EBYTE E22P Series LoRa Module SX1262 User Manual

1. Introduction

The EBYTE E22P Series LoRa Modules are high-performance wireless communication modules based on the SEMTECH SX1262 RF transceiver chip. These modules are designed for long-distance transmission with low power consumption, offering enhanced efficiency, faster speeds, and a compact size. They feature built-in PA (Power Amplifier), LNA (Low Noise Amplifier), SWA (Switching Amplifier), and ESD protection, making them suitable for various industrial and IoT applications requiring stable and anti-interference communication.

2. Key Features

Chipset: SEMTECH SX1262 RF transceiver module.
Frequency Bands: Available in 868MHz (E22P-868M30S) and 915MHz (E22P-915M30S) variants.
High Performance: Utilizes new SX1262/SX1268 chips for full performance upgrade, offering higher efficiency, longer distance, faster speed, and smaller size.
Long Communication Distance: Capable of up to 12km transmission distance under clear and open conditions with optimal antenna configuration.
Stable and Anti-interference: Built-in RF front-end module, power amplifier, low noise amplifier, surface acoustic wave filter, and ceramic filter improve out-of-band spurious suppression and anti-interference capabilities.
High Precision Oscillator: Adopts a 32MHz high-precision active temperature-compensated crystal oscillator (TCXO) to ensure accurate and stable frequency across a wide temperature range (-40°C to +85°C).
Power Output: Up to 30dBm (approximately 1W) transmit power.
Interface: SPI (Serial Peripheral Interface).
ESD Protection: Integrated ESD protection design.
Compact Size: Dimensions of 38.5mm x 24mm, suitable for applications with high volume requirements.
Antenna Options: Supports IPEX and Stamp Holes for flexible antenna integration.

EBYTE E22P LoRa Module performance upgrade with SX1262 chip — Figure 1: Full performance upgrade with SX1262/SX1268 chips, highlighting benefits like low power consumption, long distance, higher efficiency, faster speed, and smaller size.

EBYTE E22P LoRa Module long-distance transmission and anti-interference — Figure 2: Long-distance transmission communication is stable and has strong anti-interference ability due to built-in RF front-end module, power amplifier, LNA, SAW filter, and ceramic filter.

EBYTE E22P LoRa Module 12km communication distance — Figure 3: Measured communication distance of 12km under clear and open conditions, with maximum power and 2.5 kbps air speed, using a 5 dBi suction cup antenna 2 meters high.

EBYTE E22P LoRa Module active temperature compensated crystal oscillator — Figure 4: Comparison showing the benefits of an active temperature compensated crystal oscillator for stable and accurate frequency, especially across temperature variations.

3. Product Variants

The E22P series offers modules optimized for different frequency bands:

E22P-868M30S: Operates in the 868MHz frequency band.
E22P-915M30S: Operates in the 915MHz frequency band.

Both variants share the same core features and dimensions, differing primarily in their operating frequency to comply with regional regulations and application requirements.

EBYTE E22P-868M30S and E22P-915M30S LoRa Module dimensions — Figure 5: Dimensions of the E22P-868M30S and E22P-915M30S modules, both measuring 38.5mm x 24mm.

EBYTE E22P-915M30S and E22P-868M30S LoRa Modules with SX1262 chip — Figure 6: E22P-915M30S and E22P-868M30S LoRa modules, highlighting the SEMTECH SX1262 RF transceiver module.

4. Specifications

4.1. General Parameters

Main Parameters	E22P-868M30S	E22P-915M30S
Operating Frequency Band	863.3-873.3 MHz	902-928 MHz
RF Chip	SX1262
Crystal Frequency	32MHz (High-precision active temperature compensated crystal oscillator)
Transmit Power	30dBm (Maximum power, about 1W)
Communication Distance	12000m (Max, with 5dBi antenna, 2m height)
Communication Interface	SPI
Air Rate	0.018-300kbps
Supply Voltage (V)	2.5-5.5V (DC 3.3-5.5V)
Emission Current (mA)	610	640
Receiving Sensitivity (dBm)	-150
Antenna Type	IPEX/Stamp Holes
Product Weight (g)	4.9 ±0.1g
Encapsulation Interface	Patch
Sleep Current	3uA

EBYTE E22P LoRa Module Product Parameters Table — Figure 7: Detailed product parameters for E22P-868M30S and E22P-915M30S modules.

