Renesas RA Family

EK-RA2L1 Example Project Bundle

Application Note

Introduction

This document describes the contents of the Example Project Bundle for the EK-RA2L1 kit. The Example Projects contained within the bundle provide example code for the various Renesas Flexible Software Package (FSP) modules supported by the EK-RA2L1 kit.

Flexible Software Package (FSP) is an optimized software package designed to provide easy-to-use, scalable, high-quality software for embedded system design. Its primary goal is to provide lightweight, efficient drivers that meet common use cases in embedded systems. FSP code quality is enforced by peer reviews, automated requirements-based testing, and automated static analysis. FSP provides uniform and intuitive APIs that are well-documented. Each module is supported with detailed user documentation, including example code. FSP modules can be used on any MCU in the RA family, provided the MCU has the necessary peripherals. FSP modules also feature build-time configurations to optimize module size for the required application feature set.

Supported Hardware and Software

Supported Kit

EK-RA2L1

Supported FSP Version

FSP v 2.4.0 or later

Supported Toolchains

  • e² studio Integrated Development Environment (IDE), with the default toolchain being GCC Arm Embedded.
  • Keil MDK with Arm compiler toolchain.
  • IAR EWARM with IAR toolchain for Arm.

Using the Example Projects

To use the EK-RA2L1 Example Projects, follow the steps mentioned in the following documents:

List of Example Projects Supported on Different Toolchains

Example Projectse² studio/GCCe² studio/AC6Keil MDKIAR
QuickStartSupportedSupported via port from GCC
ACMPLPSupportedSupported via port from GCC
ADCSupportedSupported via port from GCC
AGTSupportedSupported via port from GCCSupportedSupported
BAREMETALSupportedSupported via port from GCC
CACSupportedSupported via port from GCC
CPPSupportedSupported via port from GCC
CRCSupportedSupported via port from GCC
DCDCSupportedSupported via port from GCC
DOCSupportedSupported via port from GCC
ELCSupportedSupported via port from GCC
Flash LPSupportedSupported via port from GCCSupportedSupported
FreeRTOSSupportedSupported via port from GCCSupportedSupported
GPTSupportedSupported via port from GCCSupportedSupported
GPT Input CaptureSupportedSupported via port from GCC
ICUSupportedSupported via port from GCCSupportedSupported
IIC MasterSupportedSupported via port from GCC
IIC SlaveSupportedSupported via port from GCCSupportedSupported
IWDTSupportedSupported via port from GCC
KINTSupportedSupported via port from GCC
LPMSupportedSupported via port from GCC
MBED-CRYPTOSupportedSupported via port from GCC
RTCSupportedSupported via port from GCCSupportedSupported
SCI I2CSupportedSupported via port from GCC
SCI SPISupportedSupported via port from GCC
SCI UARTSupportedSupported via port from GCCSupportedSupported
SPISupportedSupported via port from GCCSupportedSupported
VEEPROMSupportedSupported via port from GCC
WDTSupportedSupported via port from GCCSupportedSupported
Wi-FiSupportedSupported via port from GCC

Website and Support

Visit the following URLs to learn about key elements of the RA family, download components and related documentation, and get support.

Revision History

Rev.DateDescriptionPageSummary
1.00Dec.01.20First release document
1.01Feb.02.21Added support for FSP 2.3.0
1.02Mar.10.21Added support for QuickStart and DCDC
1.03Apr.06.21Added support for FSP 2.4.0
1.04Apr.23.21Added BAREMETAL

Important Notice and Legal Information

This document provides information to illustrate semiconductor product operation and application examples. Users are fully responsible for the incorporation and use of this information in their products or systems. Renesas Electronics disclaims liability for any losses or damages arising from such use.

No licenses are granted for third-party intellectual property rights. Users must obtain necessary licenses for product import, export, manufacture, and sales. Renesas Electronics products are classified into "Standard" and "High Quality" grades, with specific intended applications. Products are not authorized for use in systems that pose a direct threat to human life or bodily injury, or cause serious property damage, unless expressly designated for such use.

Renesas Electronics products are not guaranteed to be invulnerable to security breaches. Users are responsible for implementing safety measures and ensuring compliance with all applicable laws and regulations, including environmental and export control regulations.

For detailed information, product handling guidelines, and support, please refer to the latest product documentation and contact Renesas Electronics sales offices or visit www.renesas.com/contact/.

Trademarks: Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All other trademarks are the property of their respective owners.

Corporate Headquarters: TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan. Website: www.renesas.com.

Copyright © 2021 Renesas Electronics Corporation. All rights reserved.

r20an0598eu0104-ek-ra2l1-exampleprojects Renesas Electronics Corporation SetaPDF-Merger Component v2.27.0.1196 ©Setasign 2005-2021 (www.setasign.com)

Related Documents

Preview Renesas EK-RA4M2 Example Project Bundle: Comprehensive Guide
Explore the Renesas EK-RA4M2 Example Project Bundle, featuring the Flexible Software Package (FSP) for embedded system design. This guide details supported kits, FSP versions, toolchains, and provides a comprehensive list of example projects with their toolchain compatibility.
Preview High Performance with Renesas RA8 MCU using Arm Cortex-M85 and Helium™
Explore how to achieve significant performance gains in embedded applications using Renesas RA8 MCUs with the Arm Cortex-M85 core and Helium™ technology. This application note guides developers through optimizing DSP and ML workloads with vector extensions, Tightly Coupled Memory (TCM), and data cache.
Preview Renesas Synergy プロジェクト インポートガイド
Renesas Synergy プロジェクトを IAR Embedded Workbench for Renesas Synergy™ または e² studio にインポート、ビルド、実行するための詳細な手順を解説するガイドです。開発環境のセットアップからデバッグまでを網羅しています。
Preview Renesas RA2L1 Group: 32-bit MCU User's Manual - Hardware Specifications and Features
This user's manual provides comprehensive details on the Renesas RA2L1 Group, a series of 32-bit microcontrollers featuring the energy-efficient Arm Cortex-M23 core. It covers hardware specifications, features, peripherals, and usage guidelines for system designers.
Preview Renesas RA2 MCU Secure Bootloader Implementation Guide with MCUboot and TinyCrypt
This application note from Renesas guides developers through the implementation of a secure bootloader for the RA2 MCU Series using MCUboot and TinyCrypt, detailing setup, optimization, and application integration.
Preview Renesas Flexible Software Package (FSP) v4.6.0 User's Manual
Comprehensive user manual for Renesas Flexible Software Package (FSP) v4.6.0, guiding developers on embedded system design for Renesas RA microcontrollers using e² studio, FSP architecture, APIs, and tutorials.
Preview Renesas RZ/G2L RZ/G2LC: Getting Started with Flexible Software Package
This application note guides developers through using the Renesas Flexible Software Package (FSP) and e2 studio IDE for the RZ/G2L and RZ/G2LC microprocessors. It covers environment setup, project creation, debugging, and a practical 'Blinky' tutorial.
Preview Renesas Flash Programmer: Command Line Usage Guide
Learn how to automate microcontroller programming with the Renesas Flash Programmer (RFP) using command-line interfaces. This guide covers setup, project files, batch files, and rfp-cli examples for various Renesas MCU families.