*KAMI 512M x8 1.2V 78 bola FBGA  

'18 4Q CS

 
8 Banks (2 Bank Groups) K4A4G165WF BCTD/*KAMI 256M x16 1.2V 96 bola FBGA  
 

 

8Gb B-patay

16 Banks (4 Bank Groups) K4A8G085WB BCRC/TD/KAMI BIRC/TD/KAMI 1g x8 1.2V 78 bola FBGA  

 

MP

 
8 Banks (2 Bank Groups) K4A8G165WB BCRC/TD/KAMI BIRC/TD/KAMI 512M x16 1.2V 96 bola FBGA  
 

 

8Gb C-kamatayon

16 Banks (4 Bank Groups) K4A8G085WC BCRC/TD/*KAMI 1g x8 1.2V 78 bola FBGA  

 

MP

 
8 Banks (2 Bank Groups) K4A8G165WC BCRC/TD/*KAMI 512M x16 1.2V 96 bola FBGA  
 

 

16Gb B-patay

16 Banks (4 Bank Groups) K4AAG085WB MCRC/TD 1g x8 1.2V 78 bola FBGA  

 

MP

 
8 Banks (2 Bank Groups) K4AAG165WB MCRC/TD 512M x16 1.2V 96 bola FBGA  
 

 

16Gb A-patay

16 Banks (4 Bank Groups) K4AAG085WA BCTD/*KAMI 2g x8 1.2V 78 bola FBGA  

'19 1Q CS

 
8 Mga bangko

(2 Mga Grupo sa Bangko)

K4AAG165WA BCTD/*KAMI 1g x16 1.2V 96 bola FBGA  

Impormasyon sa Pag-order sa Module

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (2)

  • Module sa Memorya: M
  • Type sa DIMM
    • 3: DIMM
    • 4: SODIMM
  • Mga Bit sa Data
    • 71: x64 260pin Unbuffered SODIMM
    • 74: x72 260pin ECC nga Wala'y Buffered SODIMM
    • 78: x64 288pin Unbuffered DIMM
    • 86: x72 288pin Load-Reduced DIMM
    • 91: x72 288pin ECC nga Wala Gibuy-an DIMM
    • 92: x72 288pin VLP Rehistrado nga DIMM
    • 93: x72 288pin Rehistrado nga DIMM
  • DRAM Component Type
    • A: DDR4 SDRAM (1.2V VDD)
  • Kalalim
    • 56:256M
    • 51:512M
    • 1G: 1G
    • 2G: 2G
    • 4G: 4G
    • 8G: 8G
      • AG: 16G
      • 1K: 1G (para sa 8Gb)
      • 2K: 2G (para sa 8Gb)
      • 4K: 4G (para sa 8Gb)
      • 8K: 8G (para sa 8Gb)
      • AK: 16G
  • # sa mga Bangko sa comp. & Interface
    • 4 : 16Mga Bangko & POD-1.2V
  • Bit nga Organisasyon
    • 0:x 4
    • 3:x 8
    • 4:x 16
  • Pagbag-o sa Component
    • M: 1st Gen.
    • B: 3rd Gen.
    • D: 5th Gen.
    • F: 7th Gen.
    • A: 2nd Gen.
    • C: 4th Gen.
    • E: 6th Gen.
    • G: 8th Gen.
  • Pakete
    • B: FBGA (Halogen-free & Lead-free, Flip Chip)
    • M: FBGA (Halogen-free & Lead-free, DDP)
    • 2: FBGA (Halogen-free & Lead-free, 2H TSV)
    • 3: FBGA (Halogen-free & Lead-free, 2H 3DS)
    • 4: FBGA (Halogen-free & Lead-free, 4H TSV)
    • 5: FBGA (Halogen-free & Lead-free, 4H 3DS)
  • Pagbag-o sa PCB
    • 0: Wala
    • 1: 1st Rev.
    • 2: 2nd Rev.
    • 3: 3rd Rev.
    • 4: 4 nga Rev.
  • Temp ug Gahum
    • C: Commercial Temp.(0°C ~ 85°C) & Normal nga Gahum
  • Bilis
    • PB: DDR4-2133 (1066MHz @ CL=15, tRCD=15, tRP=15)
    • RC: DDR4-2400 (1200MHz @ CL=17, tRCD=17, tRP=17)
    • TD: DDR4-2666 (1333MHz @ CL=19, tRCD=19, tRP=19)
    • RB: DDR4-2133 (1066MHz @ CL=17, tRCD=15, tRP=15)
    • TC: DDR4-2400 (1200MHz @ CL=19, tRCD=17, tRP=17)
    • WD: DDR4-2666 (1333MHz @ CL=22, tRCD=19, tRP=19)
    • VF: DDR4-2933 (1466MHz @ CL=21, tRCD=21, tRP=21)
    • KAMI: DDR4-3200 (1600MHz @ CL=22, tRCD=22, tRP=22)
    • YF: DDR4-2933 (1466MHz @ CL=24, tRCD=21, tRP=21)
    • AE: DDR4-3200 (1600MHz @ CL=26, tRCD=22, tRP=22)