4.2. Pin Definitions

Serial Number	Pin Name	Pin Type	Pin Purpose
1	GND	-	Ground wire, connected to the power reference ground
2	GND	-	Ground wire, connected to the power reference ground
3	GND	-	Ground wire, connected to the power reference ground
4	GND	-	Ground wire, connected to the power reference ground
5	GND	-	Ground wire, connected to the power reference ground
6	EN	Input	RF enable control pin, connected to external MCU IO, high level is valid
7	T/R CTRL	Input/Output	RF transmission and reception control pins, high level for transmission, low level for reception, connected to external microcontroller IO or DIO2
8	DIO2	Input/Output	Configurable general IO port
9	VCC	-	Power supply, range 3.3 ~ 5.5V (it is recommended to add external ceramic filter capacitor)
10	VCC	-	Power supply, range 3.3 ~ 5.5V (it is recommended to add external ceramic filter capacitor)
11	GND	-	Ground wire, connected to the power reference ground
12	GND	-	Ground wire, connected to the power reference ground
13	DIO1	Input/Output	Configurable general IO port
14	BUSY	Output	Used for status indication
15	NRST	Input	Chip reset trigger input pin, low level is valid
16	MISO	Output	SPI data output pin
17	MOSI	Input	SPI data input pin
18	SCK	Input	SPI clock input pin
19	NSS	Input	Module chip select pin, used to start an SPI communication
20	GND	-	Ground wire, connected to the power reference ground
21	ANT	-	Antenna interface, stamp hole (50Ω characteristic impedance)
22	GND	-	Ground wire, connected to the power reference ground

EBYTE E22P LoRa Module Pin Definitions Diagram — Figure 8: Pin definitions and layout for the E22P-868M30S / E22P-915M30S modules.

4.3. RF Output Power Comparison

E22P-868M30S RF output power comparison chart — Figure 9: RF output power comparison curve for E22P-868M30S, showing real output (dBm) versus set power (dBm) across different frequencies (873MHz, 868MHz, 863MHz).

E22P-915M30S RF output power comparison chart — Figure 10: RF output power comparison curve for E22P-915M30S, showing real output (dBm) versus set power (dBm) across different frequencies (928MHz, 915MHz, 902MHz).

5. Setup

5.1. Module Integration

The E22P modules are designed for surface-mount (SMD) integration. Ensure proper soldering techniques are used to avoid damage. Connect the module to your microcontroller (MCU) using the SPI interface and relevant control pins as defined in Section 4.2.

Recommended circuit diagram for E22P LoRa Module to MCU connection — Figure 11: Recommended circuit diagram illustrating the connection between the E22P-xxxMxxS module and a microcontroller (MCU) via SPI and control pins.

5.2. Antenna Connection

The module supports both IPEX and stamp hole antenna interfaces. Choose an appropriate 50Ω antenna for your application and frequency band (868MHz or 915MHz). For optimal performance, ensure the antenna is positioned correctly and has a clear line of sight.

EBYTE E22P LoRa Module dual antenna option and high-quality components — Figure 12: The module offers dual antenna options for flexibility and uses high-quality components like Wurth wirewound inductors for better filtering.

5.3. Power Supply

Provide a stable DC power supply within the range of 2.5V to 5.5V. It is highly recommended to add external ceramic filter capacitors to the VCC pins to ensure stable power delivery and minimize noise.

5.4. Offline Test Evaluation Kit (Optional)

For quick evaluation and testing, an Offline Test Evaluation Kit is available. This kit includes a pre-welded E22P module, glue stick antennas (868M/915M), 2*10PIN headers, and a Type-C adapter cable. It is recommended to order two pieces of the kit for easy sending and receiving tests.

EBYTE E22P LoRa Module Offline Test Evaluation Kit — Figure 13: The Offline Test Evaluation Kit features an OLED display, LED indicator, control buttons (OK, UP, DOWN, Back), and a Type-C interface for quick testing.

