1. Introduction
This manual provides detailed instructions for the safe and efficient operation, setup, and maintenance of your BDJSN Manual SMT Screen Printer. This machine is designed for accurately applying solder paste onto Printed Circuit Boards (PCBs) using a stencil, facilitating the Surface Mount Technology (SMT) assembly process.
Please read this manual thoroughly before operating the machine to ensure proper usage and to prevent damage or injury.
2. Safety Instructions
- Always wear appropriate personal protective equipment (PPE), such as safety glasses and gloves, when operating the machine and handling solder paste.
- Ensure the machine is placed on a stable, level surface to prevent tipping or movement during operation.
- Keep the work area clean and free of obstructions.
- Do not attempt to modify the machine. Use only original replacement parts if repairs are necessary.
- Keep hands and fingers clear of moving parts during operation.
- Properly dispose of solder paste and cleaning materials according to local regulations.
3. Package Contents
Upon unpacking, verify that all components are present and undamaged. The package should include:
- 1x BDJSN Solder Paste Printer
- 1x Spatula (for solder paste handling)
- 1x Mixing Knife (for solder paste preparation)

Figure 3.1: The BDJSN Solder Paste Printer shown with the included spatula and mixing knife, essential tools for solder paste application and preparation.
4. Specifications
| Feature | Specification |
|---|---|
| Workbench Size | 300 x 400 mm |
| Maximum Print Size | 250 x 400 mm |
| Maximum Screen Frame Size | 370 x 470 mm |
| Printing Method | Manual |
| Substrate Thickness | 0 - 80 mm |
| Workbench Adjustment Amount | 10 mm (horizontal angle adjustment) |
| Printing Platform Height | 220 mm |
| Repeat Accuracy | ±0.01 mm |
| Positioning Method | Datum or Hole Shape / Outline or Reference Hole |
| Dimensions (L x W x H) | 540 x 380 x 390 mm |

Figure 4.1: Visual representation of the printer's dimensions and a summary of its key specifications, including workbench size, print size, and accuracy.
5. Component Identification
Familiarize yourself with the various parts of the SMT Screen Printer before operation.

Figure 5.1: Detailed view of the SMT Screen Printer with its main components labeled for easy identification. Key parts include the Working Platform, Positioning Needle, Fixed Plate, Y Axis Rotary Knob, Adjustable Foot Of Base, Counter Weight, Template Fixed Knob, Height Adjustment Knob, X Axis Rotary Knob, and Base.
- Working Platform: The surface where the PCB is placed for printing.
- Positioning Needle/Fixed Plate: Used to precisely align and secure the PCB on the working platform.
- Y Axis Rotary Knob: Adjusts the working platform's position along the Y-axis.
- X Axis Rotary Knob: Adjusts the working platform's position along the X-axis.
- Adjustable Foot Of Base: Allows for leveling the entire machine on uneven surfaces.
- Counter Weight: Balances the screen frame for smooth lifting and lowering.
- Template Fixed Knob: Secures the screen stencil frame in place.
- Height Adjustment Knob: Controls the vertical distance between the screen stencil and the PCB.
- Base: The main support structure of the printer.
6. Setup
6.1 Unpacking and Placement
- Carefully remove the printer from its packaging.
- Place the printer on a sturdy, level workbench in a well-ventilated area.
- Adjust the Adjustable Foot Of Base (Figure 5.1) to ensure the machine is perfectly level and stable.
6.2 Screen Template Installation
- Lift the screen frame holder to its upright position (Figure 6.1).
- Place your SMT stencil (screen template) into the frame holder.
- Secure the stencil using the four Template Fixed Knobs with pressure plates (Figure 6.2). Ensure the stencil is firmly held without excessive tension.

Figure 6.1: The screen template holder in the raised position, illustrating the space for stencil placement.

Figure 6.2: The screen template is secured by four knobs with pressure plates, providing a stable and firm attachment for printing.
6.3 PCB Positioning
- Place the PCB onto the Working Platform.
- Utilize the Positioning Needles, Fixed Plates, and Movable Ejector Pins (Figure 6.3) to precisely align the PCB. The movable ejector pins and support plate allow for flexible positioning, convenient for single or double-sided printing.
- Adjust the position of the PCB using the X Axis Rotary Knob and Y Axis Rotary Knob (Figure 5.1) until it is perfectly aligned with the stencil apertures.

Figure 6.3: The working platform features movable ejector pins and support plates for flexible PCB positioning, along with fixed rods and plates for precise circuit board alignment.
7. Operating Instructions
7.1 Adjusting Printing Height
- Lower the screen frame until it rests just above the PCB.
- Use the Height Adjustment Knob (Figure 5.1) which utilizes a spiral screw mechanism (Figure 7.1) to fine-tune the vertical distance between the stencil and the PCB. The goal is to achieve a small, consistent gap (snap-off distance) for optimal paste release.

Figure 7.1: The steel mesh bracket incorporates a spiral screw for precise up and down height adjustment, enabling easy control over the printing gap.
7.2 Applying Solder Paste
- Using the provided spatula or mixing knife, apply a bead of solder paste across the top edge of the stencil, just above the PCB's printing area.
- Ensure an even distribution of paste along the width of the stencil.
7.3 The Printing Process
- With the screen frame lowered and the PCB aligned, use a squeegee (not included, but essential for printing) to spread the solder paste across the stencil.
- Apply even pressure and a consistent speed as you draw the squeegee across the stencil, ensuring the paste fills all apertures.
- After one pass, lift the screen frame carefully. The solder paste should now be deposited onto the PCB pads.
- Inspect the printed PCB for quality. The machine offers guaranteed repeatability and precision fine-tuning (Figure 7.2) for consistent results.

Figure 7.2: The printer's design ensures guaranteed repeatability, adjustable height for various PCB thicknesses, and precision fine-tuning for accurate alignment.
8. Maintenance
8.1 Cleaning After Use
- Immediately after printing, clean the stencil thoroughly to prevent solder paste from drying and clogging the apertures. Use an appropriate stencil cleaner and lint-free wipes.
- Clean any solder paste residue from the working platform and machine frame.
- Ensure all moving parts are free of debris.
8.2 General Care
- Periodically check all knobs and fasteners to ensure they are tight.
- Lubricate moving parts as needed with a light machine oil to ensure smooth operation.
- Store the machine in a clean, dry environment when not in use.
9. Troubleshooting
| Problem | Possible Cause | Solution |
|---|---|---|
| Incomplete Solder Paste Deposit | Insufficient squeegee pressure; clogged stencil apertures; incorrect snap-off distance. | Increase squeegee pressure; clean stencil thoroughly; adjust height for optimal snap-off. |
| Solder Paste Bridging | Excessive solder paste; too much squeegee pressure; stencil not clean; incorrect snap-off distance. | Reduce paste amount; reduce squeegee pressure; clean stencil; adjust height. |
| Misalignment of Print | PCB or stencil not properly secured; X/Y axis knobs loose. | Re-secure PCB and stencil; tighten X/Y axis knobs and re-align. |
| Uneven Paste Thickness | Uneven squeegee pressure; warped stencil; uneven working platform. | Apply consistent squeegee pressure; replace warped stencil; ensure machine is level. |
10. Warranty and Support
For warranty information and technical support, please refer to the documentation provided at the time of purchase or contact your vendor directly. Keep your purchase receipt as proof of purchase.