DDR4 SDRAM MODULE GIYA SA PRODUKTO

288Pin DDR4 Rehistrado nga DIMM

[Table 3] 288Pin DDR4 Rehistrado nga DIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp & Power & Speed Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

1g x72 8GB M393A1G40EB1 CPB C (1Rx4) 1G x4 * 18pcs 4Gb E-mamatay 16 1 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1G40EB1 CRC C (1Rx4) 1G x4 * 18pcs 4Gb E-mamatay 16 1 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1G40EB2 CTD C (1Rx4) 1G x4 * 18pcs 4Gb E-mamatay 16 1 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1G43EB1 CPB E (2Rx8) 512G x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1G43EB1 CRC E (2Rx8) 512G x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1G43EB1 CTD E (2Rx8) 512G x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M393A1K43BB0 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
1g x72 8GB M393A1K43BB0 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
1g x72 8GB M393A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M393A2G40EB1 CPB A (2Rx4) 1G x4 * 36pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
2g x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
2g x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
2g x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M393A2G40EB1 CRC A (2Rx4) 1G x4 * 36pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
2g x72 16GB M393A2G40EB2 CTD A (2Rx4) 1G x4 * 36pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
2g x72 16GB M393A2K40BB0 CPB C (1Rx4) 2G x4 * 18pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K40BB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K40BB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
4g x72 32GB M393A4K40BB0 CPB A (2Rx4) 2G x4 * 36pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
4g x72 32GB M393A4K40BB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP

[Table 3] 288Pin DDR4 Rehistrado nga DIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp &

Gahum & Katulin

Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

4g x72 32GB M393A4K40BB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
8g x72 64GB M393A8K40B21 CRB A (4Rx4) 3DS 2H

8G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M393A8K40B21 CTC A (4Rx4) 3DS 2H

8G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M393A8K40B2B CTC A (4Rx4) 3DS 2H

8G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M393A8K40B22 CWD B (4Rx4) 3DS 2H

8G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
16g x72 128GB M393AAK40B41 CTC A (8Rx4) 3DS 4H

8G x4 * 36pcs

8Gb B-mamatay 16 8 78ball FBGA 31.25mm MP
16g x72 128GB M393AAK40B42 CWD B (8Rx4) 3DS 4H

8G x4 * 36pcs

8Gb B-mamatay 16 8 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43CB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43CB2 CTD E (2Rx8) 1G x8 * 18pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K43CB2 FVC E (2Rx8) 1G x8 * 18pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm CS 3Q'18
2g x72 16GB M393A2K40CB1 CRC C (1Rx4) 2G x4 * 18pcs 8Gb C-mamatay 16 1 78 bola 31.25mm MP
2g x72 16GB M393A2K43CB2 FVC E (2Rx8) 1G x8 * 18pcs 8Gb C-mamatay 16 2 78 bola
FBGA
31.25mm CS 3Q'18
2g x72 16GB M393A2K40CB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb C-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M393A2K40CB2 CTD C (1Rx4) 2G x4 * 18pcs 8Gb C-mamatay 16 1 78 bola
FBGA
31.25mm MP
2g x72 16GB M393A2K40CB2 FVC C (1Rx4) 2G x4 * 18pcs 8Gb C-mamatay 16 1 78 bola

