Boardcon Embedded Design MINI507 Reference Embedded Module User Manual

Boardcon Embedded Design MINI507 Reference Embedded Module

Overview

The MINI507 system-on-module is equipped with Allwinner’s T507 quad-core Cortex-A53 CPU and G31 MP2 GPU. It is designed for smart and embedded applications such as industrial controllers, IoT devices, digital clusters, and automotive devices, and the T507 is AEC-Q100 qualified.

Introduction

1. About this Manual
   This manual is intended to provide the user with an overview of the board and benefits, complete features specifications, and set up procedures. It contains important safety information as well.
2. Feedback and Update to this Manual
   To help our customers make the most of our products, we are continually making additional and updated resources available on the Boardcon website (www.boardcon.com, www.armdesigner.com).
   These include manuals, application notes, programming examples, and updated software and hardware. Check in periodically to see what’s new!
   When we are prioritizing work on these updated resources, feedback from customers is the number one influence, If you have questions, comments, or concerns about your product or project, please no hesitate to contact us at support@armdesigner.com.
3. Limited Warranty
   Boardcon warrants this product to be free of defects in material and workmanship for a period of one year from date of buy. During this warranty period Boardcon will repair or replace the defective unit in accordance with the following process:
   A copy of the original invoice must be included when returning the defective unit to Boardcon. This limited warranty does not cover damages resulting from lighting or other power surges, misuse, abuse, abnormal conditions of operation, or attempts to alter or modify the function of the product.
   This warranty is limited to the repair or replacement of the defective unit. In no event shall Boardcon be liable or responsible for any loss or damages, including but not limited to any lost profits, incidental or consequential damages, loss of business, or anticipatory profits arising from the use or inability to use this product.
   Repairs make after the expiration of the warranty period are subject to a repair charge and the cost of return shipping. Please contact Boardcon to arrange for any repair service and to obtain repair charge information.

MINI507 Introduction

1. Summary
   The MINI507 system-on-module is equipped with Allwinner’s T507, which features a quad-core Cortex-A53 CPU and a G31 MP2 GPU. It is designed specifically for smart devices such as industrial controllers, IoT devices, digital clusters, and automotive devices. The high-performance, low-power solution can help customers introduce new technologies more quickly and improve overall solution efficiency.
   In particular, the T507 is AEC-Q100 qualified.
2. Features
   • Microprocessor
     • Quad-core Cortex-A53 up to 1.5G
     • 32KB I-cache, 32KB D-cache, 512KB L2 cache
   • Memory Organization
     • DDR4 RAM up to 4GB
     • EMMC up to 64GB
   • Boot ROM
     • Supports system code download through USB OTG
   • Security ID
     • Size up to 2Kbit for security chip ID
   • Video Decoder/Encoder
     • Supports video decoding up to 4K@30fps
     • Supports H.264 encode
     • H.264 HP encoding up to 4K@25fps
     • Picture size up t0 4096×4096
   • Display Subsystem
     • Video Output
       • Supports HDMI 2.0 transmitter with HDCP 1.4, up to 4K@30fps (T507H option)
       • Supports Serial RGB interface up to 800×640@60fps
       • Supports LVDS interface Dual link up to 1920×1080@60fps and Single link up to 1366×768@60fps Supports RGB interface up to 1920×1080@60fps
       • Supports BT656 interface up to 1920×1080@30fps
       • Supports 1ch TV output with plug detecting
     • Image in
       • Supports MIPI CSI input up to 8M@30fps or 4x1080P@25fps
       • Supports parallel interfaces up to 1080P@30fps
       • Supports BT656/BT1120
   • Analog audio
     • One stereo headphone output
   • I2S/PCM/ AC97
     • Three I2S/PCM interface
     • Support up to 8-CH DMIC
     • One SPDIF input and output
   • USB
     • Four USB 2.0 interfaces
     • One USB 2.0 OTG, and three USB hosts
   • Ethernet
     • Support two Ethernet interface
     • One 10/100M PHY on CPU Board
     • One GMAC/EMAC interface
   • I2C
     • Up to five I2Cs
     • Support standard mode and fast mode(up to 400kbit/s)
     • Smart Card Reader
     • Support ISO/IEC 7816-3 and EMV2000(4.0) specifications
     • Support synchronous and any other non-ISO 7816 and non-EMVcards
   • SPI
     • Two SPI controllers, each SPI controller with two CS signals
     • Full-duplex synchronous serial interface
     • 3 or 4-wire mode
   • UART
     • Up to 6 UART controllers
     • UART0/5 with 2 wires
     • UART1/2/3/4 each with 4 wires
     • UART0 default for debug
     • Compatible with industry-standard 16550 UARTs
     • Support RS485 mode on 4 wires UARTs
   • CIR
     • One CIR controllers
     • Flexible receiver for consumer IR remote control
   • TSC
     • Support multiple transport stream format
     • Support DVB-CSA V1.1/2.1 Descrambler
   • ADC
     • Four ADC input
     • 12-bit resolution
     • Voltage input range between 0V to 1.8V
   • KEYADC
     • One ADC channel for key application
     • 6-bit resolution
     • Voltage input range between 0V to 1.8V
     • Support ingle, normal and continuous mode
   • PWM
     • 6 PWMs (3 PWM pairs) with interrupt-based operation
     • up to 24/100MHz output frequency
     • Minimum resolution is 1/65536
   • Interrupt Controller
     • Support 28 interrupts
   • 3D Graphics Engine
     • ARM G31 MP2 supply
     • Support OpenGL ES 3.2/2.0/1.1, Vulkan1.1, Open CL 2.0 standard
   • Power unit
     • AXP853T on board
     • OVP/UVP/OTP/OCP protections
     • DCDC6 0.5~3.4V@1A output
     • DCDC1 3.3V@300mA output for Carry board GPIO
     • ALDO5 0.5~3.3V@300mA output
     • BLDO5 0.5~3.3V@500mA output
     • Ext-RTC IC on board (option)
     • Very low RTC consume current, less 5uA at 3V button Cell (option)
3. Block Diagram
   1. T507 Block Diagram
   2. Development board (EMT507) Block Diagram

4. MINI507 specifications

   • Feature	Specifications
     CPU	Quad-core Cortex-A53
     DDR	2GB DDR4 (up to 4GB)
     eMMC FLASH	8GB (up to 64GB)
     Power	DC 5V
     LVDS	Dual CH up to 4-Lane
     I2S	3-CH
     MIPI_CSI	1-CH
     TSC	1-CH
     HDMI out	1-CH(option)
     Camera	1-CH(DVP)
     USB	3-CH (USB HOST2.0), 1-CH(OTG 2.0)
     Ethernet	1000M GMAC And 100M PHY
     SDMMC	2-CH
     SPDIF RX/TX	1-CH

   • I2C	5-CH
     SPI	2-CH
     UART	5-CH, 1-CH(DEBUG)
     PWM	6-CH
     ADC IN	4-CH
     Board Dimension	51 x 65 mm

5. MINI507 PCB Dimension
6. MINI507 Pin Definition

Development Kit (EMT507)

Hardware Design Guide

1. Peripheral Circuit Reference
   1. External Power
   2. Debug Circuit
   3. USB OTG Interface Circuit
   4. HDMI Interface Circuit
2. Power Tree
3. B2B connector for carrier board

Product Electrical Characteristics

Dissipation and Temperature

Reliability of Test