EBYTE E22P LoRa Module Offline Test Evaluation Kit Checklist — Figure 14: Checklist for the Offline Test Evaluation Kit, including the E22P Offline Test Board (with soldered module), glue stick antennas, 2*10PIN headers, and a Type-C adapter cable.

6. Operating Instructions

6.1. Basic Operation with Test Kit

If using the Offline Test Evaluation Kit:

Connect the Type-C adapter cable to the kit and a power source (e.g., power bank or computer).
The OLED display will show the current mode (e.g., Home, Setting, Tx Mode, Rx Mode, Version).
Use the 'OK', 'UP', and 'DOWN' buttons to navigate menus and configure parameters. The 'Back' button (Buzzer) can be used to return to previous menus.
The LED indicator provides visual feedback on module status.
For data transmission tests, configure one kit as a transmitter and another as a receiver.

6.2. Data Transfer Example

When performing data transfer tests with two evaluation kits:

Configure the number of times to send data on the transmitting module.
The receiving module can display real-time data such as channel, rate, power, total transmissions (Tx Total), current receptions (Current), lost packets (Lost), and packet loss rate (Lost Pkt %).

EBYTE E22P LoRa Module data transfer example with transmitter and receiver — Figure 15: Data transfer example showing two E22P test kits configured as a transmitter and receiver, displaying real-time communication parameters on their OLED screens.

6.3. Software Development

The Offline Test Evaluation Kit includes an onboard master control STM32E103C8T6, which supports secondary development. Users can develop custom firmware to control the LoRa module and integrate it into their specific applications.

7. Maintenance

ESD Protection: Always handle the module with proper electrostatic discharge (ESD) precautions to prevent damage to sensitive components.
Cleanliness: Keep the module clean and free from dust, moisture, and corrosive substances.
Temperature: Operate the module within its specified temperature range (-40°C to +85°C). Avoid extreme temperatures that can affect performance and longevity.
Physical Damage: Avoid physical stress or impact to the module. Ensure proper mounting to prevent vibrations or accidental disconnections.

8. Troubleshooting

No Communication:
- Check all power connections (VCC, GND) and ensure they are stable and within the specified voltage range.
- Verify SPI connections (MISO, MOSI, SCK, NSS) are correct and securely attached.
- Ensure the EN pin is high for RF operation.
- Check the T/R CTRL pin for correct transmission/reception mode.
- Confirm antenna is properly connected and matched to the module's frequency.
Poor Range/Signal:
- Ensure antennas are correctly installed and have a clear line of sight.
- Check for environmental interference (e.g., other wireless devices, metal obstructions).
- Verify transmit power settings are at the desired level.
- Ensure both modules are operating on the same frequency and with compatible LoRa parameters (e.g., spreading factor, bandwidth).
Module Not Responding:
- Check the NRST pin. A low level on this pin will reset the chip.
- Verify the power supply is stable and sufficient.
Software Issues:
- Double-check your SPI communication code and register configurations.
- Refer to the SX1262 datasheet and EBYTE's documentation for detailed register maps and programming guides.

9. User Tips

Antenna Selection: For maximum range, use a high-gain antenna (e.g., 5dBi) and position it as high as possible with minimal obstructions.
Power Filtering: Always include ceramic filter capacitors on the VCC lines close to the module to ensure clean power and prevent noise from affecting RF performance.
ESD Precautions: When handling the module, especially during installation or antenna connection, use an anti-static wrist strap and work on an ESD-safe surface.
Testing: When setting up a new communication link, start with short distances and gradually increase the range while monitoring signal quality.
Firmware Development: Leverage the STM32E103C8T6 on the evaluation kit for custom firmware development to tailor the module's behavior to your specific application needs.

10. Warranty and Support

For detailed warranty information, technical support, and additional resources, please refer to the official EBYTE website or contact their customer service. Firmware updates and further documentation may also be available on the manufacturer's product page.

Download files: https://www.cdebyte.com/product_serch/E22P/1/

Video 1: Product overview of the EBYTE E22P LoRa Module, showcasing its physical appearance and key features.

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