FBGA

31.25mm CS

3Q'18

4g x72 32GB M393A4K40CB1 CRC A (2Rx4) 2G x4 * 36pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm MP
4g x72 32GB M393A4K40CB2 CTD B (2Rx4) 2G x4 * 36pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm MP
4g x72 32GB M393A4K40CB2 FVC B (2Rx4) 2G x4 * 36pcs 8Gb C-mamatay 16 2 78ball FBGA 31.25mm CS 3Q'18

288Pin DDR4 Load-Reduced DIMM

[Table 4] 288Pin DDR4 Load-Reduced DIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp & Power & Speed Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

4g x72 32GB M386A4G40EM2 CPB D (4Rx4) DDP 2G x4 *

36 pcs

4Gb E-mamatay 16 4 78ball FBGA 31.25mm EOL 2Q'18
4g x72 32GB M386A4G40EM2 CRC D (4Rx4) DDP 2G x4 *

36 pcs

4Gb E-mamatay 16 4 78ball FBGA 31.25mm EOL 2Q'18
4g x72 32GB M386A4K40BB0 CRC A (2Rx4) 2G x4 * 36pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40BM1 CPB D (4Rx4) DDP

4G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40BM1 CRC D (4Rx4) DDP

4G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40BM2 CTD D (4Rx4) DDP

4G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40BMB CPB D (4Rx4) DDP

4G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40BMB CRC D (4Rx4) DDP

4G x4 * 36pcs

8Gb B-mamatay 16 4 78ball FBGA 31.25mm MP
16g x72 128GB M386AAK40B40 CUC A (8Rx4) 3DS 4H

8G x4 * 36pcs

8Gb B-mamatay 16 8 78ball FBGA 31.25mm MP
16g x72 128GB M386AAK40B40 CWD A (8Rx4) 3DS 4H

8G x4 * 36pcs

8Gb B-mamatay 16 8 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40CM2 CRC D (4Rx4) DDP

4G x4 * 36pcs

8Gb C-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40CM2 CTD D (4Rx4) DDP

4G x4 * 36pcs

8Gb C-mamatay 16 4 78ball FBGA 31.25mm MP
8g x72 64GB M386A8K40CM2 FVC D (4Rx4) DDP

4G x4 * 36pcs

8Gb C-mamatay 16 4 78ball FBGA 31.25mm CS 3Q'18

288Pin DDR4 VLP Rehistrado nga DIMM

[Table 5] 288Pin DDR4 VLP Rehistrado nga DIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp & Power & Speed Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

2g x72 16GB M392A2K43BB0 CPB H (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 18.75mm MP
2g x72 16GB M392A2K43BB0 CRC H (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 18.75mm MP
4g x72 32GB M392A4K40BM0 CPB J (2Rx4) 4G x4 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 18.75mm MP
4g x72 32GB M392A4K40BM0 CRC J (2Rx4) 4G x4 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 18.75mm MP

260Pin DDR4 ECC SODIMM

[Table 6] 260Pin DDR4 ECC SODIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp &

Gahum & Katulin

Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

1g x72 8GB M474A1G43EB1 CPB G (2Rx8) 512M x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 30mm EOL 2Q'18
1g x72 8GB M474A1G43EB1 CRC G (2Rx8) 512M x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 30mm EOL 2Q'18
1g x72 8GB M474A1K43BB1 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 30mm MP
2g x72 16GB M474A2K43BB1 CPB G (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm MP
 

2g x72

 

16GB

 

M474A2K43BB1

 

CRC

 

G (2Rx8)

 

1G x8 * 18pcs

 

8Gb

 

B-mamatay

 

16

 

2

78 bola

 

FBGA

 

30mm

 

MP

2g x72 16GB M474A2K43BB1 CTD G (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm MP

260Pin DDR4 ECC UDIMM

[Table 7] 260Pin DDR4 ECC UDIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp & Power & Speed Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

512M x72 4GB M391A5143EB1 CPB D (1Rx8) 512M x8 * 9pcs 4Gb E-mamatay 16 1 78ball FBGA 31.25mm EOL 2Q'18
512M x72 4GB M391A5143EB1 CRC D (1Rx8) 512M x8 * 9pcs 4Gb E-mamatay 16 1 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M391A1G43EB1 CPB E (2Rx8) 512M x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M391A1G43EB1 CRC E (2Rx8) 512M x8 * 18pcs 4Gb E-mamatay 16 2 78ball FBGA 31.25mm EOL 2Q'18
1g x72 8GB M391A1K43BB1 CPB D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
1g x72 8GB M391A1K43BB1 CRC D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
1g x72 8GB M391A1K43BB2 CTD D (1Rx8) 1G x8 * 9pcs 8Gb B-mamatay 16 1 78ball FBGA 31.25mm MP
2g x72 16GB M391A2K43BB1 CPB E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M391A2K43BB1 CRC E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP
2g x72 16GB M391A2K43BB1 CTD E (2Rx8) 1G x8 * 18pcs 8Gb B-mamatay 16 2 78ball FBGA 31.25mm MP

260Pin DDR4 Non ECC SODIMM

[Table 8] 260Pin DDR4 Non ECC SODIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp & Power & Speed Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

256M x64 2GB M471A5644EB0 CRC C (1Rx16) 256M x16 * 4pcs 4Gb E-mamatay 8 1 96ball FBGA 30mm EOL '18 1Q
512M x64 4GB M471A5244CB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb C-mamatay 8 1 96ball FBGA 30mm MP
512M x64 4GB M471A5244BB0 CRC C (1Rx16) 256M x16 * 4pcs 8Gb B-mamatay 8 1 96ball FBGA 30mm EOL '19 1Q
512M x64 4GB M471A5244BB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb B-mamatay 8 1 96ball FBGA 30mm EOL '19 1Q
512M x64 4GB M471A5143EB1 CRC A (1Rx8) 512M x8 * 8pcs 4Gb E-mamatay 16 1 78ball FBGA 30mm EOL '18 2Q
1g x64 8GB M471A1K43DB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-mamatay 16 1 78ball FBGA 30mm MP
1g x64 8GB M471A1K43CB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-mamatay 16 1 78ball FBGA 30mm MP
1g x64 8GB M471A1K43CB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-mamatay 16 1 78ball FBGA 30mm MP
1g x64 8GB M471A1K43BB1 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-mamatay 16 1 78ball FBGA 30mm EOL '19 1Q
1g x64 8GB M471A1K43BB1 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-mamatay 16 1 78ball FBGA 30mm EOL '19 1Q
1g x64 8GB M471A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-mamatay 16 2 78ball FBGA 30mm EOL '18 2Q
2g x64 16GB M471A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-mamatay 16 2 78ball FBGA 30mm MP
2g x64 16GB M471A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-mamatay 16 2 78ball FBGA 30mm MP
2g x64 16GB M471A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-mamatay 16 2 78ball FBGA 30mm MP
2g x64 16GB M471A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm EOL '19 1Q
2g x64 16GB M471A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm EOL '19 1Q
4g x64 32GB M471A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-mamatay 16 2 78ball FBGA 30mm MP
4g x64 32GB M471A4G43AB1 FVC E (2Rx8) 2G x8 * 16pcs 16Gb A-mamatay 16 2 78ball FBGA 30mm CS '18 4Q

260Pin DDR4 Non ECC UDIMM

[Table 9] 260Pin DDR4 Non ECC UDIMM

 

Org.

 

Densidad

 

Numero sa Bahin

Temp &

Gahum & Katulin

Hilaw nga Card  

Komposisyon

 

Gibutyag ni Comp. Bersyon

 

Internal nga mga Bangko

 

Ranggo

 

PKG

 

Taas

 

Magamit.

256M x64 2GB M378A5644EB0 CRC C (1Rx16) 256M x16 * 4pcs 4Gb E-mamatay 8 1 96ball FBGA 30mm EOL '18 1Q
512M x64 4GB M378A5244CB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb C-mamatay 8 1 96ball FBGA 30mm MP
512M x64 4GB M378A5244BB0 CRC C (1Rx16) 256M x16 * 4pcs 8Gb B-mamatay 8 1 96ball FBGA 30mm EOL '19 1Q
512M x64 4GB M378A5244BB0 CTD C (1Rx16) 256M x16 * 4pcs 8Gb B-mamatay 8 1 96ball FBGA 30mm EOL '19 1Q
512M x64 4GB M378A5143EB2 CRC A (1Rx8) 512M x8 * 8pcs 4Gb E-mamatay 16 1 78ball FBGA 30mm EOL '18 2Q
1g x64 8GB M378A1K43DB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb D-mamatay 16 1 78ball FBGA 30mm CS '18 2Q
1g x64 8GB M378A1K43CB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb C-mamatay 16 1 78ball FBGA 30mm MP
1g x64 8GB M378A1K43CB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb C-mamatay 16 1 78ball FBGA 30mm MP
1g x64 8GB M378A1K43BB2 CRC A (1Rx8) 1G x8 * 8pcs 8Gb B-mamatay 16 1 78ball FBGA 30mm EOL '19 1Q
1g x64 8GB M378A1K43BB2 CTD A (1Rx8) 1G x8 * 8pcs 8Gb B-mamatay 16 1 78ball FBGA 30mm EOL '19 1Q
1g x64 8GB M378A1G43EB1 CRC E (2Rx8) 512M x8 * 16pcs 4Gb E-mamatay 16 2 78ball FBGA 30mm EOL '18 2Q
2g x64 16GB M378A2K43DB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb D-mamatay 16 2 78ball FBGA 30mm CS '18 2Q
2g x64 16GB M378A2K43CB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb C-mamatay 16 2 78ball FBGA 30mm MP
2g x64 16GB M378A2K43CB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb C-mamatay 16 2 78ball FBGA 30mm MP
2g x64 16GB M378A2K43BB1 CRC E (2Rx8) 1G x8 * 16pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm EOL '19 1Q
2g x64 16GB M378A2K43BB1 CTD E (2Rx8) 1G x8 * 16pcs 8Gb B-mamatay 16 2 78ball FBGA 30mm EOL '19 1Q
4g x64 32GB M378A4G43MB1 CTD E (2Rx8) 2G x8 * 16pcs 16Gb M-mamatay 16 2 78ball FBGA 30mm CS '18 2Q
4g x64 32GB M378A4G43AB1 FVC E (2Rx8) 2G x8 * 16pcs 16Gb A-mamatay 16 2 78ball FBGA 30mm CS '19 1Q

RDIMM LRDIMM Memory Buffer nga Impormasyon

Label Example

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (3)

Impormasyon sa Deskripsyon sa JEDEC

  1. Kinatibuk-ang kapasidad sa module, sa gigabytes, alang sa nag-unang bus (ECC wala maihap)
  2. Gidaghanon sa mga ranggo sa pakete sa memorya nga na-install ug gidaghanon sa mga lohikal nga ranggo matag ranggo sa pakete
  3. Organisasyon sa device (data bit width) sa mga SDRAM nga gigamit niini nga asembliya
  4. SDRAM ug suporta nga sangkap nga suplay voltage (VDD) blangko = 1.2 V nga magamit
  5. Ang gikusgon sa module sa Mb/s/data pin
  6. SDRAM speed nga grado
  7. Matang sa Module
    • A = Unbuffered 16-bit Small Outline DIMM (“16b-SO-DIMM”), x16 data bus (placeholder)
    • B = Unbuffered 32-bit Small Outline DIMM (“32b-SO-DIMM”), x32 data bus (placeholder)
    • C = Rehistrado nga 72-bit Small Outline DIMM (“72b-SO-RDIMM”), x64 primary + 8 bit ECC module data bus(placeholder) E = Unbuffered DIMM (“UDIMM”), x64 primary + 8 bit ECC module data bus
    • L = Load-Reduced DIMM (“LRDIMM”), x64 primary + 8 bit ECC module data bus
    • N = Mini nga narehistro nga DIMM ("Mini-RDIMM"), x64 panguna + 8 bit ECC module data bus
    • R = Rehistradong DIMM (“RDIMM”), x64 primary + 8 bit ECC module data bus
    • S = Gamay nga Outline DIMM (“SO-DIMM”), walay ECC (x64 bit module data bus)
    • T = Unbuffered 72-bit Small Outline DIMM (“72b-SO-DIMM”), x64 primary + 8 bit ECC module data bus
    • U = Unbuffered DIMM (“UDIMM”), walay ECC (x64 bit module data bus)
    • W = Mini unbuffered DIMM (“Mini-UDIMM”), x64 primary + 8 bit ECC module data bus
  8. Disenyo sa pakisayran file gigamit alang niini nga disenyo (kung mahimo)
    • A = Reference design para sa raw card 'A' gigamit alang niini nga asembliya
    • B = Reference design para sa raw card 'B' gigamit alang niini nga asembliya
    • AC = Reference design alang sa raw card 'AC' gigamit alang niini nga asembliya (example lang)
    • ZZ = Walay JEDEC standard reference designs ang gigamit alang niini nga asembliya
  9. Numero sa rebisyon sa reference nga disenyo nga gigamit
    • 0 = Inisyal nga pagpagawas
    • 1 = Unang rebisyon
    • 2 = Ikaduha nga rebisyon
    • P = Pre-release o Engineering sample
    • Z = Aron gamiton kung ang reference raw card = ZZ
  10. JEDEC SPD Revision Encoding and Additions level nga gigamit niini nga DIMM

Impormasyon sa RCD (& Data Buffer).

(Kini nga mga code kay gigamit ra sa SAMSUNG, Dili JEDEC) 11&12. RCD, Data Buffer Revision & Vendor nga gigamit niini nga DIMM

Deskripsyon sa Jedec sa label Buffer Vendor RCD ver DB ver (LRDIMM ra)
DC0 IDT C0 B1
MB1 Si Montage B1 A1
MC0 Si Montage C0 B0
DC3 IDT C0 A3
MA0 Si Montage A0 A1
DB1 IDT B1 B0
PA0 Rambus (Inphi) A0 A0
DC1 IDT C1 C1

DIMENSYON SA PACKAGE

78ball FBGA alang sa

  • 4Gb D-die (x4/x8) / DDP 8Gb D-die (x4) / 4H 16Gb D-die (x4)
  • 4Gb E-die (x4/x8)
  • 8Gb B-die (x4/x8) / DDP 16Gb B-die (x4) / 2H 16Gb B-die (x4) / 4H 32Gb B-die (x4) 8Gb C-die (x4/x8)

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (4)

78ball FBGA para sa 16Gb M-die (x4/x8)

SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (5)

  • 96ball FBGA para sa 4Gb D-die (x16) / 4Gb E-die (x16)
    • 8Gb B-die (x16) / 8Gb C-die (x16)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (6)
  • 96ball FBGA para sa 16Gb M-die (x16)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (7)

DIMENSYON SA MODULE

  • x72 288pin DDR4 SDRAM RDIMM
  • x72 288pin DDR4 SDRAM LRDIMM
  • x72 288pin DDR4 SDRAM ECC UDIMM
  • x64 288pin DDR4 SDRAM Dili ECC UDIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (8)
  • x72 260pin DDR4 SDRAM ECC SODIMM
  • x64 260pin DDR4 SDRAM Dili ECC SODIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (9)
  • x72 288pin DDR4 SDRAM VLP RDIMMSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (10)
  • x72 288pin DDR4 SDRAM VLP RDIMM Heat Spreader Design Guide (DDP)
  1. ATUBANGANSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (11)
  2. BALIKSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (12)
  3. CLIPSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (13)
  4. ASS'Y VIEW
    • Kinatibuk-ang gibag-on sa pakisayran (Maximum): 7.30 (Adunay gibag-on sa clip)SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (14)

x72 288pin DDR4 SDRAM RDIMM Heat Spreader Design Guide (TSV)

  1. UNANG BAHINSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (15)
  2. BALIK NGA BAHINSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (16)
  3. CLIP BAHINSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (17)

x72 288pin DDR4 SDRAM LRDIMM Heat Spreader Design Guide (DDP)

  1. UNANG BAHINSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (18)
  2. BALIK NGA BAHIN
  3. SAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (19)CLIP BAHINSAMSUNG-DDR4-PC4-25600-Server-Memory-FIG (20)

DUGANG IMPORMASYON

Mga Dokumento / Mga Kapanguhaan

SAMSUNG DDR4 PC4 25600 Server Memory [pdf] Giya sa Gumagamit
DDR4 PC4 25600 Server Memory, DDR4 PC4 25600, Server Memory, Memorya

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